公开(公告)号：US08199478B2

公开(公告)日：2012-06-12

申请号：US12551622

申请日：2009-09-01

Applicant: Yuan-Chen Liang ,  Cheng-Wang Lin ,  Jui-Lan Yu ,  Chia-Hui Wu ,  Hung-Ching Chen

Inventor： Yuan-Chen Liang ,  Cheng-Wang Lin ,  Jui-Lan Yu ,  Chia-Hui Wu ,  Hung-Ching Chen

IPC: G06F1/16

CPC classification number: H04M1/0237 ,  H04M1/0216

Abstract: An electronic device includes an upper cover and a main body. A sliding assembly is disposed between the upper cover and the main body and includes a sliding portion, a spring, and a track with a first positioning portion disposed at the center of a side of the track and two second positionings portion disposed on two ends of the side of the track. The spring including an engaging portion and two ends, and the sliding portion are fixed on the cover. The engaging portion and the ends form an included angle. The sliding portion is movably connected to the track and slides thereon. When the sliding portion slides on the track, the engaging portion is engaged with one of the first positioning portion and the second positioning portions.

Abstract translation: 电子设备包括上盖和主体。 滑动组件设置在上盖和主体之间，并且包括滑动部分，弹簧和轨道，其中第一定位部分设置在轨道的一侧的中心，并且两个第二定位部分设置在轨道的两端 轨道的一边。 弹簧包括接合部分和两个端部，并且滑动部分固定在盖子上。 接合部分和端部形成夹角。 滑动部分可移动地连接到轨道并在其上滑动。 当滑动部分在轨道上滑动时，接合部分与第一定位部分和第二定位部分中的一个接合。

公开(公告)号：US07473459B2

公开(公告)日：2009-01-06

申请号：US11379744

申请日：2006-04-21

Applicant: Chia-Hui Wu ,  Pai-Sheng Cheng ,  Hung-Yi Wang

Inventor： Chia-Hui Wu ,  Pai-Sheng Cheng ,  Hung-Yi Wang

IPC: B32B3/00 ,  H05K1/09

CPC classification number: H05K3/108 ,  H05K1/0393 ,  H05K3/061 ,  H05K3/24 ,  H05K3/388 ,  H05K2203/0542 ,  H05K2203/1476 ,  Y10T428/24917

Abstract: A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.

Abstract translation: 提供一种制造薄膜印刷电路板的方法。 提供由聚酰亚胺基板，合金层和第一铜层构成的薄膜基板。 执行第一光刻和蚀刻工艺以对铜层和合金层进行图案化，并且在聚酰亚胺基板上形成多个导线结构。 在聚酰亚胺基板和导线结构上形成第二铜层。 执行第二光刻和蚀刻工艺以对第二铜层进行图案化。

公开(公告)号：US09348019B2

公开(公告)日：2016-05-24

申请号：US13682389

申请日：2012-11-20

Applicant: Wei-Ko Wang ,  Chin-Ching Chang ,  Chia-Hui Wu ,  Chien-Hsiung Huang ,  Cheng-Xuan Lin ,  Chang-Wei Chen

Inventor： Wei-Ko Wang ,  Chin-Ching Chang ,  Chia-Hui Wu ,  Chien-Hsiung Huang ,  Cheng-Xuan Lin ,  Chang-Wei Chen

IPC: H01L27/14 ,  G01S7/481 ,  G01S17/89 ,  H01L27/146 ,  G01S17/02

CPC classification number: G01S7/4816 ,  G01S17/023 ,  G01S17/89 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14649

Abstract: An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

Abstract translation: 提供了一种图像感测装置。 图像感测装置包括：包括双带通过滤光器和红外滤光器的滤光器阵列; 放置在双波段通过滤波器之下的RGB像素阵列; 以及与RGB像素阵列相邻并置于双波段通过滤波器和红外滤波器之下的TOF像素阵列，其中双波段通过滤波器和红外通过滤波器的组合仅允许红外区域中的入射光 传递给ToF像素阵列。

