公开(公告)号：US20190239344A1

公开(公告)日：2019-08-01

申请号：US16375947

申请日：2019-04-05

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K3/06 ,  H05K3/28 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/0038 ,  H05K3/0044 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/093 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/107

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

公开(公告)号：US20190239343A1

公开(公告)日：2019-08-01

申请号：US16375944

申请日：2019-04-05

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K3/06 ,  H05K3/28 ,  H05K1/11

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

公开(公告)号：US10362675B2

公开(公告)日：2019-07-23

申请号：US15923048

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K1/03 ,  H05K3/46

Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.

公开(公告)号：US10299375B2

公开(公告)日：2019-05-21

申请号：US15923017

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K3/28

Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.

公开(公告)号：US20180206332A1

公开(公告)日：2018-07-19

申请号：US15923048

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K1/0225 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0044 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09327

Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.