公开(公告)号：US11664199B2

公开(公告)日：2023-05-30

申请号：US16655217

申请日：2019-10-16

Applicant: ASM IP Holding B.V.

Inventor： JaeMin Roh ,  DaeYoun Kim ,  JulIl Lee ,  ChangMin Lee

IPC: C23C16/458 ,  H01J37/32 ,  H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  H01L21/68 ,  C23C16/505 ,  C23C16/455

CPC classification number: H01J37/32715 ,  C23C16/4585 ,  H01J37/32642 ,  H01L21/02274 ,  H01L21/6719 ,  H01L21/68 ,  H01L21/68764 ,  C23C16/45536 ,  C23C16/505 ,  H01J2237/20285 ,  H01J2237/3321 ,  H01J2237/3323

Abstract: A substrate processing method capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes: a first operation of moving the substrate supporting apparatus in a first direction by a first predetermined distance; a second operation of moving the substrate supporting apparatus in a second direction by a second predetermined distance; a third operation of moving the substrate supporting apparatus in the second direction by the first predetermined distance; and a fourth operation of moving the substrate supporting apparatus in the first direction by the second predetermined distance, wherein the second direction may be opposite to the first direction.

公开(公告)号：US20220415694A1

公开(公告)日：2022-12-29

申请号：US17848824

申请日：2022-06-24

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  ChangMin Lee

IPC: H01L21/683 ,  H01L21/67

Abstract: Electrostatic chucks and methods of using electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a heating element embedded within the ceramic body, and two or more temperature measurement devices embedded within the ceramic body. Exemplary methods include measuring temperatures within the electrostatic chuck using two or more vertically spaced-apart temperature measurement devices.