公开(公告)号：US10720751B2

公开(公告)日：2020-07-21

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan Tsai ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Shih-Chieh Tang

IPC: G02B6/02 ,  H04B10/50 ,  G02B6/35 ,  G02B6/42 ,  H04B10/80 ,  H01S5/022 ,  H01L31/0203 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01S5/40 ,  H01L33/48 ,  H01S5/02 ,  H01L25/075 ,  H01S5/183 ,  H01L25/04 ,  H01L31/02 ,  H01L25/16

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US09850124B2

公开(公告)日：2017-12-26

申请号：US14923602

申请日：2015-10-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Yu-Hsuan Tsai

IPC: H01L31/0232 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81B2201/0292 ,  B81C1/00317 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending from a top surface of the base substrate to a bottom surface of the base substrate; at least a portion of the inner sidewall of the base substrate is tilted. The periphery barrier is coupled to the bottom surface of the base substrate and contacts a top surface of the carrier. The filter is disposed on the top surface of the base substrate and covers the penetrating hole.