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公开(公告)号：US20200306990A1
公开(公告)日：2020-10-01
申请号：US16806373
申请日：2020-03-02
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Babak Naderi , Richard Munro , Tatiana Pankova Major
IPC: B25J15/00 , B25J11/00 , H01L21/687
Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.
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公开(公告)号：US20240424688A1
公开(公告)日：2024-12-26
申请号：US18753634
申请日：2024-06-25
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Babak Naderi , Richard Munro , Tatiana Pankova Major
IPC: B25J15/00 , B25J11/00 , B25J19/02 , H01L21/687
Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.
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公开(公告)号：US20240174396A1
公开(公告)日：2024-05-30
申请号：US18071097
申请日：2022-11-29
Applicant: JABIL INC.
Inventor： Jeroen Bosboom
CPC classification number: B65B43/265 , B65B57/005 , B65B57/10
Abstract: An apparatus, system and method for a compact box opener suitable for opening a compact box containing therein a reticle. The embodiments provide: a flowthrough deck; a plurality of location guides on the flowthrough deck suitable to mate with guides on a base of the compact box; a plurality of vacuum ports on the plurality of location guides capable of retaining the guides on the base; a lid opening arm having a suction cup at an end thereof, wherein the suction cup is capable of gripping a lid of the compact box and opening the lid by an actuation of the lid opening arm; rotary-actuated arms that are raised for initial actuation within the drawer above a rim of the compact box and which, when actuated, rotate jaws at an end of each of the rotary-actuated arms inward over the rim and downward to a height below a lower plane of the reticle; and at least one angular notch in each of the jaws suitable to grip a radiused edge of the reticle. Once the radiused edge of the reticle is gripped by the inward movement of the jaws, the jaws are raised while the reticle remains gripped until the reticle is at a second height fully above the rim.
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公开(公告)号：US11566665B2
公开(公告)日：2023-01-31
申请号：US17706337
申请日：2022-03-28
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Babak Naderi , Payman Rahimi , Michael McKenney , Kwok Yu , George Kovatchev , Jeffrey Villegas , Ward Palmer , Jose Luna
Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics. The apparatus, system and method of providing at least a planar alignment of at least one component or device in relation to a secondary reference plane may include at least: a frame and stator assembly, having, at an upper portion thereof, at least a semi-spherical receiving interface; a movable assembly that moves within the frame and stator assembly, and that is connectively associated therewith by at least a plurality of springs; a semi-spherical stage, suitable for reception by the semi-spherical receiving interface and capable of at least rotational movement therewithin; a chuck within the semi-spherical stage and capable of at least co-planar, post-planar, and ante-planar positioning in relation to a plane provided by a topmost portion of the semispherical stage, wherein the chuck is capable of receiving the component or device; and at least two gripper jaws suitable for receiving and holding, at an upper portion thereof, the component or device, wherein the two gripper jaws comprise, at a lower portion thereof, at least ramps capable of physically interacting with ones of the motion stops.
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公开(公告)号：US20220016877A1
公开(公告)日：2022-01-20
申请号：US17299997
申请日：2019-12-04
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Michael McKenney , George Kovatchev
Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.
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Patent Agency Ranking
公开(公告)号：US10576639B2
公开(公告)日：2020-03-03
申请号：US15889410
申请日：2018-02-06
Applicant: Jabil Inc.
Inventor： Jeroen Bosboom , Babak Naderi , Richard Munro , Tatiana Pankova Major
IPC: H01L21/687 , B25J15/00 , B25J11/00
Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.
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公开(公告)号：US12070928B2
公开(公告)日：2024-08-27
申请号：US18208810
申请日：2023-06-12
Applicant: Jabil Inc.
Inventor： Jeroen Bosboom , Michael McKenney , George Kovatchev
CPC classification number: B32B37/0046 , B32B37/1018 , B32B41/00
Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.
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公开(公告)号：US20230398699A1
公开(公告)日：2023-12-14
申请号：US18034515
申请日：2021-12-16
Applicant: Jabil Inc.
Inventor： Jeroen Bosboom , Lucas Nielsen , Naderi Babak , Michael McKenney , Ward Palmer
CPC classification number: B25J15/0047 , B25J15/0052 , B25J15/0206 , B25J15/10 , B23P19/084
Abstract: An apparatus, system and method for providing an o-ring gripper. The embodiments may include an end effector, comprising: a housing; a movable stripping bar mechanically associated with the housing; a plurality of modules at least partially within the housing; and at least two interleaved angular jaws, wherein each of the at least two jaws provides at least two of the at least four fingers, and wherein an increase in angle between the at least two jaws effects an expansion of an area bounded by each of the at least four fingers; wherein a movement of the stripper bar distally from the housing strips the o-ring from the retention groove for placement.
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公开(公告)号：US11673382B2
公开(公告)日：2023-06-13
申请号：US17299997
申请日：2019-12-04
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Michael McKenney , George Kovatchev
CPC classification number: B32B37/0046 , B32B37/1018 , B32B41/00
Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.
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公开(公告)号：US20220143843A1
公开(公告)日：2022-05-12
申请号：US17374846
申请日：2021-07-13
Applicant: JABIL INC.
Inventor： Jeroen Bosboom , Babak Naderi , Richard Munro , Tatiana Pankova Major
IPC: B25J15/00 , B25J11/00 , H01L21/687
Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.
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