公开(公告)号：US12165843B2

公开(公告)日：2024-12-10

申请号：US17981282

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Nathan Ransom ,  Priya Gambhire ,  Jeremy Zuch ,  Senthil Kumar Vadivelu

IPC: C23C14/54 ,  H01J37/32 ,  H01J47/02 ,  H03H7/38

Abstract: Embodiments disclosed herein include a method for field adjusting calibrating factors of a plurality of RF impedance matches for control of a plurality of plasma chambers. In an embodiment, the method comprises collecting and storing in a memory data from operation of the plurality of RF impedance matches, and finding a tune space for each of the plurality of RF impedance matches from the collected data. In an embodiment, the method further comprises finding adjustments to account for variability in each of the plurality of RF impedance matches, finding adjustments to variable tuning elements of the plurality of RF impedance matches to account for time varying and process related load impedances, and the method further comprises obtaining operating windows for the variable tuning elements in the plurality of RF impedance matches.

公开(公告)号：US20230361746A1

公开(公告)日：2023-11-09

申请号：US17737677

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  David Peterson

IPC: H03F1/56 ,  H03H7/40

CPC classification number: H03H7/40 ,  H03F1/56

Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.

公开(公告)号：US20230358790A1

公开(公告)日：2023-11-09

申请号：US17737682

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Xiaopu Li ,  Michelle SanPedro

IPC: G01R19/00 ,  G01R19/25 ,  G01R19/165 ,  G01R15/18

CPC classification number: G01R19/0007 ,  G01R19/2513 ,  G01R19/16533 ,  G01R15/18

Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.