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公开(公告)号：US20250048562A1
公开(公告)日：2025-02-06
申请号：US18789154
申请日：2024-07-30
Applicant: IBIDEN CO., LTD.
Inventor： Masashi KUWABARA , Susumu KAGOHASHI , Jun SAKAI , Kyohei YOSHIKAWA , Takuya INISHI
Abstract: A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor, a resin insulating layer having an opening extending through the resin insulating layer, a conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor formed in the opening such that the via conductor electrically connects to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The resin insulating layer includes resin and inorganic particles including first and second particles such that the first particles are partially embedded in the resin and that the second particles are embedded in the resin, the first particles have first portions protruding from the resin and second portions embedded in the resin respectively, the surface includes the resin and exposed surfaces of the first portions exposed from the resin.
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公开(公告)号：US20240206064A1
公开(公告)日：2024-06-20
申请号：US18537920
申请日：2023-12-13
Applicant: IBIDEN CO., LTD.
Inventor： Jun SAKAI , Takuya INISHI
CPC classification number: H05K1/115 , H05K1/188 , H05K3/423 , H05K2201/10015
Abstract: A printed wiring board includes a base substrate, an electronic component accommodated in a cavity formed in the substrate, a resin insulating layer formed on the substrate such that the insulating layer is covering the electronic component, a conductor layer formed on the insulating layer, and via conductors formed in the insulating layer and each including a seed layer and an electrolytic plating layer formed on the seed layer such that the via conductors are connecting the conductor layer and electrodes of the electronic component. The insulating layer includes resin and inorganic particles and has via holes in which the via conductors is formed respectively such the inorganic particles include first inorganic particles having smooth surfaces and second inorganic particles embedded in the insulating layer and that an inner wall surface of each of the via holes includes the resin and the smooth surfaces of the first inorganic particles.
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公开(公告)号：US20240306299A1
公开(公告)日：2024-09-12
申请号：US18595674
申请日：2024-03-05
Applicant: IBIDEN CO., LTD.
Inventor： Toshiki FURUTANI , Kyohei YOSHIKAWA , Takuya INISHI , Jun SAKAI
CPC classification number: H05K1/116 , H05K1/0306 , H05K3/181 , H05K3/16 , H05K2201/032 , H05K2201/09536
Abstract: A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is connected to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is formed in a through hole penetrating through the glass substrate, and the conductor layer and via conductor are formed such that the seed layer is formed by sputtering and includes an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium.
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公开(公告)号：US20240107685A1
公开(公告)日：2024-03-28
申请号：US18475288
申请日：2023-09-27
Applicant: IBIDEN CO., LTD.
Inventor： Susumu KAGOHASHI , Jun SAKAI , Kyohei YOSHIKAWA , Takuya INISHI
CPC classification number: H05K3/4688 , H05K1/0306 , H05K1/0313 , H05K1/116 , H05K3/062 , H05K3/16 , H05K3/4608 , H05K2201/0209 , H05K2201/0212 , H05K2201/0338 , H05K2203/0369
Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.
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公开(公告)号：US20240389231A1
公开(公告)日：2024-11-21
申请号：US18661198
申请日：2024-05-10
Applicant: IBIDEN CO., LTD.
Inventor： Masashi KUWABARA , Jun SAKAI , Takuya INISHI
Abstract: A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer. Shapes of the first inorganic particles are different from shapes of the second inorganic particles.
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Patent Agency Ranking
公开(公告)号：US20240243049A1
公开(公告)日：2024-07-18
申请号：US18414955
申请日：2024-01-17
Applicant: IBIDEN CO., LTD.
Inventor： Toshiki FURUTANI , Masashi KUWABARA , Jun SAKAI , Takuya INISHI
IPC: H01L23/498 , H01L21/48
CPC classification number: H01L23/49822 , H01L21/4857 , H01L23/49894
Abstract: A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.
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公开(公告)号：US20230276570A1
公开(公告)日：2023-08-31
申请号：US18173154
申请日：2023-02-23
Applicant: IBIDEN CO., LTD.
Inventor： Jun SAKAI , Takuya INISHI
CPC classification number: H05K1/0298 , H05K1/115 , H05K3/0094 , H05K3/4644 , H05K2201/0212 , H05K2203/13
Abstract: A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
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公开(公告)号：US20240407094A1
公开(公告)日：2024-12-05
申请号：US18679521
申请日：2024-05-31
Applicant: IBIDEN CO., LTD.
Inventor： Masashi KUWABARA , Susumu KAGOHASHI , Jun SAKAI , Takuya INISHI , Kyohei YOSHIKAWA
Abstract: A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
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公开(公告)号：US20240306296A1
公开(公告)日：2024-09-12
申请号：US18599671
申请日：2024-03-08
Applicant: IBIDEN CO., LTD.
Inventor： Toshiki FURUTANI , Masashi KUWABARA , Jun SAKAI , Takuya INISHI
CPC classification number: H05K1/115 , H05K1/0306 , H05K3/16 , H05K2201/0209 , H05K2201/0245 , H05K2201/0323 , H05K2201/09536 , H05K2203/0361
Abstract: A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor formed in the glass substrate, a resin insulating layer formed on the core substrate and including resin and inorganic particles, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer such that the via conductor is electrically connected to the through-hole conductor formed in the glass substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The conductor layer and the via conductor are formed such that the seed layer is formed by sputtering, and the resin insulating layer has an opening in which the via conductor is formed such that the inorganic particles include first particles forming an inner wall surface in the opening and second particles embedded in the insulating layer.
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公开(公告)号：US20240292536A1
公开(公告)日：2024-08-29
申请号：US18585113
申请日：2024-02-23
Applicant: IBIDEN CO., LTD.
Inventor： Susumu KAGOHASHI , Kyohei YOSHIKAWA , Takuya INISHI , Jun SAKAI
CPC classification number: H05K1/116 , H05K1/09 , H05K3/0035 , H05K3/0041 , H05K3/423 , H05K1/0373 , H05K2201/0209
Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.
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