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    LED HEAT SINK AND MANUFACTURING METHOD THEREOF
    11.
    发明申请
    LED HEAT SINK AND MANUFACTURING METHOD THEREOF 审中-公开
    LED散热及其制造方法

    公开(公告)号：US20140090795A1

    公开(公告)日：2014-04-03

    申请号：US14090710

    申请日：2013-11-26

    Applicant: Asia Vital Components Co., Ltd.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: F21V29/00

    CPC classification number: F21V29/77 ,  F21K9/00 ,  F21V29/76 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  Y10T29/49393

    Abstract: An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.

    Abstract translation: 公开了一种LED散热器及其制造方法。 LED散热器包括具有热接收部分和延伸传热部分的主体。 传热部分外部设置有多个接收槽，用于与多个散热片相对应地连接。 LED散热器制造方法包括使用半熔融金属材料成型主体并冷却主体的步骤，使得冷却的主体与多个散热片连接以形成一体的单元。 利用LED散热器制造方法，可以制造具有相对复杂的散热片结构或由两种或更多种材料形成的LED散热器，并且大大减少LED热时间，人力和材料成本 水槽。

    Thermal module assembling structure
    12.
    发明授权
    Thermal module assembling structure 有权

    公开(公告)号：US10859320B2

    公开(公告)日：2020-12-08

    申请号：US16199213

    申请日：2018-11-25

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: F28D15/02 ,  F28F3/12

    Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

    THERMAL MODULE ASSEMBLING STRUCTURE
    13.
    发明申请
    THERMAL MODULE ASSEMBLING STRUCTURE 审中-公开

    公开(公告)号：US20170254599A1

    公开(公告)日：2017-09-07

    申请号：US15060607

    申请日：2016-03-04

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: F28D15/02

    CPC classification number: F28D15/0275 ,  F28D15/0233

    Abstract: A thermal module assembling structure includes a base seat and a heat pipe. The base seat is formed with a channel and at least one hole recessed and formed on one side of the base seat in adjacency to the channel. The channel has at least one protrusion section corresponding to the hole. One end of the heat pipe is received in the channel. The heat pipe has at least one insertion recess. The protrusion section is tightly fitted and inserted in the corresponding insertion recess of the heat pipe.

    Mold for molding a case of a mobile device
    15.
    发明授权
    Mold for molding a case of a mobile device 有权
    用于模制移动设备的模具的模具

    公开(公告)号：US09566629B2

    公开(公告)日：2017-02-14

    申请号：US14718219

    申请日：2015-05-21

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Kuo-Sheng Lin ,  Fei-Fei Shi

    IPC: B21D22/02 ,  B21D37/10 ,  B21D37/14 ,  B21J13/02

    CPC classification number: B21D22/02 ,  B21D22/06 ,  B21D37/10 ,  B21D37/14 ,  B21J13/02 ,  B21K1/26 ,  B22C9/06 ,  B22C9/22

    Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.

    Abstract translation: 用于模制移动装置的壳体的模具包括第一，第二，第三，第四和第五主体，连接滑块，以及第一和第二抵靠滑动块。 连接滑动块和第二抵接滑动块被嵌入第一和第二主体的第一和第二滑动通道中。 第一基台滑动块镶嵌在连接滑块的通道中。 第三，第四和第五主体相对于第一主体和第二主体水平移动。 第一和第二主体，连接滑动块和第一和第二抵接滑动块一起限定了阳模部分，并且第三，第四和第五主体共同限定了阴模部分。 将金属薄片放置在阳模部分上并由阴模部分加压和模制以形成外壳。

    THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE
    16.
    发明申请
    THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE 有权
    具有增强组装结构的热模块

    公开(公告)号：US20150260462A1

    公开(公告)日：2015-09-17

    申请号：US14205275

    申请日：2014-03-11

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: F28D15/02

    CPC classification number: F28D15/0275 ,  F28D15/0233

    Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.

    Abstract translation: 具有增强的组装结构的热模块包括基座和热管。 基部形成在具有纵向容纳凹部的中间部分上，其具有形成两个支撑部分的两个端部和形成开口的中间部分。 第一和第二延伸臂形成在接收凹槽和开口的两个纵向侧之间的接合处。 与开口的纵向侧面相邻的第一和第二延伸臂的壁表面形成有交替的升高和下沉的区域。 热管通过第一和第二延伸臂压住接收凹槽，以与升高的和凹陷的区域适配地接合。 因此，在热管与基座之间存在增加的配合密封性，以确保增加热模块的组装强度并降低其制造成本。

    METHOD OF MANUFACTURING THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE
    17.
    发明申请
    METHOD OF MANUFACTURING THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE 有权
    具有增强组装结构的热模块制造方法

    公开(公告)号：US20150258643A1

    公开(公告)日：2015-09-17

    申请号：US14205289

    申请日：2014-03-11

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: B23P15/26

    CPC classification number: B23P15/26 ,  B23P2700/10 ,  F28D1/00 ,  F28D15/0233 ,  F28D15/0275 ,  F28F2275/14 ,  H01L23/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.

    Abstract translation: 具有增强的组装结构的热模块包括基座和热管。 基部形成在具有纵向容纳凹部的中间部分上，其具有形成两个支撑部分的两个端部和形成开口的中间部分。 第一和第二延伸臂形成在接收凹槽和开口的两个纵向侧之间的接合处。 与开口的纵向侧面相邻的第一和第二延伸臂的壁表面形成有交替的升高和下沉的区域。 热管通过第一和第二延伸臂压住接收凹槽，以与升高的和凹陷的区域适配地接合。 因此，在热管与基座之间存在增加的配合密封性，以确保增加热模块的组装强度并降低其制造成本。

    HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF
    18.
    发明申请
    HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    热沉结构及其制造方法

    公开(公告)号：US20150209917A1

    公开(公告)日：2015-07-30

    申请号：US14677094

    申请日：2015-04-02

    Applicant: Asia Vital Components Co., Ltd.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: B23P19/027 ,  B23P15/26

    CPC classification number: F28F1/16 ,  B21K25/00 ,  B23P15/26 ,  B23P19/027 ,  B23P2700/10 ,  F21V29/773 ,  F28D21/00 ,  F28D2021/0029 ,  F28F1/24 ,  F28F2275/10 ,  H01L21/4882 ,  H01L23/3672 ,  Y10T29/49378 ,  Y10T29/49945

    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.

    Abstract translation: 散热器结构及其制造方法。 散热器包括具有多个主体连接部分的主体和各自具有连接部分的多个散热片。 主体具有第一端和第二端。 第一和第二端限定纵向方向。 多个散热片放置在模具中。 使用机械加工措施来高速冲击主体以将主体推入模具中。 因此，放置在模具中的散热片的连接部分被高速推入主体连接部分，并且沿长度方向移动到主体的第二端，以与主体紧密地一体地连接。

    THERMAL MODULE ASSEMBLING STRUCTURE
    19.
    发明申请
    THERMAL MODULE ASSEMBLING STRUCTURE 审中-公开

    公开(公告)号：US20190162479A1

    公开(公告)日：2019-05-30

    申请号：US16199213

    申请日：2018-11-25

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Sheng-Huang Lin ,  Kuo-Sheng Lin

    IPC: F28D15/02

    Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

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