公开(公告)号：US20220104353A1

公开(公告)日：2022-03-31

申请号：US17488373

申请日：2021-09-29

Applicant: IBIDEN CO., LTD.

Inventor： Yasuki KIMISHIMA ,  Satoru KAWAI

IPC: H05K1/11 ,  H05K1/02

Abstract: A wiring substrate includes an insulating layer having a through hole, a first conductor layer formed on a first surface of the insulating layer, a second conductor layer formed on a second surface of the insulating layer, an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers, and a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole. The interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 μm to 2000 μm in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.

公开(公告)号：US20210159010A1

公开(公告)日：2021-05-27

申请号：US17102878

申请日：2020-11-24

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI ,  Yasuki KIMISHIMA

IPC: H01F27/28 ,  H01F27/255 ,  H01F41/24 ,  H01F41/04 ,  H01L23/498 ,  H01L23/64 ,  H01L21/48

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.

公开(公告)号：US20230030601A1

公开(公告)日：2023-02-02

申请号：US17815575

申请日：2022-07-28

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI

IPC: H05K3/42 ,  H05K3/26 ,  H05K3/06 ,  C25D5/02 ,  C25D5/34 ,  C25D5/48 ,  C25D3/38 ,  H05K3/10

Abstract: A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

公开(公告)号：US20220369457A1

公开(公告)日：2022-11-17

申请号：US17744069

申请日：2022-05-13

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: A printed wiring board includes a resin insulating layer, pads formed on the resin insulating layer, an uppermost resin insulating layer formed on the resin insulating layer such that the uppermost resin insulating layer is covering the pads and has openings exposing the pads, respectively, via conductors formed in the uppermost resin insulating layer such that the via conductors are formed on the pads exposed from the openings in the uppermost resin insulating layer, respectively, and metal posts formed on the via conductors such that each of the metal posts has a portion on a surface of the uppermost resin insulating layer around the via conductors and a side surface having a flared bottom extending toward the uppermost resin insulating layer.

公开(公告)号：US20210251087A1

公开(公告)日：2021-08-12

申请号：US17158500

申请日：2021-01-26

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI ,  Yasuki KIMISHIMA

IPC: H05K3/42 ,  H05K3/46 ,  H05K1/11

Abstract: A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.

公开(公告)号：US20210183562A1

公开(公告)日：2021-06-17

申请号：US17106225

申请日：2020-11-30

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI

IPC: H01F27/28 ,  H01F41/24 ,  H01F41/04 ,  H01L23/498 ,  H01L23/64 ,  H01L21/48

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.

公开(公告)号：US20150216050A1

公开(公告)日：2015-07-30

申请号：US14680463

申请日：2015-04-07

Applicant: IBIDEN CO., LTD.

Inventor： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/112 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/113 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Abstract translation: 印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘 并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。 垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。