公开(公告)号：US20090218116A1

公开(公告)日：2009-09-03

申请号：US12167242

申请日：2008-07-02

Applicant: Chia-Hui Wu

Inventor： Chia-Hui Wu

IPC: H05K1/00 ,  B05D5/12

CPC classification number: H01L23/4985 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K1/0209 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2203/104 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract translation: 膜芯片（COF）结构包括柔性电路板和芯片。 柔性电路板包括柔性基膜和导电层。 柔性基膜具有聚酰亚胺层和各向异性导电层（ACL）。 导电层设置在柔性基膜上。 导电层和ACL被聚酰亚胺层分离。 芯片通过互连器件安装有导电层。

公开(公告)号：US20060006531A1

公开(公告)日：2006-01-12

申请号：US10711674

申请日：2004-09-30

Applicant: Chiu-Shun Lin ,  Kuan-Chou Lin ,  Chia-Hui Wu ,  Pai-Sheng Cheng

Inventor： Chiu-Shun Lin ,  Kuan-Chou Lin ,  Chia-Hui Wu ,  Pai-Sheng Cheng

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

Abstract translation: 提供了芯片结构和接合焊盘。 芯片结构包括芯片和至少一个焊盘。 该芯片具有活性表面。 焊盘设置在芯片的有源表面上。 接合焊盘包括多边形主体和多个第一突出部分。 多边形体具有第一平面和相应的第二平面。 多边体的第二平面与芯片接触。 第一突出部设置在多边体的角部的第一平面上。 通过改变接合焊盘的几何形状，增加了通过接合焊盘将芯片结构和另一个器件结合在一起的成品率。

公开(公告)号：US20130087906A1

公开(公告)日：2013-04-11

申请号：US13253088

申请日：2011-10-05

Applicant: Pai-Sheng Cheng ,  Chia-Hui Wu

Inventor： Pai-Sheng Cheng ,  Chia-Hui Wu

IPC: H01L23/498

CPC classification number: H01L24/11 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/16058 ,  H01L2224/16502 ,  H01L2224/81193 ,  H01L2224/81805 ,  H01L2224/8185 ,  H01L2224/83193 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump.

Abstract translation: 本发明提供一种电路板，其包括基板，至少一个引线，至少一个凸块和焊料层。 引线设置在基板上，并且凸块设置在引线上。 焊料层覆盖引线和凸块。

公开(公告)号：US08142096B2

公开(公告)日：2012-03-27

申请号：US12588338

申请日：2009-10-13

Applicant: Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

Inventor： Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

IPC: B42F3/00 ,  B42F13/00 ,  B42F13/12 ,  B42F13/40 ,  G09B5/00

CPC classification number: B42F13/16 ,  B42F13/40 ,  G06F1/1635 ,  G06F1/1656 ,  G06F2200/1634 ,  H01M2/1055

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover plate and plural parallel folder rings piercing through an edge of the cover plate. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and a movable arm. The movable arm has two opposite ends, in which one end thereof is fixed on one of the opposite ends of the column-shaped battery portion, and the other end thereof is movably disposed on one side of the main body.

Abstract translation: 本公开中提供的包含计算机的装订夹具具有文件夹和计算机装置。 文件夹具具有穿过盖板的边缘的至少一个盖板和多个平行折叠环。 计算机装置具有主体，由所有平行折叠环刺穿的柱状电池部分和可动臂。 可动臂具有两个相对的端部，其一端固定在柱状电池部分的相对端之一上，另一端可移动地设置在主体的一侧。

公开(公告)号：US20100310303A1

公开(公告)日：2010-12-09

申请号：US12588339

申请日：2009-10-13

Applicant: Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

Inventor： Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

IPC: B42F13/40

CPC classification number: B42F13/40

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover and plural parallel folder rings piercing through an edge of the cover. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and two shafts. Each shaft respectively pivots the column-shaped battery portion and the main body at two opposite end of the shaft.

Abstract translation: 本公开中提供的包含计算机的装订夹具具有文件夹和计算机装置。 文件夹具具有穿过盖的边缘的至少一个盖和多个平行的折叠环。 计算机装置具有主体，通过所有平行折叠环刺穿的柱状电池部分和两个轴。 每个轴分别在柱的两相对端枢转柱状电池部分和主体。

公开(公告)号：US20100310302A1

公开(公告)日：2010-12-09

申请号：US12588338

申请日：2009-10-13

Applicant: Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

Inventor： Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

IPC: B42F13/40

CPC classification number: B42F13/16 ,  B42F13/40 ,  G06F1/1635 ,  G06F1/1656 ,  G06F2200/1634 ,  H01M2/1055

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover plate and plural parallel folder rings piercing through an edge of the cover plate. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and a movable arm. The movable arm has two opposite ends, in which one end thereof is fixed on one of the opposite ends of the column-shaped battery portion, and the other end thereof is movably disposed on one side of the main body.

