Abstract:
The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.
Abstract:
A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.
Abstract:
A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.
Abstract:
A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.
Abstract:
The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.
Abstract:
The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.
Abstract:
An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material.
Abstract:
A ceramic component includes a ceramic main body having at least one metallization on at least one exterior surface of the main body and at least one electric inlet lead in electrical contact with the metallization, and an inner protective layer and an outer protective layer that encapsulates the component, wherein the inner protective layer includes at least one material selected from the group consisting of phosphonates (SAMP), silanes, Parylenes and combinations thereof, and the inner protective layer a) contains at least first functional groups via which covalent chemical bonding to at least the ceramic main body is effected and/or b) has been deposited by chemical vapor deposition.
Abstract:
A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.