公开(公告)号：US09437521B2

公开(公告)日：2016-09-06

申请号：US14989686

申请日：2016-01-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii ,  Masahiko Ito ,  Shinichi Uchida ,  Atsuya Yoshinari ,  Syunsuke Uchida

IPC: H01L23/48 ,  H01L23/373 ,  H01L23/367 ,  B29C47/00 ,  B29L31/18

CPC classification number: H01L23/3737 ,  B29C47/0066 ,  B29L2031/18 ,  C08L83/00 ,  H01L23/3675 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract translation: 一种导热片，其包含可固化树脂组合物，导热纤维和导热颗粒，其中导热片的压缩率为40％以上。

公开(公告)号：US20160118316A1

公开(公告)日：2016-04-28

申请号：US14989686

申请日：2016-01-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii ,  Masahiko Ito ,  Shinichi Uchida ,  Atsuya Yoshinari ,  Syunsuke Uchida

IPC: H01L23/373 ,  B29C47/00 ,  H01L23/367

CPC classification number: H01L23/3737 ,  B29C47/0066 ,  B29L2031/18 ,  C08L83/00 ,  H01L23/3675 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract translation: 一种导热片，其包含可固化树脂组合物，导热纤维和导热颗粒，其中导热片的压缩率为40％以上。

公开(公告)号：US09966324B2

公开(公告)日：2018-05-08

申请号：US14892724

申请日：2014-06-18

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shin-ichi Uchida ,  Masahiko Ito ,  Syunsuke Uchida

IPC: H01L23/373 ,  H01L21/48 ,  C09K5/14 ,  B29C47/00 ,  B29C47/88 ,  B29C35/08

CPC classification number: H01L23/3737 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/8805 ,  B29C2035/0822 ,  B29K2995/0013 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.