公开(公告)号：US20170290156A1

公开(公告)日：2017-10-05

申请号：US15084046

申请日：2016-03-29

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H05K1/18 ,  H01L23/498 ,  H03H7/38 ,  H01L23/522

CPC classification number: H05K1/18 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5226 ,  H01L23/5227 ,  H03H1/00 ,  H03H7/38 ,  H05K1/165

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.

公开(公告)号：US20150371756A1

公开(公告)日：2015-12-24

申请号：US14746994

申请日：2015-06-23

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu

IPC: H01F27/28 ,  H01F27/29 ,  H01F1/14 ,  H01F1/147 ,  H01F27/24 ,  H01F27/32

CPC classification number: H01F27/24 ,  H01F1/14708 ,  H01F13/003 ,  H01F17/0013 ,  H01F17/04 ,  H01F17/062 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2895 ,  H01F27/38 ,  H01F41/06 ,  H01F41/14 ,  H01F2017/0066 ,  H01L28/10

Abstract: Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.

Abstract translation: 包括用于磁偏置的各向异性介质和偏置线圈的感应元件以及用于微电子学等应用的制造和操作方法。 施加通过偏置线圈的电流产生偏置磁性材料的磁场，使得在整个磁芯上实现各向异性的理想取向，并且能够调制器件的感应响应。 耦合到互连件的电导体磁耦合到磁芯层以产生自身和/或互感器。

公开(公告)号：US10347709B2

公开(公告)日：2019-07-09

申请号：US15419562

申请日：2017-01-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01F7/06 ,  H01L49/02 ,  H01L23/522 ,  H01L21/3205 ,  H01L21/288 ,  H01F27/28 ,  H01F41/04 ,  H01F17/00 ,  H01F41/26

Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.

公开(公告)号：US09781834B1

公开(公告)日：2017-10-03

申请号：US15408096

申请日：2017-01-17

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L23/49 ,  H05K1/18 ,  H01L23/522 ,  H01L23/498 ,  H01F27/28 ,  H03H7/38

CPC classification number: H03H7/38 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2823 ,  H01L23/49822 ,  H01L23/5227 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086 ,  Y02P70/611

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.