公开(公告)号：US12042930B2

公开(公告)日：2024-07-23

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J11/00 ,  B25J15/00 ,  B25J19/02

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US10518422B2

公开(公告)日：2019-12-31

申请号：US15964365

申请日：2018-04-27

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J15/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20240424688A1

公开(公告)日：2024-12-26

申请号：US18753634

申请日：2024-06-25

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  B25J19/02 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US10576639B2

公开(公告)日：2020-03-03

申请号：US15889410

申请日：2018-02-06

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11602859B2

公开(公告)日：2023-03-14

申请号：US17374846

申请日：2021-07-13

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11027437B2

公开(公告)日：2021-06-08

申请号：US16726396

申请日：2019-12-24

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J15/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20180311832A1

公开(公告)日：2018-11-01

申请号：US15964365

申请日：2018-04-27

Applicant: Jabil Inc.

Inventor： Jeroen BOSBOOM ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/06 ,  H01L21/687 ,  H01L21/683 ,  B25J15/00

CPC classification number: B25J15/0683 ,  B25J15/0014 ,  B25J15/0616 ,  B25J15/0691 ,  H01L21/6838 ,  H01L21/68707

Abstract: The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20220143843A1

公开(公告)日：2022-05-12

申请号：US17374846

申请日：2021-07-13

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20200206954A1

公开(公告)日：2020-07-02

申请号：US16726396

申请日：2019-12-24

Applicant: JABIL INC.

Inventor： Jeroen BOSBOOM ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/06 ,  B25J15/00 ,  H01L21/683 ,  H01L21/687

Abstract: The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20180161989A1

公开(公告)日：2018-06-14

申请号：US15889410

申请日：2018-02-06

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  H01L21/687 ,  B25J11/00

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.