公开(公告)号：US09966324B2

公开(公告)日：2018-05-08

申请号：US14892724

申请日：2014-06-18

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shin-ichi Uchida ,  Masahiko Ito ,  Syunsuke Uchida

IPC: H01L23/373 ,  H01L21/48 ,  C09K5/14 ,  B29C47/00 ,  B29C47/88 ,  B29C35/08

CPC classification number: H01L23/3737 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/8805 ,  B29C2035/0822 ,  B29K2995/0013 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.

公开(公告)号：US09944840B2

公开(公告)日：2018-04-17

申请号：US14402195

申请日：2013-07-08

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki

IPC: B29C47/00 ,  C09K5/14 ,  C08J5/18 ,  H05K7/20 ,  H01L23/373 ,  H01L21/48 ,  B29D7/01 ,  F28F21/02 ,  B29C43/02 ,  B29C47/08 ,  B29K83/00 ,  B29K505/00 ,  B29K507/04 ,  B29K509/02 ,  B29K509/08

CPC classification number: C09K5/14 ,  B29C43/02 ,  B29C47/0019 ,  B29C47/004 ,  B29C47/0066 ,  B29C47/0869 ,  B29C2793/0027 ,  B29D7/01 ,  B29K2083/005 ,  B29K2505/00 ,  B29K2507/04 ,  B29K2509/02 ,  B29K2509/08 ,  B29K2995/0013 ,  C08J5/18 ,  C08J2383/04 ,  C08J2383/05 ,  C08J2383/07 ,  F28F21/02 ,  H01L21/4878 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.

公开(公告)号：US09922901B2

公开(公告)日：2018-03-20

申请号：US15521426

申请日：2015-10-27

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Hiroki Kanaya ,  Masahide Daimon

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/373 ,  B81B3/00

CPC classification number: H01L23/373 ,  B81B3/0081 ,  H01L23/3737 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

Abstract: A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.

公开(公告)号：US12233493B2

公开(公告)日：2025-02-25

申请号：US18276497

申请日：2022-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Mukasa ,  Yusuke Kubo ,  Keisuke Aramaki

IPC: B23P15/26 ,  B29C43/00 ,  B29C43/56 ,  F28F3/00

Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.

公开(公告)号：US20220240411A1

公开(公告)日：2022-07-28

申请号：US17595453

申请日：2021-05-13

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke MUKASA ,  Yusuke Kubo ,  Keisuke Aramaki

IPC: H05K7/20 ,  C09K5/14 ,  C08K13/04

Abstract: A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.

公开(公告)号：US10336929B2

公开(公告)日：2019-07-02

申请号：US14404741

申请日：2013-07-05

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki

IPC: C09K5/14 ,  B29C48/07 ,  B29C48/00 ,  C08J5/18 ,  H05K7/20 ,  H01L23/373 ,  H01L21/48 ,  B29D7/01 ,  F28F21/02 ,  B29C43/02 ,  B29C48/25 ,  B29K83/00 ,  B29K505/00 ,  B29K507/04 ,  B29K509/02 ,  B29K509/08

Abstract: A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body and the radiator when the heat conductive sheet is disposed therebetween. The method includes: a step (A) of dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; a step (C) of slicing the formed molded block into a sheet; and a step (D) of pressing the sliced surface of the obtained sheet.

公开(公告)号：US20190035712A1

公开(公告)日：2019-01-31

申请号：US16072671

申请日：2017-01-13

Applicant: Dexerials Corporation

Inventor： Hiroki Kanaya ,  Shinichi Uchida ,  Shunsuke Uchida ,  Gupta Rishabh ,  Keisuke Aramaki

IPC: H01L23/373 ,  H01L23/367

Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

公开(公告)号：US09560791B2

公开(公告)日：2017-01-31

申请号：US14898858

申请日：2014-06-27

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shinichi Uchida ,  Masahiko Ito

IPC: B32B3/00 ,  H05K7/20 ,  H01L23/373 ,  H01L23/42 ,  B29C65/00 ,  B29C69/00 ,  B32B25/08 ,  B32B27/28 ,  B32B37/10 ,  B32B38/00 ,  F28F13/18 ,  F28F21/02 ,  H01L23/433 ,  H01L21/48 ,  B29K683/00 ,  B29L31/18 ,  B29L31/34

CPC classification number: H05K7/20481 ,  B29C65/002 ,  B29C66/45 ,  B29C69/001 ,  B29K2683/00 ,  B29K2995/0013 ,  B29L2031/18 ,  B29L2031/3481 ,  B32B25/08 ,  B32B27/283 ,  B32B37/10 ,  B32B38/0004 ,  B32B2250/24 ,  B32B2307/302 ,  B32B2383/00 ,  B32B2457/00 ,  F28F13/18 ,  F28F21/02 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K7/2049 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

Abstract translation: 提供一种具有改进的粘附性和导热性的导热片的制造方法。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片材，得到成型品片材，并压制成型品片材。

公开(公告)号：US09437521B2

公开(公告)日：2016-09-06

申请号：US14989686

申请日：2016-01-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii ,  Masahiko Ito ,  Shinichi Uchida ,  Atsuya Yoshinari ,  Syunsuke Uchida

IPC: H01L23/48 ,  H01L23/373 ,  H01L23/367 ,  B29C47/00 ,  B29L31/18

CPC classification number: H01L23/3737 ,  B29C47/0066 ,  B29L2031/18 ,  C08L83/00 ,  H01L23/3675 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract translation: 一种导热片，其包含可固化树脂组合物，导热纤维和导热颗粒，其中导热片的压缩率为40％以上。

公开(公告)号：US09365001B2

公开(公告)日：2016-06-14

申请号：US14323423

申请日：2014-07-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki Usui ,  Keisuke Aramaki

IPC: B29D7/01 ,  B29D7/00 ,  B06B1/00 ,  B29C47/00 ,  C08J5/18 ,  H01L23/373 ,  C08K7/06 ,  C08L83/04 ,  C08K3/22 ,  C08L83/14 ,  B26D1/08 ,  B26D7/08 ,  B26D3/28 ,  C08K7/18 ,  B29C35/02 ,  B29C47/10 ,  B29C47/88 ,  B29C70/62 ,  B29C70/14 ,  C08K3/04 ,  C08G77/12 ,  C08G77/20 ,  C08K5/56 ,  B29K509/00 ,  B29L7/00 ,  B29L31/18

CPC classification number: B29D7/01 ,  B26D1/08 ,  B26D3/28 ,  B26D7/086 ,  B29C35/02 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/1027 ,  B29C47/8805 ,  B29C70/14 ,  B29C70/62 ,  B29K2509/00 ,  B29K2883/00 ,  B29K2995/0013 ,  B29K2995/0044 ,  B29K2995/0073 ,  B29L2007/00 ,  B29L2031/18 ,  C08G77/12 ,  C08G77/20 ,  C08J5/18 ,  C08J2383/04 ,  C08J2383/05 ,  C08J2383/07 ,  C08K3/04 ,  C08K3/22 ,  C08K5/56 ,  C08K7/06 ,  C08K7/18 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/005 ,  C08L83/04 ,  C08L83/14 ,  C08L2205/025 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/8385 ,  H01L2924/0002 ,  Y10T428/24 ,  Y10T428/24355 ,  Y10T428/24488 ,  Y10T428/24777 ,  Y10T428/268 ,  C08L83/00 ,  H01L2924/00

Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.