公开(公告)号：US20040104640A1

公开(公告)日：2004-06-03

申请号：US10716750

申请日：2003-11-19

Applicant: Intel Corporation

Inventor： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

IPC: H02N002/00 ,  H01L041/04

CPC classification number: H03H9/174 ,  H03H3/02 ,  H03H2003/023 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49156

Abstract: A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.

Abstract translation: 在基板上形成膜体声波谐振器。 膜体声波谐振器包括具有靠近衬底的第一表面的压电材料层和远离衬底的第二表面。 沉积在压电材料的第一表面上的第一导电层包括具有与与第二部分相关联的表面不同的平面上的表面的第一部分。

公开(公告)号：US20040032705A1

公开(公告)日：2004-02-19

申请号：US10219013

申请日：2002-08-14

Applicant: Intel Corporation

Inventor： Qing Ma

IPC: H01H051/22

CPC classification number: H01H59/0009

Abstract: A microelectromechanical system (MEMS) switch that includes a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first portion and a second portion. The actuation electrode is positioned between the first and second portions of the signal contact.

Abstract translation: 一种微电子机械系统（MEMS）开关，其包括信号触点，致动电极和当电压施加到致动电极时接合信号触点的光束。 信号触点包括第一部分和第二部分。 致动电极位于信号触点的第一和第二部分之间。

公开(公告)号：US20030042117A1

公开(公告)日：2003-03-06

申请号：US09943451

申请日：2001-08-30

Applicant: Intel Corporation

Inventor： Qing Ma

IPC: H01H057/00

CPC classification number: B81B3/007 ,  B81B2201/014 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/056 ,  H01H1/20 ,  H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0036 ,  H01H2059/0063 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49082 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49147

Abstract: A microelectromechanical system (MEMS) switch having a high-resonance-frequency beam is disclosed. The MEMS switch includes first and second spaced apart electrical contacts, and an actuating electrode. The beam is adapted to establish contact between the electrodes via electrostatic deflection of the beam as induced by the actuating electrode. The beam may have a cantilever or bridge structure, and may be hollow or otherwise shaped to have a high resonant frequency. Methods of forming the high-speed MEMS switch are also disclosed.

Abstract translation: 公开了一种具有高共振频率波束的微机电系统（MEMS）开关。 MEMS开关包括第一和第二间隔开的电触头和致动电极。 光束适于通过由致动电极引起的光束的静电偏转来建立电极之间的接触。 梁可以具有悬臂或桥结构，并且可以是中空的或以其它方式成形为具有高共振频率。 还公开了形成高速MEMS开关的方法。

公开(公告)号：US20040032000A1

公开(公告)日：2004-02-19

申请号：US10218290

申请日：2002-08-14

Applicant: Intel Corporation

Inventor： Qing Ma

IPC: H01L029/82

CPC classification number: H01H1/0036 ,  H01H37/5409 ,  H01H2001/0042 ,  H01H2037/008

Abstract: A microelectromechanical system (MEMS) that includes a first electro-thermal actuator, a second electro-thermal actuator and a beam having a first side and a second side. The first electro-thermal actuator applies a force to the first side of the beam as current passes through the first electro-thermal actuator and the second electro-thermal actuator applies a force to the second side of the beam as current passes through the second electro-thermal actuator.

Abstract translation: 一种包括第一电热致动器，第二电热致动器和具有第一侧和第二侧的梁的微机电系统（MEMS）。 当电流通过第一电热致动器时，第一电热致动器向梁的第一侧施加力，并且当电流通过第二电热致动器时，第二电热致动器向梁的第二侧施加力 热致动器。

公开(公告)号：US20030112097A1

公开(公告)日：2003-06-19

申请号：US10109811

申请日：2002-03-28

Applicant: Intel Corporation

Inventor： Qing Ma ,  Li-Peng Wang ,  Valluri Rao

IPC: H03H009/56

CPC classification number: H03H9/172 ,  H03H3/02 ,  H03H9/586 ,  Y10T29/42

Abstract: A film bulk acoustic resonator is formed on a substrate having a major surface. The film bulk acoustic resonator includes an elongated stack. The elongated stack includes a layer of piezoelectric material positioned between a first conductive layer deposited on a first surface of the layer of piezoelectric material, and a second conductive layer deposited on a second surface of the layer of piezoelectric material. The elongated stack is positioned substantially perpendicular with respect to the major surface of the substrate. The first and second conductive layers are placed on the layer of piezoelectric material substantially simultaneously and in one processing step. The major surface of the substrate is in a horizontal plane and the stack of the film bulk acoustic resonator is in a substantially vertical plane. The resonator structure formed may be used either as a resonator or a filter.

Abstract translation: 在具有主表面的基板上形成膜体声波谐振器。 薄膜体声波谐振器包括细长的叠层。 细长堆叠包括一层位于压电材料层的第一表面上的第一导电层和沉积在该压电材料层的第二表面上的第二导电层之间的压电材料。 细长的堆叠被定位成相对于基底的主表面基本垂直。 第一和第二导电层基本上同时并在一个处理步骤中放置在压电材料层上。 衬底的主表面处于水平面，膜体声波谐振器的堆叠处于基本垂直的平面。 形成的谐振器结构可以用作谐振器或滤波器。

公开(公告)号：US20030077871A1

公开(公告)日：2003-04-24

申请号：US10246360

申请日：2002-09-17

Applicant: Intel Corporation

Inventor： Peng Cheng ,  Qing Ma

IPC: H01L021/20

CPC classification number: H01L23/5227 ,  H01L24/19 ,  H01L27/08 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/00

Abstract: The invention relates to a process of forming an on-chip package inductor. The process includes providing a substrate with at least one microelectronic device packaged therewith. As part of the inventive process, electrical communication is formed for the microelectronic device. The electrical communication includes at least two electrically conductive layers. As part of the inventive technology, the inductor is patterned on the substrate before, during, or after formation of the electrical communication. The inductor is connected to the at least one microelectronic device.

Abstract translation: 本发明涉及一种形成片上封装电感器的工艺。 该方法包括提供具有与其一起封装的至少一个微电子器件的衬底。 作为本发明方法的一部分，为微电子器件形成电通信。 电通信包括至少两个导电层。 作为本发明技术的一部分，电感器在形成电通信之前，期间或之后在衬底上图案化。 电感器连接到至少一个微电子器件。