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    ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240164020A1

    公开(公告)日：2024-05-16

    申请号：US18407700

    申请日：2024-01-09

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K2201/10128

    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.

    LED MODULE
    2.
    发明申请
    LED MODULE 有权

    公开(公告)号：US20220209081A1

    公开(公告)日：2022-06-30

    申请号：US17696927

    申请日：2022-03-17

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kota UOGISHI ,  Kenichi TAKEMASA ,  Daiki ISONO

    IPC: H01L33/60 ,  H01L33/62

    Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

    ELECTRONIC DEVICE
    3.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20220141957A1

    公开(公告)日：2022-05-05

    申请号：US17577435

    申请日：2022-01-18

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE

    IPC: H05K1/11 ,  H05K1/14

    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.

    DISPLAY DEVICE AND WIRING SUBSTRATE
    4.
    发明申请
    DISPLAY DEVICE AND WIRING SUBSTRATE 有权

    公开(公告)号：US20210157192A1

    公开(公告)日：2021-05-27

    申请号：US17142458

    申请日：2021-01-06

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE ,  Yasuhito ARUGA ,  Hiroyuki ONODERA ,  Hiroki KATO ,  Yasushi NAKANO ,  Hitoshi KAWAGUCHI ,  Keisuke ASADA

    IPC: G02F1/1345 ,  H05K3/36 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/18

    Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

    ELECTRONIC DEVICE
    5.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20150098197A1

    公开(公告)日：2015-04-09

    申请号：US14509119

    申请日：2014-10-08

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE ,  Yasushi NAKANO ,  Hitoshi KAWAGUCHI ,  Ryouhei SUZUKI

    IPC: H05K1/02 ,  H05K5/00 ,  H05K1/11

    CPC classification number: H05K1/189 ,  G02F1/1345 ,  G02F1/136286 ,  H01R4/04 ,  H01R12/62 ,  H01R2107/00 ,  H05K1/118 ,  H05K3/323 ,  H05K3/3442 ,  H05K3/361 ,  H05K2201/09663 ,  H05K2201/09918 ,  H05K2201/10136

    Abstract: Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.

    Abstract translation: 端子部分以规则的宽度和规则的间隔排列，并且每个面向任何使能端子，并且通过导电颗粒电连接到使能端子。 除了作为彼此相邻的一对端子部分的一对端子部分之外，引线部分连接到另一个端子部分，并且从重叠区域延伸到引线区域。 连接部分将不与导线部分连接的各个端子部分连接到在重叠区域的区域内连接到引线部分的相邻端子部分。 从一对连接部分延伸出来的一对引线部分之间的间隔大于其它相邻的引线部分之间的间隔。

    ELECTRONIC DEVICE
    6.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20250159809A1

    公开(公告)日：2025-05-15

    申请号：US19026949

    申请日：2025-01-17

    Applicant: Japan Display Inc.

    Inventor： Hideaki ABE

    IPC: H05K1/11 ,  H05K1/14

    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD OF DRIVER IC
    7.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD OF DRIVER IC 有权

    公开(公告)号：US20210066238A1

    公开(公告)日：2021-03-04

    申请号：US17001701

    申请日：2020-08-25

    Applicant: Japan Display Inc.

    Inventor： Youhei IWAI ,  Hideaki ABE

    IPC: H01L23/00 ,  H01L23/31 ,  H01L21/78 ,  H01L21/304

    Abstract: The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.

    DISPLAY DEVICE and ELECTRONIC DEVICE
    10.
    发明公开
    DISPLAY DEVICE and ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230380063A1

    公开(公告)日：2023-11-23

    申请号：US18364543

    申请日：2023-08-03

    Applicant: Japan Display Inc.

    Inventor： Youhei IWAI ,  Hideaki ABE

    IPC: H05K1/14 ,  H05K1/02 ,  H10K59/131 ,  G02F1/1345

    CPC classification number: H05K1/14 ,  H05K1/028 ,  H05K2201/10128 ,  H10K59/131 ,  G02F1/13452

    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

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