公开(公告)号：US20230365753A1

公开(公告)日：2023-11-16

申请号：US18315153

申请日：2023-05-10

Applicant: Ascend Performance Materials Operations LLC

Inventor： Jacob G. Ray ,  Ramesh Ramakrishnan

IPC: C08G69/28

CPC classification number: C08G69/28

Abstract: A method of producing a polyamide elastomer comprising feeding a salt solution having a solids content of greater than or equal to 80% to a reactor having a phosphorous containing catalyst having a phosphorous level from 5 to 1000 part by million based on the total weight of the catalyst, feeding a polyether amine to the reactor, and reducing the pressure in the reactor once a target temperature is reached to polymerize the salt solution and the polyether amine to form the polyamide elastomer. The polyamide elastomer has particular uses as a cable tie and demonstrates improved cold-temperature applications while maintaining high strength, good flammability rating, and excellent processability.

公开(公告)号：US20230193026A1

公开(公告)日：2023-06-22

申请号：US18067055

申请日：2022-12-16

Applicant: Ascend Performance Materials Operations LLC

Inventor： Bradley J. Sparks ,  Jacob G. Ray

IPC: C08L77/06 ,  C08K3/22 ,  C08K7/14 ,  C08K3/08

CPC classification number: C08L77/06 ,  C08K3/22 ,  C08K7/14 ,  C08K3/08 ,  C08K2003/221 ,  C08L2203/20 ,  C08K2003/085 ,  C08L2201/08

Abstract: A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 0-65 wt % filler.

公开(公告)号：US20230151167A1

公开(公告)日：2023-05-18

申请号：US18055451

申请日：2022-11-15

Applicant: Ascend Performance Materials Operations LLC

Inventor： Ramesh Ramakrishnan ,  Jacob G. Ray ,  Joseph Suriano

IPC: C08J5/18 ,  C08G69/14 ,  C08K3/22 ,  B29C48/00 ,  B29C48/08

CPC classification number: C08J5/18 ,  C08G69/14 ,  C08K3/22 ,  B29C48/022 ,  B29C48/08 ,  C08K2003/2296 ,  B29K2077/00

Abstract: An antimicrobial film comprising antimicrobial film comprising from 50 wt % to 99.99 wt % of a polyamide composition, and from 10 wppm to 6000 wppm of zinc (and/or copper) dispersed within the film; wherein the film demonstrates: an antimicrobial efficacy to Staphylococcus aureus and Escherichia coli log reduction greater than 2.0, as determined by ISO 22196 (modified), and a slow rate puncture resistance greater than 1.5 N/μm as measured according to ASTM F1306.

公开(公告)号：US20200032057A1

公开(公告)日：2020-01-30

申请号：US16525121

申请日：2019-07-29

Applicant: Ascend Performance Materials Operations LLC

Inventor： Jacob G. Ray ,  Douglas Hoffman ,  Scott E. Powers

IPC: C08L77/06 ,  C08G69/14 ,  C08G69/26 ,  C08L77/02

Abstract: A terpolymer composition is described that contains a statistical amount of 50-98 wt % of a first repeating AA-BB comonomer unit; 1-25 wt % of a second repeating AA-BB comonomer unit; and 1-25 wt % of a repeating lactam comonomer unit or 1-25 wt % of a third repeating AA-BB comonomer unit, where the terpolymer composition exhibits a high melting point similar to that of PA66 while also exhibiting a significantly reduced crystallization rate and crystallization temperature.

公开(公告)号：US11643552B2

公开(公告)日：2023-05-09

申请号：US17307020

申请日：2021-05-04

Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC

Inventor： Jacob G. Ray ,  Ramesh Ramakrishnan ,  Douglas Claire Hoffman ,  Roland M. Planeta

IPC: C08L77/06 ,  C08J5/18

CPC classification number: C08L77/06 ,  C08J5/18 ,  C08J2377/06 ,  C08J2477/06 ,  C08L2205/025

Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.

公开(公告)号：US11274192B2

公开(公告)日：2022-03-15

申请号：US16455268

申请日：2019-06-27

Applicant: Ascend Performance Materials Operations LLC

Inventor： Kimberly M. White ,  Scott E. Powers ,  Jacob G. Ray ,  Bradley J. Sparks

IPC: C08K13/02 ,  B29C45/00 ,  B29C45/72 ,  C08G69/26 ,  C08G69/36 ,  C08K3/22 ,  C08K3/40 ,  C08K5/098 ,  C08K5/3435 ,  C08K7/14 ,  C08K9/06 ,  C23C18/16 ,  C23C18/22 ,  C23C18/31 ,  C25D5/54 ,  B29K77/00 ,  B29K105/12 ,  B29K509/08

Abstract: The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.

公开(公告)号：US20210347993A1

公开(公告)日：2021-11-11

申请号：US17307020

申请日：2021-05-04

Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC

Inventor： Jacob G. Ray ,  Ramesh Ramakrishnan ,  Douglas Claire Hoffman ,  Roland M. Planeta

IPC: C08L77/06 ,  C08J5/18

Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.

公开(公告)号：US20200002511A1

公开(公告)日：2020-01-02

申请号：US16455268

申请日：2019-06-27

Applicant: Ascend Performance Materials Operations LLC

Inventor： Kimberly M. White ,  Scott E. Powers ,  Jacob G. Ray ,  Bradley J. Sparks

IPC: C08K13/02 ,  C08G69/26 ,  C08G69/36 ,  C08K3/40 ,  C08K7/14 ,  C08K3/22 ,  C08K9/06 ,  C08K5/098 ,  C08K5/3435 ,  B29C45/00 ,  B29C45/72 ,  C23C18/22 ,  C23C18/31 ,  C23C18/16 ,  C25D5/54

Abstract: The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.

公开(公告)号：US20180298144A1

公开(公告)日：2018-10-18

申请号：US15763316

申请日：2016-09-28

Applicant: Ascend Performance Materials Operations LLC

Inventor： Jacob G. Ray ,  Tiffany Hristopoulos ,  Steven C. Manning ,  Tariq S. Oweimreen ,  Scott E. Powers ,  Askim Senyurt

IPC: C08G69/36 ,  C08G69/26 ,  C08K5/098 ,  C08K5/20 ,  C08K3/36 ,  C08J5/18 ,  B32B27/08 ,  B32B27/34 ,  B32B27/18 ,  B32B27/32

Abstract: A copolyamide composition comprising a statistical copolyamide containing 70-99 wt % of diamine and dicarboxylic acid repeat units and 1-30 wt % of lactam or AA-BB repeat units, whereby incorporation of the comonomer lactam or AA-BB unit reduces the crystallization rate (longer crystallization times) while maintaining (1) high melting point, (2) low potential plate out, (3) low oxygen permeation, (4) high tensile strength and (5) puncture/tear resistance.