Abstract translation: 本公开中提供的包含计算机的装订夹具具有文件夹和计算机装置。 文件夹具具有穿过盖板的边缘的至少一个盖板和多个平行折叠环。 计算机装置具有主体，由所有平行折叠环刺穿的柱状电池部分和可动臂。 可动臂具有两个相对的端部，其一端固定在柱状电池部分的相对端之一上，另一端可移动地设置在主体的一侧。

公开(公告)号：US20100309612A1

公开(公告)日：2010-12-09

申请号：US12551622

申请日：2009-09-01

Applicant: Yuan-Chen Liang ,  Cheng-Wang Lin ,  Jui-Lan Yu ,  Chia-Hui Wu ,  Hung-Ching Chen

Inventor： Yuan-Chen Liang ,  Cheng-Wang Lin ,  Jui-Lan Yu ,  Chia-Hui Wu ,  Hung-Ching Chen

IPC: H05K5/00 ,  F16C29/02

CPC classification number: H04M1/0237 ,  H04M1/0216

Abstract: An electronic device includes an upper cover and a main body. A sliding assembly is disposed between the upper cover and the main body and includes a sliding portion, a spring, and a track with a first positioning portion disposed at the center of a side of the track and two second positionings portion disposed on two ends of the side of the track. The spring including an engaging portion and two ends, and the sliding portion are fixed on the cover. The engaging portion and the ends form an included angle. The sliding portion is movably connected to the track and slides thereon. When the sliding portion slides on the track, the engaging portion is engaged with one of the first positioning portion and the second positioning portions.

Abstract translation: 电子设备包括上盖和主体。 滑动组件设置在上盖和主体之间，并且包括滑动部分，弹簧和轨道，其中第一定位部分设置在轨道的一侧的中心，并且两个第二定位部分设置在轨道的两端 轨道的一边。 弹簧包括接合部分和两个端部，并且滑动部分固定在盖子上。 接合部分和端部形成夹角。 滑动部分可移动地连接到轨道并在其上滑动。 当滑动部分在轨道上滑动时，接合部分与第一定位部分和第二定位部分中的一个接合。

公开(公告)号：US20090091028A1

公开(公告)日：2009-04-09

申请号：US12110868

申请日：2008-04-28

Applicant: Chiu-Shun Lin ,  Chia-Hui Wu ,  Wen-Chieh Tu

Inventor： Chiu-Shun Lin ,  Chia-Hui Wu ,  Wen-Chieh Tu

IPC: H01L23/482 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/116 ,  H01L2224/11902 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13144 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29075 ,  H01L2224/83851

Abstract: A semiconductor device including a semiconductor substrate, a contact pad, a passivation layer, a bump, and a seeding layer is provided. The semiconductor substrate has an active surface. The contact pad is disposed on the active surface. The passivation layer is disposed on the active surface and exposes a central part of the contact pad. The seeding layer is disposed on the exposed central part of the contact pad. The bump has a top surface, a bottom surface opposite to the top surface, and a side surface connecting the top surface and the bottom surface. The bump is disposed on the seeding layer. The bump is placed in contact with the seeding layer by the bottom surface and by part of the side surface.

Abstract translation: 提供了包括半导体衬底，接触焊盘，钝化层，凸块和接种层的半导体器件。 半导体衬底具有活性表面。 接触垫设置在有源表面上。 钝化层设置在有源表面上并且暴露接触焊盘的中心部分。 接种层设置在接触垫的暴露的中心部分上。 凸块具有顶表面，与顶表面相对的底表面和连接顶表面和底表面的侧表面。 凸块设置在接种层上。 凸块通过底面和侧面的一部分与接种层接触。

公开(公告)号：US07064449B2

公开(公告)日：2006-06-20

申请号：US10711674

申请日：2004-09-30

Applicant: Chiu-Shun Lin ,  Kuan-Chou Lin ,  Chia-Hui Wu ,  Pai-Sheng Cheng

Inventor： Chiu-Shun Lin ,  Kuan-Chou Lin ,  Chia-Hui Wu ,  Pai-Sheng Cheng

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

Abstract translation: 提供了芯片结构和接合焊盘。 芯片结构包括芯片和至少一个焊盘。 该芯片具有活性表面。 焊盘设置在芯片的有源表面上。 接合焊盘包括多边形主体和多个第一突出部分。 多边形体具有第一平面和相应的第二平面。 多边体的第二平面与芯片接触。 第一突出部设置在多边体的角部的第一平面上。 通过改变接合焊盘的几何形状，增加了通过接合焊盘将芯片结构和另一个器件结合在一起的成品率。

公开(公告)号：US06861749B2

公开(公告)日：2005-03-01

申请号：US10247553

申请日：2002-09-20

Applicant: Chia-Hui Wu ,  Biing-Seng Wu ,  Ying-Chou Tu

Inventor： Chia-Hui Wu ,  Biing-Seng Wu ,  Ying-Chou Tu

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A semiconductor device comprises a substrate having contact pads each covered by under bump metallurgy and a plurality of bump electrodes respectively provided on the under bump metallurgy covering the contact pads. According to one embodiment of the present invention, the semiconductor device is characterized by having at least one contact pad (e.g., a test contact pad) which is not provided with any bump electrode but still has under bump metallurgy provided thereon. According to another embodiment of the present invention, the semiconductor device is characterized by having at least a conductive line formed of the same material as the under bump metallurgy for interconnecting at least two of the contact pads. The present invention further provides methods of manufacturing the semiconductor devices.

Abstract translation: 半导体器件包括具有各自被凸块下金属覆盖的接触焊盘的基板和分别设置在覆盖接触焊盘的凸块下的金属上的多个凸起电极。 根据本发明的一个实施例，半导体器件的特征在于具有至少一个接触焊盘（例如，测试接触焊盘），其没有设置任何凸起电极，但是在其上设置有凸起下的冶金。 根据本发明的另一实施例，半导体器件的特征在于至少具有由与凸块下方冶金相同的材料形成的导电线，用于互连至少两个接触焊盘。 本发明还提供了制造半导体器件的方法。