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公开(公告)号:US11643552B2
公开(公告)日:2023-05-09
申请号:US17307020
申请日:2021-05-04
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor: Jacob G. Ray , Ramesh Ramakrishnan , Douglas Claire Hoffman , Roland M. Planeta
CPC classification number: C08L77/06 , C08J5/18 , C08J2377/06 , C08J2477/06 , C08L2205/025
Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.
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公开(公告)号:US20210347993A1
公开(公告)日:2021-11-11
申请号:US17307020
申请日:2021-05-04
Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC
Inventor: Jacob G. Ray , Ramesh Ramakrishnan , Douglas Claire Hoffman , Roland M. Planeta
Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.
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公开(公告)号:US20250115713A1
公开(公告)日:2025-04-10
申请号:US18917342
申请日:2024-10-16
Applicant: Ascend Performance Materials Operations LLC
Inventor: Jacob G. Ray , Bradley J. Sparks , Ramesh Ramakrishnan , Nanayakkara L. Somasiri
Abstract: A polyamide composition comprising from 45 wt % to 95 wt % of polyamide polymer and from 5 wt % to 55 wt % of a modifier comprising a C18-44 dimer acid or a C18-44 dimer amine or a combination thereof. A number average molecular weight of the polyamide polymer is less than 30,000 g/mol. The polyamide composition has a chemical resistance, as measured by exposure to HCl (10%) for 14 days at 58° C., resulting in a weight loss of less than 3.0 wt %; and a moisture uptake of less than about 2.0 wt % moisture at 95% RH. A process for preparing the polyamide composition is also disclosed.
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公开(公告)号:US20230147709A1
公开(公告)日:2023-05-11
申请号:US17984681
申请日:2022-11-10
Applicant: Ascend Performance Materials Operations LLC
Inventor: Jacob G. Ray , Ramesh Ramakrishnan
IPC: C08L77/06
CPC classification number: C08L77/06 , C08L2205/035 , C08L2205/025
Abstract: A polyamide composition comprising a base polyamide and an elastomer concentrate comprising: 20-80 wt % of an elastomeric aliphatic polyether having a molecular weight ranging from 400-4000 g/mol; and 80-20 wt % of a concentrate polyamide. The polyamide composition has particular uses as a cable tie and demonstrates improved cold-temperature applications while maintaining high strength, good flammability rating, and excellent processability.
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公开(公告)号:US20230365753A1
公开(公告)日:2023-11-16
申请号:US18315153
申请日:2023-05-10
Applicant: Ascend Performance Materials Operations LLC
Inventor: Jacob G. Ray , Ramesh Ramakrishnan
IPC: C08G69/28
CPC classification number: C08G69/28
Abstract: A method of producing a polyamide elastomer comprising feeding a salt solution having a solids content of greater than or equal to 80% to a reactor having a phosphorous containing catalyst having a phosphorous level from 5 to 1000 part by million based on the total weight of the catalyst, feeding a polyether amine to the reactor, and reducing the pressure in the reactor once a target temperature is reached to polymerize the salt solution and the polyether amine to form the polyamide elastomer. The polyamide elastomer has particular uses as a cable tie and demonstrates improved cold-temperature applications while maintaining high strength, good flammability rating, and excellent processability.
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公开(公告)号:US20230151167A1
公开(公告)日:2023-05-18
申请号:US18055451
申请日:2022-11-15
Applicant: Ascend Performance Materials Operations LLC
Inventor: Ramesh Ramakrishnan , Jacob G. Ray , Joseph Suriano
CPC classification number: C08J5/18 , C08G69/14 , C08K3/22 , B29C48/022 , B29C48/08 , C08K2003/2296 , B29K2077/00
Abstract: An antimicrobial film comprising antimicrobial film comprising from 50 wt % to 99.99 wt % of a polyamide composition, and from 10 wppm to 6000 wppm of zinc (and/or copper) dispersed within the film; wherein the film demonstrates: an antimicrobial efficacy to Staphylococcus aureus and Escherichia coli log reduction greater than 2.0, as determined by ISO 22196 (modified), and a slow rate puncture resistance greater than 1.5 N/μm as measured according to ASTM F1306.
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