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11.发明申请Temperature Sensor System and Method for Producing a Temperature Sensor System 有权温度传感器系统和温度传感器系统的制作方法公开(公告)号：US20160290872A1
公开(公告)日：2016-10-06
申请号：US14442357
申请日：2013-09-27
Applicant: EPCOS AG
Inventor： Jan Ihle , Oliver Bard , Gerald Kloiber
Abstract: The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.
Abstract translation: 本发明涉及一种温度传感器系统，包括第一陶瓷壳体部分，其包括套筒形下部，第一下端具有第一开口，第二上端具有第二开口，上部连接到第二上部 结束。 温度传感器系统还包括温度探针元件，其至少部分地布置在下部，并且具有陶瓷传感器元件壳体，布置在传感器元件壳体中的传感器元件和电源线。 传感器元件壳体至少部分地布置在第一开口中。 陶瓷传感器元件壳体具有比第一陶瓷壳体部分更高的热导率。 还公开了一种用于生产温度传感器系统的方法。
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公开(公告)号：US20160013112A1
公开(公告)日：2016-01-14
申请号：US14766405
申请日：2013-11-20
Applicant: EPCOS AG
Inventor： Jan Ihle , Bernhard Ostrick , Wolfgang Schreiber-Prillwitz
CPC classification number: H01L23/291 , B81B7/0048 , B81B2207/012 , B81B2207/097 , B81C1/0023 , G01D11/245 , G01D11/30 , H01L21/56 , H01L2924/0002 , H01L2924/00
Abstract: A sensor system includes a sensor chip mounted on a mounting receptacle of a ceramic housing body. The housing body is shaped three-dimensionally and embodied monolithically and is formed by a ceramic material having a coefficient of thermal expansion which deviates from the coefficient of thermal expansion of the sensor chip by less than 30% in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
Abstract translation: 传感器系统包括安装在陶瓷壳体主体的安装座上的传感器芯片。 壳体主体是三维成形的并且整体地成形并且由在大于或等于的温度范围内具有偏离传感器芯片的热膨胀系数的热膨胀系数的陶瓷材料形成的温度小于30％ 至-40℃且小于或等于150℃
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公开(公告)号：US10908030B2
公开(公告)日：2021-02-02
申请号：US15773156
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Jan Ihle , Anke Weidenfelder , Christl Lisa Mead , Gerald Kloiber
IPC: G01K7/22 , G01K7/16 , B28B3/02 , B28B11/24 , H01C7/04 , H01C17/28 , G01K7/18 , H01C7/00 , H01C17/08 , H01C17/12 , H01C17/075
Abstract: A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.
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公开(公告)号：US10132689B2
公开(公告)日：2018-11-20
申请号：US14442333
申请日：2013-09-27
Applicant: EPCOS AG
Inventor： Jan Ihle , Oliver Bard , Steffen Mehlig , Wolfgang Grundmann
Abstract: The invention relates to a temperature sensor system comprising a temperature probe element and a first ceramic housing part. The temperature probe element comprises a sensor element and electrical feed lines. The first ceramic housing part comprises a sleeve-shaped lower part with a closed lower end and an open upper end, and an upper part connected to the open upper end. The sensor element is arranged in the sleeve-shaped lower part. The upper part has recesses in which the electrical feed lines are partially arranged and guided. The lower part and the upper part form one piece. Also disclosed is a method for producing a temperature sensor system.
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Patent Agency Ranking
公开(公告)号：US20180321091A1
公开(公告)日：2018-11-08
申请号：US15773156
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Jan Ihle , Anke Weidenfelder , Christl Lisa Mead , Gerald Kloiber
CPC classification number: G01K7/22 , B28B3/02 , B28B11/243 , G01K7/16 , G01K7/18 , H01C7/008 , H01C7/043 , H01C17/075 , H01C17/281
Abstract: A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.
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公开(公告)号：US20170162303A1
公开(公告)日：2017-06-08
申请号：US15327995
申请日：2015-07-14
Applicant: EPCOS AG
Inventor： Heinz Strallhofer , Lutz Kirsten , Gerald Kloiber , Danilo Neuber , Jan Ihle
CPC classification number: H01C1/1413 , G01K1/08 , G01K7/22 , H01C7/008
Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.
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公开(公告)号：US20170089796A1
公开(公告)日：2017-03-30
申请号：US15379018
申请日：2016-12-14
Applicant: Epcos AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , C04B35/626 , G01L19/04 , C04B35/185 , G01L19/06 , G01L19/00
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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公开(公告)号：US20160299011A1
公开(公告)日：2016-10-13
申请号：US14442346
申请日：2013-09-27
Applicant: EPCOS AG
Inventor： Jan Ihle , Gerald Kloiber
Abstract: The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.
Abstract translation: 本发明涉及包括两个第一陶瓷板，布置在第一陶瓷板之间的第二陶瓷板和两个第三陶瓷板的温度探针。 两个第一陶瓷板中的每一个包括在其中布置有NTC传感器元件的开口。 在第二陶瓷板和每个第一陶瓷板之间布置有电极。 第一和第二陶瓷板布置在两个第三陶瓷板之间。 电极布置在每个第三陶瓷板和第一陶瓷板之间。 每个电极与NTC传感器元件电接触。 每个NTC传感器元件由陶瓷板封闭。 第一，第二和第三陶瓷板和NTC传感器元件被烧结以形成陶瓷体。 本发明还涉及一种用于生产温度探针的方法。
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公开(公告)号：US20160265979A1
公开(公告)日：2016-09-15
申请号：US14442365
申请日：2013-09-27
Applicant: EPCOS AG
Inventor： Jan Ihle , Gerald Kloiber
Abstract: The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.
Abstract translation: 本发明涉及一种温度探头，其包括功能陶瓷探针元件和陶瓷壳体。 探针元件安装在陶瓷壳体中，使得探针元件的表面与陶瓷壳体具有直接和形状配合的接触。 本发明还涉及一种用于生产温度探针的方法。
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