公开(公告)号：US20050133912A1

公开(公告)日：2005-06-23

申请号：US10995141

申请日：2004-11-24

Applicant: Chia-Hui Wu ,  Pai-Sheng Cheng ,  Wen-Chieh Tu

Inventor： Chia-Hui Wu ,  Pai-Sheng Cheng ,  Wen-Chieh Tu

IPC: H01L23/498 ,  H01L29/40

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrical connection structure for electrically connecting with a chip and a bearing element is provided. The chip has a first surface. The bearing element has a second surface corresponding to the first surface. The electrical connection structure includes two outer contact points on the first surface, M inner contact points on the first surface and correspond to the inner side of the first surface, two outer conducting wires on the second surface, and M inner conducting wires on the second surface and corresponding to the M inner contact points. The chip and the bearing element are electrically connected via the electrical contact between the two outer contact points and the two outer conducting wires, and the electrical connection between the M inner contact points and the M inner conducting wires. M is a positive integer greater than or equal to 2.

Abstract translation: 提供了一种用于与芯片和轴承元件电连接的电连接结构。 芯片具有第一表面。 轴承元件具有对应于第一表面的第二表面。 电气连接结构包括第一表面上的两个外部接触点，第一表面上的M个内部接触点和第一表面的内侧，第二表面上的两个外部导电线，第二表面上的M个内部导电线 表面并对应于M内接触点。 芯片和轴承元件经由两个外部接触点和两个外部导电线之间的电接触以及M个内部接触点和M个内部导电线之间的电连接而电连接。 M是大于或等于2的正整数。

公开(公告)号：US08674503B2

公开(公告)日：2014-03-18

申请号：US13253088

申请日：2011-10-05

Applicant: Pai-Sheng Cheng ,  Chia-Hui Wu

Inventor： Pai-Sheng Cheng ,  Chia-Hui Wu

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L29/40

CPC classification number: H01L24/11 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/16058 ,  H01L2224/16502 ,  H01L2224/81193 ,  H01L2224/81805 ,  H01L2224/8185 ,  H01L2224/83193 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump.

Abstract translation: 本发明提供一种电路板，其包括基板，至少一个引线，至少一个凸块和焊料层。 引线设置在基板上，并且凸块设置在引线上。 焊料层覆盖引线和凸块。

公开(公告)号：US08657982B2

公开(公告)日：2014-02-25

申请号：US13551041

申请日：2012-07-17

Applicant: Yuan-Chen Liang ,  Chia-Hui Wu ,  Hung-Ta Lee ,  Yi-Chun Lin ,  Li-Chuan Chien ,  Kuo-Hsiang Hsu

Inventor： Yuan-Chen Liang ,  Chia-Hui Wu ,  Hung-Ta Lee ,  Yi-Chun Lin ,  Li-Chuan Chien ,  Kuo-Hsiang Hsu

IPC: B44C1/17

CPC classification number: H03K17/955 ,  H03K2017/9602 ,  H03K2217/960755 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T156/10 ,  Y10T156/1039 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/108

Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

Abstract translation: 用于制造适于附接到移动设备的接近感测模块的方法的步骤包括：（a）图案化上导电膜以形成图案化的导电膜，其包括适于电气的上连接焊盘 连接到移动设备的电路板上的相应触点，以​​及电连接到上连接焊盘的感应电路图案; （b）将粘合片粘附到图案化的导电膜上; 和（c）在粘合片中形成通孔，使得上连接垫从通孔露出。

