公开(公告)号：US12055986B2

公开(公告)日：2024-08-06

申请号：US17187164

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

CPC classification number: G06F1/206 ,  H05K1/0272 ,  G06F2200/201

Abstract: A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

公开(公告)号：US20210208647A1

公开(公告)日：2021-07-08

申请号：US17187164

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

Abstract: A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

公开(公告)号：US11495518B2

公开(公告)日：2022-11-08

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L31/00 ,  H01L21/00 ,  H01L23/40 ,  H01L25/18 ,  H01L23/427

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US20200251403A1

公开(公告)日：2020-08-06

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L23/40 ,  H01L23/427 ,  H01L25/18

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US20240345639A1

公开(公告)日：2024-10-17

申请号：US18755226

申请日：2024-06-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

CPC classification number: G06F1/206 ,  H05K1/0272 ,  G06F2200/201

Abstract: Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.

公开(公告)号：US20230027076A1

公开(公告)日：2023-01-26

申请号：US17956612

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Eric Buddrius ,  Jeffory Smalley ,  Fernando Gonzalez Lenero ,  Francisco Javier Colorado Alonso ,  Fatima Elias Flores ,  Rolf Laido

IPC: H01L23/40 ,  H01L21/48 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

公开(公告)号：US12293956B2

公开(公告)日：2025-05-06

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin Yang ,  Jimmy Chuang ,  Xicai Jing ,  Yuan-Liang Li ,  Yuyang Xia ,  David Shia ,  Mohanraj Prabhugoud ,  Maria de la Luz Belmont ,  Oscar Farias Moguel ,  Andres Ramirez Macias ,  Javier Avalos Garcia ,  Jessica Gullbrand ,  Shaorong Zhou ,  Chia-Pin Chiu ,  Xiaojin Gu

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20240297119A1

公开(公告)日：2024-09-05

申请号：US18573116

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Srikant Nekkanty ,  Karumbu Meyyappan ,  Andres Ramirez Macias ,  Zhe Chen ,  Jeffory L. Smalley ,  Zhichao Zhang ,  Steven A. Klein ,  Eric Erike

IPC: H01L23/532 ,  H01L23/32 ,  H01L23/40 ,  H01L23/498 ,  H01L23/528

CPC classification number: H01L23/53209 ,  H01L23/32 ,  H01L23/4093 ,  H01L23/49811 ,  H01L23/5283

Abstract: An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.