DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200060024A1

    公开(公告)日:2020-02-20

    申请号:US16662118

    申请日:2019-10-24

    Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

    Electronic device
    13.
    发明授权

    公开(公告)号:US12147119B2

    公开(公告)日:2024-11-19

    申请号:US17818771

    申请日:2022-08-10

    Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

    Electronic device
    15.
    发明授权

    公开(公告)号:US10976607B2

    公开(公告)日:2021-04-13

    申请号:US16699978

    申请日:2019-12-02

    Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

    Display device
    16.
    发明授权

    公开(公告)号:US10795200B2

    公开(公告)日:2020-10-06

    申请号:US16253867

    申请日:2019-01-22

    Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.

    Display device
    17.
    发明授权

    公开(公告)号:US10531563B2

    公开(公告)日:2020-01-07

    申请号:US15796917

    申请日:2017-10-30

    Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.

    DISPLAY DEVICE
    18.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20180164629A1

    公开(公告)日:2018-06-14

    申请号:US15832007

    申请日:2017-12-05

    Abstract: A display device includes a display panel, a circuit connecting board, a plurality of passive components and a first insulation layer. The circuit connecting board is connected to the display panel and has a component configuration area. The passive components are disposed on the component configuration area and include a first passive component. The first insulation layer is disposed on the component configuration area and covers the first passive component. The adhesive can be applied on the component configuration area by an automatic dispensing machine, and the adhesive is solidified to form the first insulation layer for covering the passive components. This configuration can prevent the short circuit between the metal material and the components disposed on the component configuration area of the circuit connecting board, thereby benefitting in automatically manufacturing and decreasing the production cost.

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