公开(公告)号：US20240143445A1

公开(公告)日：2024-05-02

申请号：US17974981

申请日：2022-10-27

Applicant: Advanced Micro Devices, Inc.

Inventor： Alicia Wen Ju Yurie Leong ,  William Robert Alverson ,  Joshua Taylor Knight ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Amitabh Mehra ,  Jayesh Hari Joshi

IPC: G06F11/14 ,  G11C29/52

CPC classification number: G06F11/1417 ,  G11C29/52

Abstract: Stability testing for memory overclocking is described. In accordance with the described techniques, operation of a memory with overclocked memory settings is testing during a boot up process of a computing device. Test results based on the testing are exposed via a user interface. The test results predict a stability of the memory over a subsequent time period if the memory is configured to operate with the overclocked memory settings.

公开(公告)号：US20240053891A1

公开(公告)日：2024-02-15

申请号：US17887245

申请日：2022-08-12

Applicant: Advanced Micro Devices, Inc.

Inventor： William Robert Alverson ,  Amitabh Mehra ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F3/06

CPC classification number: G06F3/061 ,  G06F3/0673 ,  G06F3/0655

Abstract: Random access memory (RAM) is attached to an input/output (I/O) controller of a chipset (e.g., on a motherboard). This chipset attached RAM is optionally used as part of a tiered storage solution with other tiers including, for example, nonvolatile memory (e.g., a solid state drive (SSD)) or a hard disk drive. The chipset attached RAM is separate from the system memory, allowing the chipset attached RAM to be used to speed up access to frequently used data stored in the tiered storage solution without reducing the amount of system memory available to an operating system running on the one or more processing units.

公开(公告)号：US20230315171A1

公开(公告)日：2023-10-05

申请号：US17704912

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K5/0213 ,  H05K5/0239 ,  H05K7/20209

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

公开(公告)号：US20250004514A1

公开(公告)日：2025-01-02

申请号：US18217390

申请日：2023-06-30

Applicant: Advanced Micro Devices, Inc ,  ATI Technologies ULC

Inventor： Amitabh Mehra ,  William Robert Alverson ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Joshua Taylor Knight ,  Anil Harwani ,  Adam Neil Calder Clark

IPC: G06F1/20 ,  G01K13/00

Abstract: Adjustable thermal management is described. Input to adjust one or more parameters for controlling thermal conditions of a component is received. Temperature measurements of a component are obtained from two or more sensors of the component. A temperature of a thermal hotspot of the component is estimated based on the temperature measurements obtained from the two or more sensors of the component and using the adjusted parameters. Operation of the component is adjusted based on the estimated temperature of the thermal hotspot.

公开(公告)号：US20240330134A1

公开(公告)日：2024-10-03

申请号：US18190664

申请日：2023-03-27

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Joshua Taylor Knight ,  Amitabh Mehra ,  Anil Harwani ,  Grant Evan Ley

IPC: G06F11/22 ,  G06F9/4401

CPC classification number: G06F11/2284 ,  G06F9/4401

Abstract: A system that includes at least a system memory, a chipset link, and a chipset attached memory is powered down. A boot-up process is loaded in the chipset attached memory. The boot-up process is performed for the system, via the chipset link, by the chipset attached memory. The boot-up process includes loading one or more memory testing applications. The system memory is tested using the one or more memory testing applications loaded by the chipset attached memory.

公开(公告)号：US20240319712A1

公开(公告)日：2024-09-26

申请号：US18187848

申请日：2023-03-22

Applicant: Advanced Micro Devices, Inc ,  ATI Technologies ULC

Inventor： Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Amitabh Mehra ,  Joshua Taylor Knight ,  William Robert Alverson ,  Adam Neil Calder Clark

IPC: G05B19/4155 ,  G01K7/01

CPC classification number: G05B19/4155 ,  G01K7/01 ,  G05B2219/49216

Abstract: Dynamic range aware conversion of sensor readings is described. A system includes one or more sensors to sense conditions of a component and output sensor readings and a system manager. The system manager is configured to convert the sensor readings into condition measurements by converting the sensor readings into the condition measurements using a first transformation while operating in a first conversion mode or converting the sensor readings into the condition measurements using a second transformation while operating in a second conversion mode. The system manager then adjusts operation of the component based on the condition measurements.

公开(公告)号：US20240220108A1

公开(公告)日：2024-07-04

申请号：US18147963

申请日：2022-12-29

Applicant: Advanced Micro Devices, Inc.

Inventor： Jayesh Hari Joshi ,  Alicia Wen Ju Yurie Leong ,  William Robert Alverson ,  Joshua Taylor Knight ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Amitabh Mehra ,  Anil Harwani

IPC: G06F3/06

CPC classification number: G06F3/061 ,  G06F3/0653 ,  G06F3/0673

Abstract: Automated memory overclocking is described. In accordance with the described techniques, one or more sets of overclocked memory settings of a memory are automatically selected for performance testing and stability testing of the memory. The one or more sets of the overclocked memory settings are tested for performance of the memory and a performance indication is output for each of the one or more sets of the overclocked memory settings. The one or more sets of the overclocked memory settings are tested for stability of the memory and a stability indication is output for each of the one or more sets of the overclocked memory settings. One of the one or more sets of the overclocked memory settings are selected as optimized overclocked memory settings for the memory.

公开(公告)号：US11977757B2

公开(公告)日：2024-05-07

申请号：US17732718

申请日：2022-04-29

Applicant: Advanced Micro Devices, Inc.

Inventor： Grant Evan Ley ,  Jayesh Hari Joshi ,  Amitabh Mehra ,  Jerry Anton Ahrens ,  Joshua Taylor Knight ,  Anil Harwani ,  William Robert Alverson

IPC: G06F3/06

CPC classification number: G06F3/0634 ,  G06F3/0604 ,  G06F3/0613 ,  G06F3/0673

Abstract: Profile switching for memory overclocking is described. In accordance with the described techniques, a memory is operated according to a first memory profile. During operation of the memory according to the first memory profile, a request is received to operate the memory according to a second memory profile. Responsive to the request, operation of the memory is switched to operate according to the second memory profile without rebooting. In one or more implementations, at least one of the first memory profile or the second memory profile comprises an overclocking memory profile that configures the memory to operate in an overclocking mode. In one or more implementations, the memory is trained to operate according to the overclocking memory profile prior to operating the memory according to the first memory profile.

公开(公告)号：US20230324967A1

公开(公告)日：2023-10-12

申请号：US17704862

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package’s internal components and the auxiliary device.

公开(公告)号：US12242325B2

公开(公告)日：2025-03-04

申请号：US17708453

申请日：2022-03-30

Applicant: Advanced Micro Devices, Inc.

Inventor： William Robert Alverson ,  Amitabh Mehra ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/32 ,  G06F1/3206 ,  G06F1/3287 ,  G06F9/445

Abstract: Core activation and deactivation for a multi-core processor is described. In accordance with the described techniques, a processor having multiple cores operates using a first core configuration. A request to switch from the first core configuration to a second core configuration is received. Responsive to the request, a switch from the first core configuration to the second core configuration occurs by adjusting a number of active cores of the processor without rebooting.