公开(公告)号：US07298234B2

公开(公告)日：2007-11-20

申请号：US10904731

申请日：2004-11-24

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01P3/08

CPC classification number: H01P3/003 ,  H01L2223/6627 ,  H01L2924/19032 ,  H01P1/2005 ,  H01P3/081 ,  H01P3/084 ,  H01P3/085 ,  H01P3/087 ,  H01P3/088

Abstract: High-speed interconnect systems for connecting two or more electrical elements are provided. Interconnect system has the means, which could reduce the microwave loss induced due to the dielectrics. Reducing the effective loss tangent of the dielectrics reduces the microwave loss. With optimize design of the interconnects, the speed of the electrical signal can be made to closer to the speed of the light. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems and the ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. Alternatively dielectric structure can have the structure based on the fully electronic or electromagnetic crystal or quasi crystal with the line defect. Alternatively, dielectric structure can be made to comb-shaped structure with teethes having thickness and space making the air pocket to reduce the microwave loss. The interconnect system, can be made in rigid or flex board for off-chip interconnects for IC packages, connectors and cables, where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

Abstract translation: 提供了用于连接两个或多个电气元件的高速互连系统。 互连系统具有减少由于电介质导致的微波损耗的手段。 降低电介质的有效损耗角正切可减少微波损耗。 通过互连的优化设计，可以使电信号的速度更接近于光的速度。 互连系统由电信号线，不均匀电介质系统和接地线组成，其中由介电衬底或梳状电介质构成的开放沟槽的非均匀介质系统以减少微波损耗。 或者介电结构可以具有基于完全电子或电磁晶体或具有线缺陷的准晶体的结构。 或者，电介质结构可以制成具有厚度和空间的牙齿的梳状结构，从而减小微波损耗。 互连系统可以用于用于IC封装，连接器和电缆的芯片外互连的刚性或柔性板，其中可以使用常规的制造技术，并且还可以增加互连的带宽。

公开(公告)号：US5861636A

公开(公告)日：1999-01-19

申请号：US629470

申请日：1996-04-11

Applicant: Achyut Kumar Dutta ,  Akira Suzuki

Inventor： Achyut Kumar Dutta ,  Akira Suzuki

IPC: H01L33/10 ,  H01L33/14 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

CPC classification number: H01L33/44 ,  H01L33/14 ,  H01L33/38 ,  H01L33/10 ,  H01L33/387 ,  H01L33/46

Abstract: Disclosed is a surface emitting visible light emitting diode, which has: a first conductivity-type substrate; and a first conductivity-type buffer layer, a first conductivity-type cladding layer, an active layer, a second conductivity-type cladding layer, a second conductivity-type current spreading layer and a second conductivity-type cap layer which are in turn grown on the substrate; wherein the second conductivity-type cap layer has a ring shaped electrode formed thereon.

Abstract translation: 公开了一种表面发射可见光发光二极管，其具有：第一导电型基板; 第一导电型包覆层，有源层，第二导电型包覆层，第二导电型电流扩散层和第二导电型覆盖层，第二导电型覆盖层，第二导电型覆盖层，第二导电型覆盖层， 在基材上 其中所述第二导电型盖层具有形成在其上的环形电极。

公开(公告)号：US12219120B1

公开(公告)日：2025-02-04

申请号：US17861203

申请日：2022-07-09

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H04N13/254 ,  H04N13/204 ,  H04N13/271 ,  B25J9/16 ,  G05D1/00

Abstract: This invention relates to a sensor and sensor platform, for an autonomous system. The sensor and its platform sense, perform signal or data processing, and make the decision locally at the point of sensing. More specifically, the sensor along with its platform simulates the human-like or human capacity to make decisions by combing the data from several sensors that detect different data sets, and combine them in a series of data processes that allows autonomous decisions to be made. Additionally, the sensor platform combines multiple sensors in one metasensor with the functionality of multiple sensors placed on a common carrier or platform.

