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    Cold plate architecture for liquid cooling of devices
    11.
    发明授权
    Cold plate architecture for liquid cooling of devices 有权

    公开(公告)号：US12133357B2

    公开(公告)日：2024-10-29

    申请号：US17123760

    申请日：2020-12-16

    Applicant: Intel Corporation

    Inventor： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

    IPC: H05K7/20

    CPC classification number: H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

    Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

    DIMM RETENTION ASSEMBLY FOR COMPRESSION MOUNT TECHNOLOGY AND LAND GRID ARRAY CONNECTOR LOADING
    13.
    发明申请
    DIMM RETENTION ASSEMBLY FOR COMPRESSION MOUNT TECHNOLOGY AND LAND GRID ARRAY CONNECTOR LOADING 有权

    公开(公告)号：US20210408724A1

    公开(公告)日：2021-12-30

    申请号：US17470646

    申请日：2021-09-09

    Applicant: Intel Corporation

    Inventor： Xiang Li ,  George Vergis ,  Phil Geng

    IPC: H01R13/627

    Abstract: Systems, apparatuses and methods may provide for technology including a memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an L-shaped load member extending through an opening in the first lever, a second lever coupled to the L-shaped load member via a second pivot point, and a spring to bias the L-shaped load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading,

    PINS FOR USE IN LAND GRID ARRAY
    14.
    发明申请
    PINS FOR USE IN LAND GRID ARRAY 有权

    公开(公告)号：US20250055217A1

    公开(公告)日：2025-02-13

    申请号：US18929426

    申请日：2024-10-28

    Applicant: Intel Corporation

    Inventor： Min Pei ,  Lejie Liu ,  Ralph Miele ,  Phil Geng ,  Steven Klein

    IPC: H01R13/24 ,  H01R12/71

    Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.

    Retention of dual in-line memory modules
    19.
    发明授权
    Retention of dual in-line memory modules 有权

    公开(公告)号：US10888010B2

    公开(公告)日：2021-01-05

    申请号：US16422854

    申请日：2019-05-24

    Applicant: Intel Corporation

    Inventor： Phil Geng ,  George Vergis ,  Xiang Li

    IPC: H05K7/12 ,  H05K1/11 ,  H05K7/10 ,  H05K7/14 ,  H01R12/73

    Abstract: Embodiments are directed towards apparatuses, methods, and systems for a memory module, e.g., a dual in-line memory module (DIMM) including a first lengthwise edge along the DIMM and a second lengthwise edge, opposite the first lengthwise edge, to couple the DIMM with a printed circuit board (PCB). In embodiments, the DIMM includes one or more notches along the first lengthwise edge, to removeably couple with one or more flexible supports located at least partially along a length or width of a chassis and to engage the notches to assist in retention of the DIMM in the chassis to reduce a shock and/or vibration associated with a load of a plurality of DIMMs on the PCB. In some embodiments, the one or more flexible supports are coupled to a support structure, such as a pole mounted or otherwise coupled to a panel of the chassis. Additional embodiments may be described and claimed.

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