公开(公告)号：US20160055975A1

公开(公告)日：2016-02-25

申请号：US14830587

申请日：2015-08-19

Applicant: Apple Inc.

Inventor： Cesar Lozano Villarreal ,  Gang Ning ,  Alexander Michael Kwan

IPC: H01G4/228 ,  H05K1/14 ,  H01G13/00 ,  H05K1/18

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G2/10 ,  H01G4/10 ,  H01G4/224 ,  H01G4/33 ,  H01G13/006 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10015

Abstract: This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.

Abstract translation: 该应用包括与电容器相关的多个实施例。 在一些实施例中，将电容器设置为具有平行且相对轴向延伸的端子引线。 本文讨论的实施例涉及一种电容器模块，其包括用于在电容器模块内提供电荷存储的一个或多个阳极氧化颗粒。 电容器模块可以被配置为表面安装或非表面安装的电容器模块。 电容器模块可以包括阳极氧化颗粒的阵列，其被布置成多行或多列阳极氧化的颗粒，所述阳极氧化颗粒通过包含在电容器模块中的导电迹线连接 在电容器模块的非表面安装的实施例中，电容器模块可以包括仅在电容器模块的侧表面上的阴极和阳极连接。

公开(公告)号：US20180144870A1

公开(公告)日：2018-05-24

申请号：US15873855

申请日：2018-01-17

Applicant: Apple Inc.

Inventor： Gang Ning ,  Shawn X. Arnold

IPC: H01G4/30 ,  H01G13/00 ,  H01G4/012 ,  H01G4/232 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G13/00

Abstract: This application relates to multi-layered ceramic capacitors (MLCC) that can be surface mounted, include multiple terminals, and handle multiple voltages. The MLCC can include electrode and dielectric layers that are stacked in parallel to a printed circuit board (PCB) on which the MLCC can be attached. A set of primary conductive pads can be formed on the bottom of the MLCC in order to create a conductive interface between the PCB and the MLCC. Secondary conductive pads are formed on the side of the MLCC, and can extend perpendicular to the PCB. The secondary conductive pads are created by stacking internal electrode plates together and connecting them electrically and mechanically to each another. This arrangement provides for multiple voltages and electrical connections at the MLCC while reducing reverse piezoelectric and/or electro-striction noise.

公开(公告)号：US09715964B2

公开(公告)日：2017-07-25

申请号：US14500786

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Gang Ning ,  Pradeep Vengavasi ,  Linda Y. Dunn ,  Yonas A. Hartanto ,  Shawn X. Arnold

IPC: H01G2/22 ,  H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12

CPC classification number: H01G2/22 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: This disclosure describes methods and systems for minimizing electromagnetic interference (EMI) noise emanating from a ceramic capacitor. The ceramic capacitor may include several terminations are on a bottom portion of the capacitor. The capacitor may be designed to include several capacitors formed from electrode layers. The capacitor may include a conductive coating on an outer peripheral portion. The coating may include conductive materials such as Cu, Ni, Ag, and/or graphite. Alternatively, some regions of the capacitor may include electrode layers built into the capacitor that are not associated with capacitors. In this manner, the ceramic capacitor may be free of the conductive coating to locations proximate to the described electrode layers not associated with capacitors. The conductive coating can act as an electromagnetic shielding to prevent the EMI noise from emanating outside the electromagnetic shielding. Also, the conductive coating can be electrically grounded (e.g., to printed circuit board) via terminals.

公开(公告)号：US20160055978A1

公开(公告)日：2016-02-25

申请号：US14830598

申请日：2015-08-19

Applicant: Apple Inc.

Inventor： Gang Ning ,  Raul A. Perez ,  Parin Patel

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/228

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G2/10 ,  H01G4/10 ,  H01G4/224 ,  H01G4/33 ,  H01G13/006 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10015

Abstract: This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.

Abstract translation: 该应用包括与电容器相关的多个实施例。 在一些实施例中，将电容器设置为具有平行和相对轴向延伸的端子引线。 本文讨论的实施例涉及一种电容器模块，其包括用于在电容器模块内提供电荷存储的一个或多个阳极氧化颗粒。 电容器模块可以被配置为表面安装或非表面安装的电容器模块。 电容器模块可以包括阳极氧化颗粒的阵列，其被布置成多行或多列阳极氧化的颗粒，所述阳极氧化颗粒通过包含在电容器模块中的导电迹线连接 在电容器模块的非表面安装的实施例中，电容器模块可以包括仅在电容器模块的侧表面上的阴极和阳极连接。

公开(公告)号：US20150364253A1

公开(公告)日：2015-12-17

申请号：US14500794

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Dennis R. Pyper ,  Gang Ning ,  Meng Chi Lee ,  Sascha Tietz ,  Sury N. Darbha ,  Zhong-Qing Gong

IPC: H01G2/06 ,  G10K11/16 ,  H01G4/12 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G2/065 ,  G10K11/16 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component.

Abstract translation: 描述了用于将具有压电特性的电路部件（例如陶瓷电容器）耦合到印刷电路板（PCB）的装置和方法，该方法通过形成将电路部件固定地耦合到PCB的第一焊脚跟内圆角和第二焊脚跟内圆角 其中第一和第二焊脚后视角具有低于电路部件的高度h的高度z，以减小由于将电路部件耦合到PCB而导致的PCB处的声学噪声。 在各种配置中，第一焊脚跟内圆角和第二焊脚跟内圆角可以各自固定地连接到：电路部件的底表面，PCB的顶表面处于第一焊盘和第二焊垫，下部 电路部件的多个侧表面中的每一个的部分。

公开(公告)号：US20180061578A1

公开(公告)日：2018-03-01

申请号：US15694726

申请日：2017-09-01

Applicant: Apple Inc.

Inventor： Gang Ning ,  Paul A. Martinez ,  Amanda R. Rainer ,  Won Seop Choi ,  Gemin Li ,  Zhong-Qing Gong ,  Shawn X. Arnold

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/232 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015

Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.