公开(公告)号：US10999931B2

公开(公告)日：2021-05-04

申请号：US16662118

申请日：2019-10-24

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/28

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

公开(公告)号：US11835805B2

公开(公告)日：2023-12-05

申请号：US17664387

申请日：2022-05-20

Applicant: InnoLux Corporation

Inventor： Wen-Cheng Huang ,  Bi-Ly Lin ,  Chia-Chun Yang ,  Ying-Jung Wu ,  Chien-Wei Tseng

IPC: G02F1/1333

CPC classification number: G02F1/133305 ,  G02F1/133308 ,  G02F1/133345 ,  G02F2202/28

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

公开(公告)号：US11409162B2

公开(公告)日：2022-08-09

申请号：US17204379

申请日：2021-03-17

Applicant: InnoLux Corporation

Inventor： Wen-Cheng Huang ,  Ting-Sheng Chen ,  Chia-Chun Yang ,  Chin-Cheng Kuo

IPC: G02F1/13357

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

公开(公告)号：US20210227692A1

公开(公告)日：2021-07-22

申请号：US17223054

申请日：2021-04-06

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/28

Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

公开(公告)号：US20180146555A1

公开(公告)日：2018-05-24

申请号：US15796917

申请日：2017-10-30

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/148 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522 ,  H05K2203/0126

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.