公开(公告)号：US12216015B2

公开(公告)日：2025-02-04

申请号：US18531478

申请日：2023-12-06

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  David Peterson ,  Philip Allan Kraus ,  Amir Bayati

IPC: G01L19/00 ,  G01N29/02 ,  H03H9/02 ,  H03H9/145

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.

公开(公告)号：US12301199B2

公开(公告)日：2025-05-13

申请号：US17737677

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  David Peterson

IPC: H03H7/40 ,  H03F1/56

Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.

公开(公告)号：US12142461B2

公开(公告)日：2024-11-12

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20230360886A1

公开(公告)日：2023-11-09

申请号：US17737670

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32935 ,  H01J2237/332

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20250037973A1

公开(公告)日：2025-01-30

申请号：US18912366

申请日：2024-10-10

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US11874189B2

公开(公告)日：2024-01-16

申请号：US17367250

申请日：2021-07-02

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  David Peterson ,  Philip Allan Kraus ,  Amir Bayati

IPC: G01L19/00 ,  G01N29/02 ,  H03H9/02 ,  H03H9/145

CPC classification number: G01L19/0092 ,  H03H9/02015 ,  H03H9/02574 ,  H03H9/14502 ,  G01N29/022 ,  G01N2291/014

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.

公开(公告)号：US20230003598A1

公开(公告)日：2023-01-05

申请号：US17367250

申请日：2021-07-02

Applicant: Applied Materials, Inc.

Inventor： Chuang-Chia Lin ,  David Peterson ,  Philip Allan Kraus ,  Amir Bayati

IPC: G01L19/00 ,  H03H9/02 ,  H03H9/145

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.

公开(公告)号：US20230361746A1

公开(公告)日：2023-11-09

申请号：US17737677

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  David Peterson

IPC: H03F1/56 ,  H03H7/40

CPC classification number: H03H7/40 ,  H03F1/56

Abstract: Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.