公开(公告)号：US20190097387A1

公开(公告)日：2019-03-28

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Shih-Chieh TANG

IPC: H01S5/022 ,  H01S5/02 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01L25/075 ,  H01S5/40 ,  H01L33/48

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US20250167131A1

公开(公告)日：2025-05-22

申请号：US18511996

申请日：2023-11-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei CHAN ,  Shih-Chieh TANG ,  Lu-Ming LAI ,  Tzu Hui CHEN

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

Abstract: An optical package structure is provided. The optical package structure includes a first substrate, a second substrate, a first optical component, a second optical component, and an electrical shielding element. The second substrate is over the first substrate. The first substrate and the second substrate collectively define a first cavity. The first optical component is disposed in the first cavity. The second optical component is disposed over the first substrate. The electrical shielding element is disposed adjacent to a sidewall of the first cavity and between the first optical component and the second optical component.

公开(公告)号：US20250087618A1

公开(公告)日：2025-03-13

申请号：US18244207

申请日：2023-09-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/498

Abstract: A package structure includes a substrate, an electronic device, an underfill, and an underfill guide structure. The electronic device is disposed over the substrate. The underfill is outflanked by the substrate and the electronic device. The underfill guide structure is disposed outside of a vertical projection of the circuit structure and horizontally overlaps a gap between the substrate and the electronic device, and configured to reduce an extension of a portion of the underfill outside of the vertical projection along a lateral surface of the electronic device.

公开(公告)号：US20230194807A1

公开(公告)日：2023-06-22

申请号：US17559943

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG

IPC: G02B6/42 ,  G01P15/093

CPC classification number: G02B6/4246 ,  G01P15/093

Abstract: An electronic module is provided. The electronic module includes a carrier, a movable component and an optical component. The movable component is on the carrier and configured to be movable with respect to the carrier. The optical component is configured to detect a movement of the movable component by an optical coupling between the optical component and the movable component.

公开(公告)号：US20230063405A1

公开(公告)日：2023-03-02

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US20210210662A1

公开(公告)日：2021-07-08

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen CHIANG ,  Kuang-Hsiung CHEN ,  Lu-Ming LAI ,  Hsun-Wei CHAN ,  Hsin-Ying HO ,  Shih-Chieh TANG

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US20190157492A1

公开(公告)日：2019-05-23

申请号：US15821302

申请日：2017-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Lu-Ming LAI ,  Shih-Chieh TANG

IPC: H01L31/173 ,  H01L27/146 ,  H01L27/15 ,  H01L31/0232 ,  H01L31/02 ,  G06K9/00

Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.