公开(公告)号：US09991407B1

公开(公告)日：2018-06-05

申请号：US12821125

申请日：2010-06-22

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L31/072 ,  H01L31/0236 ,  H01L31/0352

CPC classification number: H01L31/072 ,  H01L31/0236 ,  H01L31/0352

Abstract: A novel method to fabricate the high-efficiency solar cells are provided by this application. The cells are based on micro (or nano) structures that not only increase the surface area but also have the capability of self-concentrating the solar spectrum incident onto the cell. These photovoltaic cells have a larger power generation capability per unit physical area than conventional cells. These cells will have enormous applications in space, commercial, residential and industrial sectors.

公开(公告)号：US08643187B1

公开(公告)日：2014-02-04

申请号：US13151242

申请日：2011-06-01

Applicant: Achyut Kumar Dutta ,  Robert Olah

Inventor： Achyut Kumar Dutta ,  Robert Olah

IPC: H01L29/40 ,  H01L21/4763

CPC classification number: H01L23/5226 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnection system is provided with reduced capacitance between a signal via and the surrounding dielectric material. By using a non-homogenous dielectric, the effective dielectric constant of the system is reduced. The signal vias are surrounded with some combination of open trenches and/or grounded vias to decrease the effective dielectric constant of the surrounding system, providing shielding from the interference of nearby signal lines and vias. The fabrication techniques provided are advantageous because they can be preformed using today's standard IC fabrication techniques.

Abstract translation: 互连系统在信号通孔和周围的电介质材料之间具有减小的电容。 通过使用不均匀的电介质，系统的有效介电常数降低。 信号通道被开放沟槽和/或接地通孔的某些组合包围，以降低周围系统的有效介电常数，提供对附近信号线和通孔的干扰的屏蔽。 所提供的制造技术是有利的，因为它们可以使用当今的标准IC制造技术进行。

公开(公告)号：US08304759B2

公开(公告)日：2012-11-06

申请号：US12821114

申请日：2010-06-22

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L29/06 ,  H01L31/072 ,  H01L31/109 ,  H01L31/0328 ,  H01L31/0336

CPC classification number: H01L27/14603 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/02554 ,  H01L21/02603 ,  H01L25/042 ,  H01L27/14607 ,  H01L31/0352 ,  H01L31/035281 ,  H01L31/068 ,  H01L31/075 ,  H01L2924/0002 ,  Y02E10/547 ,  Y02E10/548 ,  H01L2924/00

Abstract: It is highly desirable to design a monolithic image sensor (and array), which could offer high quantum efficiency over broad spectral ranges, and the possibility to rapidly and randomly address any element in the array. This invention utilizes the growth of semiconductor nanowires such as Si, Ge, Si:Ge, ZnO, or their alloys based nanowires on standard substrates to create multispectral image sensors and photovoltaic cells having these highly desirable features.

Abstract translation: 非常希望设计一个单片图像传感器（和阵列），可以在宽光谱范围内提供高量子效率，以及快速随机地对阵列中任何元素进行寻址的可能性。 本发明利用半导体纳米线如Si，Ge，Si：Ge，ZnO或其基于合金的纳米线在标准基板上的生长，以产生具有这些非常理想特征的多光谱图像传感器和光伏电池。

公开(公告)号：US07851816B2

公开(公告)日：2010-12-14

申请号：US11830865

申请日：2007-07-31

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L29/22 ,  H01L31/0232

CPC classification number: G02B6/12002 ,  G02B6/122 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4257 ,  G02B6/4268 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12147 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.

Abstract translation: 提供了一种光电子芯片到芯片互连系统，包括至少一个要连接在印刷电路板上的封装芯片与至少一个其它封装芯片，光电（OE）转换平均值，波导板和 （PCB）。 可以使用本发明公开的技术将单芯片至多片芯片互连互连。 封装芯片包括基于球栅阵列或芯片级封装的半导体管芯及其封装。 O-E板包括O-E基板两侧的光电子元件和多个电触点。 波导板包括将信号从O-E板传输到PCB的电导体，并且柔性光波导容易地堆叠到PCB上以引导来自一个芯片到另一个芯片的光信号。 或者，电极可以直接连接到PCB，而不是包括在波导板中。 芯片到芯片互连系统是无引脚的，与PCB兼容。 本发明的主要优点是使用封装芯片进行互连，并且传统的PCB技术可用于低速电信号连接。 此外，来自封装芯片的部分热量可以通过导体传输到PCB，从而可以避免复杂的冷却系统。

