公开(公告)号：US09966324B2

公开(公告)日：2018-05-08

申请号：US14892724

申请日：2014-06-18

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shin-ichi Uchida ,  Masahiko Ito ,  Syunsuke Uchida

IPC: H01L23/373 ,  H01L21/48 ,  C09K5/14 ,  B29C47/00 ,  B29C47/88 ,  B29C35/08

CPC classification number: H01L23/3737 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/8805 ,  B29C2035/0822 ,  B29K2995/0013 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.

公开(公告)号：US09560791B2

公开(公告)日：2017-01-31

申请号：US14898858

申请日：2014-06-27

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shinichi Uchida ,  Masahiko Ito

IPC: B32B3/00 ,  H05K7/20 ,  H01L23/373 ,  H01L23/42 ,  B29C65/00 ,  B29C69/00 ,  B32B25/08 ,  B32B27/28 ,  B32B37/10 ,  B32B38/00 ,  F28F13/18 ,  F28F21/02 ,  H01L23/433 ,  H01L21/48 ,  B29K683/00 ,  B29L31/18 ,  B29L31/34

CPC classification number: H05K7/20481 ,  B29C65/002 ,  B29C66/45 ,  B29C69/001 ,  B29K2683/00 ,  B29K2995/0013 ,  B29L2031/18 ,  B29L2031/3481 ,  B32B25/08 ,  B32B27/283 ,  B32B37/10 ,  B32B38/0004 ,  B32B2250/24 ,  B32B2307/302 ,  B32B2383/00 ,  B32B2457/00 ,  F28F13/18 ,  F28F21/02 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K7/2049 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

Abstract translation: 提供一种具有改进的粘附性和导热性的导热片的制造方法。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片材，得到成型品片材，并压制成型品片材。

公开(公告)号：US09437521B2

公开(公告)日：2016-09-06

申请号：US14989686

申请日：2016-01-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii ,  Masahiko Ito ,  Shinichi Uchida ,  Atsuya Yoshinari ,  Syunsuke Uchida

IPC: H01L23/48 ,  H01L23/373 ,  H01L23/367 ,  B29C47/00 ,  B29L31/18

CPC classification number: H01L23/3737 ,  B29C47/0066 ,  B29L2031/18 ,  C08L83/00 ,  H01L23/3675 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract translation: 一种导热片，其包含可固化树脂组合物，导热纤维和导热颗粒，其中导热片的压缩率为40％以上。

公开(公告)号：US10106672B2

公开(公告)日：2018-10-23

申请号：US14401954

申请日：2013-07-05

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii

IPC: C08K7/06 ,  C08L83/04 ,  C08K3/22 ,  C08K3/28 ,  C08K7/18 ,  H01L23/373 ,  C08J5/04

Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are not oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.

公开(公告)号：US20160118316A1

公开(公告)日：2016-04-28

申请号：US14989686

申请日：2016-01-06

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii ,  Masahiko Ito ,  Shinichi Uchida ,  Atsuya Yoshinari ,  Syunsuke Uchida

IPC: H01L23/373 ,  B29C47/00 ,  H01L23/367

CPC classification number: H01L23/3737 ,  B29C47/0066 ,  B29L2031/18 ,  C08L83/00 ,  H01L23/3675 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract translation: 一种导热片，其包含可固化树脂组合物，导热纤维和导热颗粒，其中导热片的压缩率为40％以上。

公开(公告)号：US09536804B2

公开(公告)日：2017-01-03

申请号：US14899221

申请日：2014-06-27

Applicant: Dexerials Corporation

Inventor： Keisuke Aramaki ,  Atsuya Yoshinari ,  Takuhiro Ishii ,  Shinichi Uchida ,  Masahiko Ito

IPC: F28F13/18 ,  H01L23/373 ,  F28F21/02 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/3737 ,  F28F21/02 ,  H01L21/4871 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).

Abstract translation: 提供一种制造导热片的方法，其本身具有粘性并且由于对发热体和散热器的粘附性的改善而具有降低的耐热性，并且可以暂时固定而不需要使用粘合剂等 。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片状物，用片材主体（7）渗出的粘合剂树脂的未固化成分（8）涂布片主体（7）的整个表面。

公开(公告)号：US20150166771A1

公开(公告)日：2015-06-18

申请号：US14401954

申请日：2013-07-05

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii

IPC: C08K7/06 ,  C08K3/28 ,  C08K3/22

CPC classification number: C08K7/06 ,  C08J5/042 ,  C08J2383/02 ,  C08K3/22 ,  C08K3/28 ,  C08K7/18 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/003 ,  C08L83/04 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.

Abstract translation: 提供了一种导热片，其中纤维填料之间的接触频率高。 在导热片中，纤维状填料的露出端部不会露出而嵌入片材，不需要施加可能干扰发热体和散热器正常工作的负荷 发热体和散热器。 导热片含有纤维状填料和粘合剂树脂，所有纤维状填料中的导热性片的厚度方向的纤维填料的比例为45〜95％。