公开(公告)号：US20210066238A1

公开(公告)日：2021-03-04

申请号：US17001701

申请日：2020-08-25

Applicant: Japan Display Inc.

Inventor： Youhei IWAI ,  Hideaki ABE

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/78 ,  H01L21/304

Abstract: The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.