公开(公告)号：US20240196546A1

公开(公告)日：2024-06-13

申请号：US18537853

申请日：2023-12-13

Applicant: IBIDEN CO., LTD.

Inventor： Jun SAKAI ,  Takuya INISHI

IPC: H05K3/42 ,  H05K3/46

CPC classification number: H05K3/423 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2203/068 ,  H05K2203/0723

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers, and via conductors formed in via holes of the resin insulating layers and each including a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors connect the conductor layers adjacent to each other and that the via conductors include a first via conductor and a second via conductor formed on the first via conductor in a lamination direction of the laminate. The resin insulating layers include resin and inorganic particles such that the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the resin insulating layers and that an inner wall surface of each of the via holes in the resin insulating layers includes the resin and the smooth surfaces of the first inorganic particles.

公开(公告)号：US20240107684A1

公开(公告)日：2024-03-28

申请号：US18475276

申请日：2023-09-27

Applicant: IBIDEN CO., LTD.

Inventor： Jun SAKAI ,  Takuya INISHI ,  Susumu KAGOHASHI

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/16

CPC classification number: H05K3/4608 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/095

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

公开(公告)号：US20230422406A1

公开(公告)日：2023-12-28

申请号：US18338737

申请日：2023-06-21

Applicant: IBIDEN CO., LTD.

Inventor： Takuya INISHI

IPC: H05K3/38 ,  H05K3/18

CPC classification number: H05K3/387 ,  H05K3/188 ,  H05K3/429

Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including one or more conductor circuits, an insulating adhesive layer covering a surface of the conductor layer and a part or parts of the insulating layer exposed from the conductor layer, and a resin insulating layer formed on the insulating layer and the conductor layer such that the insulating adhesive layer is sandwiched between the conductor layer and the resin insulating layer. The insulating adhesive layer includes a first portion covering an upper surface of the one or more conductor circuits and a second portion covering a side surface of the one or more conductor circuits and a thickness of the first portion is greater than a thickness of the second portion.