公开(公告)号：US08017873B2

公开(公告)日：2011-09-13

申请号：US12167242

申请日：2008-07-02

Applicant: Chia-Hui Wu

Inventor： Chia-Hui Wu

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01L23/4985 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K1/0209 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2203/104 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract translation: 膜芯片（COF）结构包括柔性电路板和芯片。 柔性电路板包括柔性基膜和导电层。 柔性基膜具有聚酰亚胺层和各向异性导电层（ACL）。 导电层设置在柔性基膜上。 导电层和ACL被聚酰亚胺层分离。 芯片通过互连器件安装有导电层。

公开(公告)号：US20090020316A1

公开(公告)日：2009-01-22

申请号：US12033876

申请日：2008-02-19

Applicant: Chia-Hui Wu ,  Pai-Sheng Cheng ,  Po-Chiang Tseng

Inventor： Chia-Hui Wu ,  Pai-Sheng Cheng ,  Po-Chiang Tseng

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H01L23/4985 ,  H01L21/4846 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16225 ,  H05K1/111 ,  H05K2201/098 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um and a cross-section shape is substantially rectangular. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board, is provided. Each lead has a thickness of 8 um˜15 um, and lead widths of the leads are based on pitch widths of a plurality of bumps corresponding to the leads. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um, and a lead width of each of the leads is greater than a bump width minus 4 um.

Abstract translation: 提供一种制造薄膜（COF）的方法，包括：提供柔性电路板; 以及在所述柔性电路板上形成多个引线。 每个引线的厚度为8um〜15μm，截面形状基本上为矩形。 提供了一种COF结构，其具有柔性电路板和形成在柔性电路板上的多个引线。 每个引线的厚度为8um〜15μm，引线的引线宽度基于对应于引线的多个凸块的间距宽度。 COF结构，具有柔性电路板和形成在柔性电路板上的多个引线。 每个引线的厚度为8um〜15um，每个引线的引线宽度大于凹凸宽度减去4um。

公开(公告)号：US06772895B2

公开(公告)日：2004-08-10

申请号：US10170038

申请日：2002-06-11

Applicant: Yuan-Chen Liang ,  Wei-Cheng Yen ,  Chih-Ming Hsu ,  Chia-Hui Wu

Inventor： Yuan-Chen Liang ,  Wei-Cheng Yen ,  Chih-Ming Hsu ,  Chia-Hui Wu

IPC: B65D4300

CPC classification number: G06F1/1656 ,  G06F1/1613

Abstract: A casing for an electronic device and a method producing the same. The method comprises the following steps. First, a first member is formed of a first metallic material, and a second member is formed of a second metallic material. In the second member, at least one step portion is formed. Then, the casing is produced by combining the first member and the second member in a manner such that the step portion corresponds to the unit and the second member is nearer to the unit than the first member.

Abstract translation: 一种电子设备用壳体及其制造方法。 该方法包括以下步骤。 首先，第一构件由第一金属材料形成，第二构件由第二金属材料形成。 在第二构件中，形成至少一个台阶部。 然后，通过使第一构件和第二构件以使得台阶部对应于单元并且第二构件比第一构件更靠近单元的方式制造外壳。

公开(公告)号：US08137020B2

公开(公告)日：2012-03-20

申请号：US12588339

申请日：2009-10-13

Applicant: Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

Inventor： Chee-Chun Leung ,  Yuan-Chen Liang ,  Chia-Hui Wu ,  Yi-Chun Lin

IPC: B42F3/00 ,  B42F13/00 ,  B42F13/12 ,  B42F13/40 ,  G09B5/00

CPC classification number: B42F13/40

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover and plural parallel folder rings piercing through an edge of the cover. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and two shafts. Each shaft respectively pivots the column-shaped battery portion and the main body at two opposite end of the shaft.

Abstract translation: 本公开中提供的包含计算机的装订夹具具有文件夹和计算机装置。 文件夹具具有穿过盖的边缘的至少一个盖和多个平行的折叠环。 计算机装置具有主体，通过所有平行折叠环刺穿的柱状电池部分和两个轴。 每个轴分别在柱的两相对端枢转柱状电池部分和主体。