Method and apparatus for building three-dimensional MEMS elements
    14.
    发明授权
    Method and apparatus for building three-dimensional MEMS elements 有权
    用于构建三维MEMS元件的方法和装置

    公开(公告)号:US09573802B2

    公开(公告)日:2017-02-21

    申请号:US13397174

    申请日:2012-02-15

    CPC classification number: B81C1/00007 B81B2203/0109 B81C1/0019 Y10T29/49002

    Abstract: The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

    Abstract translation: 本发明一般涉及用于形成三维MEMS的方法和装置。 更具体地说,本公开涉及一种控制微结构装置中的平面外屈曲的方法,以便产生具有1×,5×,10×,100×或500× 膜的厚度或晶片表面之上。 根据所公开的原理形成的示例性装置包括具有在晶片表面上方和下方延伸的微桥的三维加速度计。

    Temperature-gradient cancelation technique and device
    17.
    发明授权
    Temperature-gradient cancelation technique and device 有权
    温度梯度消除技术和装置

    公开(公告)号:US07862229B2

    公开(公告)日:2011-01-04

    申请号:US12229525

    申请日:2008-08-22

    CPC classification number: G01K3/14 G01P15/008

    Abstract: A system, device, and method for minimizing x-axis and/or y-axis offset shift due to internally produced as well as externally produced on chip temperature imbalances. At least one temperature gradient canceling device is disposed on a substrate including a temperature gradient sensitive device having at least one pair of sensors. Voltage signals generated by the temperature gradient canceling devices can be combined with voltage signals generated by each of the pair of sensors to account for the offset.

    Abstract translation: 用于最小化由于内部产生的x轴和/或y轴偏移偏移以及外部产生的片上温度失衡的系统,装置和方法。 至少一个温度梯度消除装置设置在包括具有至少一对传感器的温度梯度敏感装置的基板上。 由温度梯度消除装置产生的电压信号可与由该对传感器中的每一个生成的电压信号组合以考虑偏移。

    Temperature-gradient cancelation technique and device
    18.
    发明申请
    Temperature-gradient cancelation technique and device 有权
    温度梯度消除技术和装置

    公开(公告)号:US20100045362A1

    公开(公告)日:2010-02-25

    申请号:US12229525

    申请日:2008-08-22

    CPC classification number: G01K3/14 G01P15/008

    Abstract: A system, device, and method for minimizing x-axis and/or y-axis offset shift due to internally produced as well as externally produced on chip temperature imbalances. At least one temperature gradient canceling device is disposed on a substrate including a temperature gradient sensitive device having at least one pair of sensors. Voltage signals generated by the temperature gradient canceling devices can be combined with voltage signals generated by each of the pair of sensors to account for the offset.

    Abstract translation: 用于最小化由于内部产生的x轴和/或y轴偏移偏移以及外部产生的片上温度失衡的系统,装置和方法。 至少一个温度梯度消除装置设置在包括具有至少一对传感器的温度梯度敏感装置的基板上。 由温度梯度消除装置产生的电压信号可以与由一对传感器中的每一个生成的电压信号相组合以考虑偏移。

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