公开(公告)号：US07719105B2

公开(公告)日：2010-05-18

申请号：US12250510

申请日：2008-10-13

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01Q3/46

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09681 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A high speed electrical interconnection system is provided. The interconnection system comprises one or more electrical signal lines, or differential pairs of signal lines, and an inhomogeneous dielectric system. The dielectric system further comprises a homogeneous dielectric layer interposed between the electrical signal lines, and electrical conducting planes including a periodic array etched in the conducting material of the conducting plane. The inhomogeneous dielectric system exhibits a lower dielectric constant as compared to the dielectric constant of the homogeneous dielectric layer, resulting in lower microwave loss, reduced signal propagation delay, reduced signal skew, and increased signal bandwidth. The interconnection system may be implemented for connecting one or more high speed electron elements on-chip, off-chip, chip-chip connection on multilayer printed circuit boards, high speed die-package, high speed connectors, and high speed electric cables.

Abstract translation: 提供了一种高速电气互连系统。 互连系统包括一个或多个电信号线或信号线的差分对，以及不均匀的电介质系统。 电介质系统还包括介于电信号线之间的均匀介电层，以及包括在导电平面的导电材料中蚀刻的周期性阵列的导电平面。 与均匀介电层的介电常数相比，不均匀的介电系统表现出较低的介电常数，导致较低的微波损耗，降低的信号传播延迟，降低的信号偏移和增加的信号带宽。 互连系统可以实现用于连接多层印刷电路板上的一个或多个高速电子元件，片上芯片，片上芯片连接，高速模封装，高速连接器和高速电缆。

公开(公告)号：US07535033B2

公开(公告)日：2009-05-19

申请号：US11162523

申请日：2005-09-13

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L27/146

CPC classification number: H01L31/109 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14645 ,  H01L2224/4847

Abstract: Novel structures of the photodetector having broad spectral ranges detection capability are provided. The photodetector can offer high quantum efficiency >95% over wide spectral ranges, high frequency response >10 GHz (@3 dB). The photodiode array of N×N elements is also provided. The array can also offer wide spectral detection ranges ultraviolet to 2500 nm with high quantum efficiency >95% and high quantum efficiency of >10 GHz, cross-talk of

Abstract translation: 提供具有宽光谱范围检测能力的光电检测器的新型结构。 光电探测器可以在宽光谱范围内提供高达95％的高量子效率，高频响应> 10 GHz（@ 3dB）。 还提供了NxN元件的光电二极管阵列。 该阵列还可以提供宽光谱检测范围紫外到2500 nm，高量子效率> 95％，高量子效率> 10 GHz，串扰<1％。 在阵列中，每个光电二极管可以独立地寻址，并且可以被制成顶部照明或底部照明型检测器。 本发明中提供的光电二极管及其阵列可以用于诸如电信，成像和感测应用的多种用途，包括监视，卫星跟踪，先进的激光雷达系统等。这种光电检测器的优点是它们是非制冷的，性能将 在宽范围的温度变化下不会退化。

公开(公告)号：US20090066437A1

公开(公告)日：2009-03-12

申请号：US12202418

申请日：2008-09-01

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H03H7/00 ,  H01P3/08

CPC classification number: H01L23/5383 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/09063 ,  Y02P80/30 ,  Y10T29/49016 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract translation: 提供了用于连接高速电子元件的基础互连系统。 互连系统由信号线，具有开放沟槽的介质系统或充满空气或较低介质损耗材料的槽以及接地层组成。 信号线可以是例如微带线，带状线，共面线，单线或差分对。 互连系统可用于片上互连，也可用于片外互连。 本发明提供的基本技术也可用于高速连接器和高速电缆。