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公开(公告)号:US20200060024A1
公开(公告)日:2020-02-20
申请号:US16662118
申请日:2019-10-24
Applicant: Innolux Corporation
Inventor: Chin-Cheng Kuo , Chia-Chun Yang , Wen-Cheng Huang
Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.
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公开(公告)号:US10324251B2
公开(公告)日:2019-06-18
申请号:US15817756
申请日:2017-11-20
Applicant: InnoLux Corporation
Inventor: Li-Ling Chen , Chien-Chih Chen , Chia-Chun Yang , Chin-Cheng Kuo
Abstract: A display module is provided. The display module includes a backlight module with an upper surface, a display panel opposite to the backlight module, and a glue having a first contact surface and a second contact surface located between the display panel and the backlight module, wherein the first contact surface is in contact with the display panel, the second contact surface is in contact with the upper surface of the backlight module, and there is a gap between the display panel and the backlight module. A method for fabricating a display module is also provided.
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公开(公告)号:US12147119B2
公开(公告)日:2024-11-19
申请号:US17818771
申请日:2022-08-10
Applicant: InnoLux Corporation
Inventor: Wen-Cheng Huang , Ting-Sheng Chen , Chia-Chun Yang , Chin-Cheng Kuo
IPC: G02F1/13357
Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.
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公开(公告)号:US11889627B2
公开(公告)日:2024-01-30
申请号:US17223054
申请日:2021-04-06
Applicant: Innolux Corporation
Inventor: Chin-Cheng Kuo , Chia-Chun Yang , Wen-Cheng Huang
CPC classification number: H05K1/148 , H05K1/181 , H05K3/284 , H05K3/303 , H05K3/361 , H05K2201/041 , H05K2201/09027 , H05K2201/10106 , H05K2201/10128 , H05K2201/10522 , H05K2203/0126
Abstract: A display device includes a first substrate, a second substrate, a plurality of drive ICs and at least one flexible circuit board. The first substrate has a first region and a second region near to the first region. The second substrate is disposed on the first region and has a lateral side. The plurality of drive ICs are disposed on the second region and arranged along the lateral side. The at least one flexible circuit board is disposed on the second region and disposed correspondingly to the lateral side. Wherein in a top view of the display device, each of the plurality of drive ICs does not overlap with the at least one flexible circuit board in a direction perpendicular to an extending direction of the lateral side.
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公开(公告)号:US10976607B2
公开(公告)日:2021-04-13
申请号:US16699978
申请日:2019-12-02
Applicant: InnoLux Corporation
Inventor: Wen-Cheng Huang , Ting-Sheng Chen , Chia-Chun Yang , Chin-Cheng Kuo
IPC: G02F1/13357
Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.
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公开(公告)号:US10795200B2
公开(公告)日:2020-10-06
申请号:US16253867
申请日:2019-01-22
Applicant: InnoLux Corporation
Inventor: Chien-Chih Chen , Chia-Chun Yang , Chin-Cheng Kuo , Hsin-Tien Wu , Chih-Jen Chang
IPC: G02F1/1335 , G02F1/1333
Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.
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公开(公告)号:US10531563B2
公开(公告)日:2020-01-07
申请号:US15796917
申请日:2017-10-30
Applicant: Innolux Corporation
Inventor: Chin-Cheng Kuo , Chia-Chun Yang , Wen-Cheng Huang
Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.
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公开(公告)号:US20180164629A1
公开(公告)日:2018-06-14
申请号:US15832007
申请日:2017-12-05
Applicant: InnoLux Corporation
Inventor: Hung-Yi Lin , Chia-Chun Yang , Chin-Cheng Kuo
IPC: G02F1/1333 , G02F1/1335
CPC classification number: G02F1/133308 , G02F1/133305 , G02F1/1336 , G02F1/133602 , G02F2001/133317 , G02F2202/28
Abstract: A display device includes a display panel, a circuit connecting board, a plurality of passive components and a first insulation layer. The circuit connecting board is connected to the display panel and has a component configuration area. The passive components are disposed on the component configuration area and include a first passive component. The first insulation layer is disposed on the component configuration area and covers the first passive component. The adhesive can be applied on the component configuration area by an automatic dispensing machine, and the adhesive is solidified to form the first insulation layer for covering the passive components. This configuration can prevent the short circuit between the metal material and the components disposed on the component configuration area of the circuit connecting board, thereby benefitting in automatically manufacturing and decreasing the production cost.
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