公开(公告)号：US09659925B2

公开(公告)日：2017-05-23

申请号：US15089747

申请日：2016-04-04

Applicant: INNOLUX CORPORATION

Inventor： Yi-Ling Yu ,  Wei-Ching Cho ,  Hsia-Ching Chu ,  Peng-Cheng Huang ,  Yi-Hung Lin

IPC: H01L27/02 ,  H01L27/12

CPC classification number: H01L27/0288 ,  H01L27/1225 ,  H01L27/124

Abstract: A display panel includes a substrate, a first stacking unit, and a second stacking unit. The first stacking unit is disposed on the substrate and connected to a scan line. The first stacking unit includes a first conducting layer, a second conducting layer, at least one first through hole, and a first protruding portion. The first conducting layer is interposed between the second conducting layer and the substrate. The first through hole connects the first conducting layer and the second conducting layer. The position of the first protruding portion is relative to the position of the second protruding portion.

公开(公告)号：US20250157904A1

公开(公告)日：2025-05-15

申请号：US19019362

申请日：2025-01-13

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: A manufacturing method of a package device is provided. First, a carrier is provided, and then a conductive element is formed on the carrier. Thereafter, a conductive pad is formed on the conductive element. Next, a redistribution layer is formed on the conductive pad. Then, the carrier and at least a part of the conductive element are removed.

公开(公告)号：US20240381540A1

公开(公告)日：2024-11-14

申请号：US18779116

申请日：2024-07-22

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Hsiu-Yi Tsai ,  Chin-Lung Ting ,  Chung-Kuang Wei

IPC: H05K3/32 ,  H05K1/02

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding an electronic component to the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode, and the electronic component is electrically connected in series with another electronic component; applying a forward bias to the electronic component, and determining whether the electronic component is normal or failed based on a light emitted by the another electronic component or thermal characteristics of the electronic component; and transporting the substrate configured with the electronic component determined to be normal to a next production site or repairing the electronic component determined to be failed.

公开(公告)号：US20240297638A1

公开(公告)日：2024-09-05

申请号：US18663116

申请日：2024-05-14

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Chung-Le Chen ,  Shuo-Ting Hong ,  Yu-Ti Huang ,  Yu-Hsiang Chiu ,  Nai-Fang Hsu

IPC: H03K3/01 ,  H03K17/687

CPC classification number: H03K3/01 ,  H03K17/687

Abstract: Disclosed is an electronic device including a tunable element, a first power supply circuit, and a second power supply circuit. The first power supply circuit and the second power supply circuit are electrically connected to the tunable element. The first power supply circuit drives the tunable element during a first time period. The second power supply circuit drives the tunable element during a second time period.

公开(公告)号：US20240243069A1

公开(公告)日：2024-07-18

申请号：US18402654

申请日：2024-01-02

Applicant: Innolux Corporation

Inventor： Hsiu-Yi Tsai ,  Yi-Hung Lin ,  Nai-Fang Hsu

IPC: H01L23/538

CPC classification number: H01L23/5386 ,  H01L24/16 ,  H01L2224/16227

Abstract: An electronic device includes a substrate, a metal layer, a first dielectric layer, a first conductive circuit, and a driving chip. The metal layer is provided on the substrate and has a first opening. The first dielectric layer is provided on the metal layer. The first conductive circuit is provided on the first dielectric layer. The driving chip is provided on the first dielectric layer and electrically connected to the first conductive circuit. The first opening is adjacent to the driving chip. The first conductive circuit overlaps the first opening. The electronic device of the disclosure may reduce the risk of a short circuit between the conductive circuit and the metal layer below when performing patching, function analysis, or failure analysis.

公开(公告)号：US20240145461A1

公开(公告)日：2024-05-02

申请号：US18480511

申请日：2023-10-04

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Tong-Jung Wang ,  Wen-Chieh Lin ,  Ming-Chun Tseng ,  Yi-Hung Lin

IPC: H01L27/02

CPC classification number: H01L27/0248

Abstract: A modulation device includes a substrate, an electrostatic discharge protection element, an electronic element, and a driving element. The substrate has an active region. The electrostatic discharge protection element is arranged around the active region. The electronic element is disposed in the active region. The driving element is electrically connected to the electronic element.

公开(公告)号：US20230386387A1

公开(公告)日：2023-11-30

申请号：US18304337

申请日：2023-04-20

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Chih-Yung Hsieh ,  Hsiu-Yi Tsai

IPC: G09G3/20

CPC classification number: G09G3/2092 ,  G09G2300/0809 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2310/0248

Abstract: A modulating device with a short frame time is provided. The modulating device includes multiple modulators, multiple switches, and a driving circuit. Each of the modulators corresponds to each of the switches. The driving circuit drives the switches. The driving circuit drives switches of more than two rows among the switches within a time period.

公开(公告)号：US11790838B2

公开(公告)日：2023-10-17

申请号：US17947173

申请日：2022-09-19

Applicant: Innolux Corporation

Inventor： Kazuyuki Hashimoto ,  Yi-Hung Lin ,  Kung-Chen Kuo

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0852 ,  G09G2300/0861 ,  G09G2310/0267 ,  G09G2310/06 ,  G09G2310/08

Abstract: An electronic device is provided. The electronic device includes a pixel array, a gate driver and a bias control signal driver. The pixel array includes a pixel unit. The gate driver is configured to generate a plurality of gate control signals. The bias control signal driver is electrically connected to the pixel unit and the gate driver. The bias control signal driver is configured to generate a bias signal to drive the pixel unit according to a part of the plurality of gate control signals.

公开(公告)号：US20230261650A1

公开(公告)日：2023-08-17

申请号：US18161899

申请日：2023-01-31

Applicant: Innolux Corporation

Inventor： Hsiu-Yi Tsai ,  Yu-Ti Huang ,  Yu-Hsiang Chiu ,  Yi-Hung Lin

IPC: H03K17/56

CPC classification number: H03K17/56

Abstract: The disclosure provides an electrical apparatus, including a substrate, a plurality of gate driver units and a plurality of gate lines. The gate driver units are disposed on the substrate. The gate lines are disposed on the substrate. Each of the gate lines is respectively electrically connected to the corresponding gate driver unit. Each of the gate lines is configured to transmit a respective gate signal. The gate lines include a first gate line and a second gate line. The first gate line and the second gate line are configured to transmit the respective gate signals at a same time.

公开(公告)号：US20220386475A1

公开(公告)日：2022-12-01

申请号：US17742415

申请日：2022-05-12

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Hsiu-Yi Tsai ,  Chin-Lung Ting ,  Chung-Kuang Wei

IPC: H05K3/32 ,  H05K1/02

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or failed; and transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.