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公开(公告)号:US20230383402A1
公开(公告)日:2023-11-30
申请号:US18233065
申请日:2023-08-11
Applicant: ASM IP Holding B.V.
Inventor: Eric James Shero , Carl Louis White , Mohith E. Verghese , Kyle Fondurulia , Timothy James Sullivan
IPC: C23C16/448 , H01L21/67
CPC classification number: C23C16/4485 , H01L21/67115 , H01L21/67103 , H01L21/67098
Abstract: Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.
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公开(公告)号:US11624113B2
公开(公告)日:2023-04-11
申请号:US17011828
申请日:2020-09-03
Applicant: ASM IP HOLDING B.V.
Inventor: Carl Louis White , Eric James Shero , Kyle Fondurulia
IPC: C23C16/448 , C23C16/455 , C23C16/48 , C23C16/44 , C23C16/52
Abstract: Systems and methods related to temperature zone control systems can include a reactant source cabinet that is configured to be at least partially evacuated, a vessel base that is configured to hold solid source chemical reactant therein, and a lid that is coupled to a distal portion of the vessel base. The lid may include one or more lid valves. The system may further include a plurality of gas panel valves that are configured to deliver gas from a gas source to the vessel. The system may include a heating element that is configured to heat the one or more lid valves. The system may include a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base. A second portion of the heat shield may be disposed between the first heating element and the plurality of gas panel valves.
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公开(公告)号:US20210207269A1
公开(公告)日:2021-07-08
申请号:US17136659
申请日:2020-12-29
Applicant: ASM IP Holding B.V.
Inventor: Jianqiu Huang , Gejian Zhao , Kyle Fondurulia
IPC: C23C16/455 , F16K7/14
Abstract: Gas supply assemblies and reactors systems including the gas supply assemblies are disclosed. An exemplary gas supply assembly includes a vessel, a valve plate, a housing encasing the vessel and the valve plate, a gas feedthrough having a first end interior of the housing and a second end exterior of the housing, and one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to an interior of the vessel. The assemblies can further include a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. Additionally or alternatively, a gas supply assembly can include one or more valve plate leveling devices coupled to the valve plate.
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公开(公告)号:US20210104427A1
公开(公告)日:2021-04-08
申请号:US17126750
申请日:2020-12-18
Applicant: ASM IP HOLDING B.V.
Inventor: Carl Louis White , Kyle Fondurulia , John Kevin Shugrue , David Marquardt
IPC: H01L21/687 , C23C16/458 , C23C16/455 , C23C16/44 , H01L21/67
Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.
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公开(公告)号:US20210040613A1
公开(公告)日:2021-02-11
申请号:US16983364
申请日:2020-08-03
Applicant: ASM IP Holding B.V.
Inventor: Carl Louis White , Eric James Shero , Kyle Fondurulia , Timothy James Sullivan
IPC: C23C16/455 , C23C16/52
Abstract: A cooling apparatus and methods for maintaining a precursor source vessel heater at a desired temperature are disclosed. The apparatus and methods can be used to maintain a desired temperature gradient within the precursor source vessel for improved integrity of the precursor source before delivery of the precursor to a reaction chamber. The apparatus and methods can also be used for rapid cooling of a source vessel for maintenance.
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公开(公告)号:US10714315B2
公开(公告)日:2020-07-14
申请号:US13651144
申请日:2012-10-12
Applicant: ASM IP Holding B.V.
Inventor: Carl White , Todd Dunn , Eric Shero , Kyle Fondurulia
IPC: H01J37/32 , C23C16/455
Abstract: A showerhead including a body having an opening, a first plate positioned within the opening and having a plurality of slots, a second plate positioned within the opening and having a plurality of slots, and wherein each of the first plate plurality of slots are concentrically aligned with the second plate plurality of slots.
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17.
公开(公告)号:US20190139808A1
公开(公告)日:2019-05-09
申请号:US16031613
申请日:2018-07-10
Applicant: ASM IP HOLDING B.V.
Inventor: Carl Louis White , Kyle Fondurulia , John Kevin Shugrue , David Marquardt
IPC: H01L21/687 , C23C16/458 , C23C16/455 , C23C16/44
Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.
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公开(公告)号:US12163225B2
公开(公告)日:2024-12-10
申请号:US16944241
申请日:2020-07-31
Applicant: ASM IP Holding B.V.
Inventor: Carl Louis White , Kyle Fondurulia , Timothy James Sullivan
IPC: C23C16/455 , C23C16/448 , C23C16/52 , C30B25/16 , H01L21/67
Abstract: A temperature control system for a chemical delivery system (e.g., comprised in a reactor system) may comprise a temperature control shell coupled to and/or enclosing at least a portion of at least one component of the chemical delivery system. A chemical delivery system may comprise a filter, an accumulator, and/or a chemical application line fluidly coupled to one another in any suitable arrangement and/or configuration. A temperature control system for such a chemical delivery system may comprise a filter temperature control shell coupled to and/or enclosing at least a portion of the filter, an accumulator temperature control shell coupled to and/or enclosing at least a portion of the accumulator, and/or an application line temperature control shell coupled to and/or enclosing at least a portion of the chemical application line.
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公开(公告)号:US11976359B2
公开(公告)日:2024-05-07
申请号:US17136659
申请日:2020-12-29
Applicant: ASM IP Holding B.V.
Inventor: Jianqiu Huang , Gejian Zhao , Kyle Fondurulia
IPC: C23C16/455 , F15B13/08 , F16K7/14 , F16K27/00 , F17C13/04
CPC classification number: C23C16/45561 , F15B13/0817 , F16K7/14 , F16K27/003 , F17C13/04
Abstract: Gas supply assemblies and reactors systems including the gas supply assemblies are disclosed. An exemplary gas supply assembly includes a vessel, a valve plate, a housing encasing the vessel and the valve plate, a gas feedthrough having a first end interior of the housing and a second end exterior of the housing, and one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to an interior of the vessel. The assemblies can further include a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. Additionally or alternatively, a gas supply assembly can include one or more valve plate leveling devices coupled to the valve plate.
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公开(公告)号:US20230313370A1
公开(公告)日:2023-10-05
申请号:US18332627
申请日:2023-06-09
Applicant: ASM IP HOLDING B.V.
Inventor: Eric James Shero , Carl Louis White , Mohith E. Verghese , Kyle Fondurulia , Timothy James Sullivan
IPC: C23C16/448 , H01L21/67
CPC classification number: C23C16/4485 , H01L21/67098 , H01L21/67103 , H01L21/67115
Abstract: Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.
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