公开(公告)号：US12061215B2

公开(公告)日：2024-08-13

申请号：US17737682

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Xiaopu Li ,  Michelle SanPedro

IPC: G01R19/00 ,  G01R15/18 ,  G01R19/165 ,  G01R19/25

CPC classification number: G01R19/0007 ,  G01R15/18 ,  G01R19/16533 ,  G01R19/2513

Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.

公开(公告)号：US20230360896A1

公开(公告)日：2023-11-09

申请号：US17737665

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Valeriy Serebryanskiy

IPC: H01J37/32 ,  G01R23/02

CPC classification number: H01J37/32935 ,  H01J37/32183 ,  G01R23/02 ,  H01J2237/24564 ,  H01J2237/332 ,  H03L7/06

Abstract: Embodiments disclosed herein include a processing tool. In an embodiment the processing tool comprises a transmission line sensor, and an analog to digital (A/D) converter. In an embodiment, the processing tool may further comprise a digital down converter (DDC), and a frequency digital phase lock loop (dPLL). In an embodiment, the processing tool may further comprise a transmission line scaling module.

公开(公告)号：US20230360885A1

公开(公告)日：2023-11-09

申请号：US17737659

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou

IPC: H01J37/32 ,  H03H7/40 ,  G01R19/00

CPC classification number: H01J37/32183 ,  H03H7/40 ,  G01R19/003 ,  G01R19/0061

Abstract: Embodiments disclosed herein include a processing tool. In an embodiment, the processing tool comprises a power supply, an impedance matching network coupled to the power supply, a cathode, wherein the power supply is configured to supply power through the impedance matching network to the cathode, and a processing module, wherein the processing module is communicatively coupled to the power supply and the impedance matching network.

公开(公告)号：US20250037973A1

公开(公告)日：2025-01-30

申请号：US18912366

申请日：2024-10-10

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20240153743A1

公开(公告)日：2024-05-09

申请号：US17981282

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  NATHAN RANSOM ,  PRIYA GAMBHIRE ,  JEREMY ZUCH ,  SENTHIL KUMAR VADIVELU

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32256

Abstract: Embodiments disclosed herein include a method for field adjusting calibrating factors of a plurality of RF impedance matches for control of a plurality of plasma chambers. In an embodiment, the method comprises collecting and storing in a memory data from operation of the plurality of RF impedance matches, and finding a tune space for each of the plurality of RF impedance matches from the collected data. In an embodiment, the method further comprises finding adjustments to account for variability in each of the plurality of RF impedance matches, finding adjustments to variable tuning elements of the plurality of RF impedance matches to account for time varying and process related load impedances, and the method further comprises obtaining operating windows for the variable tuning elements in the plurality of RF impedance matches.

公开(公告)号：US12301199B2

公开(公告)日：2025-05-13

申请号：US17737677

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  David Peterson

IPC: H03H7/40 ,  H03F1/56

Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.

公开(公告)号：US20240393373A1

公开(公告)日：2024-11-28

申请号：US18787862

申请日：2024-07-29

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Xiaopu Li ,  Michelle SanPedro

IPC: G01R19/00 ,  G01R15/18 ,  G01R19/165 ,  G01R19/25

Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.

公开(公告)号：US12142461B2

公开(公告)日：2024-11-12

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20230360886A1

公开(公告)日：2023-11-09

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32935 ,  H01J2237/332

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US12183548B2

公开(公告)日：2024-12-31

申请号：US17737659

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou

IPC: H03H7/38 ,  G01R19/00 ,  H01J37/32 ,  H03H7/40

Abstract: Embodiments disclosed herein include a processing tool. In an embodiment, the processing tool comprises a power supply, an impedance matching network coupled to the power supply, a cathode, wherein the power supply is configured to supply power through the impedance matching network to the cathode, and a processing module, wherein the processing module is communicatively coupled to the power supply and the impedance matching network.