公开(公告)号：US12006209B2

公开(公告)日：2024-06-11

申请号：US16980792

申请日：2019-03-14

Applicant: Obsidian Sensors, Inc.

Inventor： John Hong ,  Tallis Chang ,  Edward Chan ,  Bing Wen ,  Yaoling Pan ,  Sean Andrews

IPC: B81B3/00 ,  B81C1/00 ,  G01J5/20

CPC classification number: B81C1/00595 ,  B81B3/0081 ,  B81C1/0069 ,  G01J5/20 ,  B81B2201/0207 ,  B81B2203/019 ,  B81C2201/0105 ,  B81C2201/014

Abstract: A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.

公开(公告)号：US20230384164A1

公开(公告)日：2023-11-30

申请号：US18025940

申请日：2021-08-04

Applicant: MSG Lithoglas GmbH

Inventor： David Bunel ,  Ulli Hansen ,  Simon Maus

IPC: G01J5/20 ,  G01J5/08 ,  G01J5/0875 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01J5/20 ,  G01J5/0879 ,  G01J5/0875 ,  B81B7/0067 ,  B81C1/00317 ,  B81B2201/0207 ,  B81C2203/0109 ,  B81C2203/031

Abstract: A method of forming an infrared detector includes defining an optical window in a cover substrate. Defining the optical window includes forming a multilayer interference filter or a periodic diffraction grating on an upper surface of the optical window and a periodic diffraction grating on the lower surface of the optical window. The method also includes performing anodic bonding of a spacer onto the cover substrate, transferring the cover substrate provided onto a base substrate, and hermetically bonding the spacer onto the base substrate.

公开(公告)号：US20180226309A1

公开(公告)日：2018-08-09

申请号：US15942911

申请日：2018-04-02

Applicant: RAYTHEON COMPANY

Inventor： Roland W. Gooch ,  Buu Q. Diep ,  Adam M. Kennedy ,  Stephen H. Black ,  Thomas A. Kocian

IPC: H01L23/10 ,  H01L21/768 ,  H01L21/52 ,  H01L27/146 ,  H01L23/498 ,  H01L23/26 ,  B81B7/00 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81B7/0038 ,  B81B2201/0207 ,  B81C1/00269 ,  B81C2203/035 ,  H01L21/52 ,  H01L21/76841 ,  H01L23/26 ,  H01L23/49866 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/1469 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.

公开(公告)号：US09966320B2

公开(公告)日：2018-05-08

申请号：US15270145

申请日：2016-09-20

Applicant: RAYTHEON COMPANY

Inventor： Roland W. Gooch ,  Buu Q. Diep ,  Adam M. Kennedy ,  Stephen H. Black ,  Thomas A. Kocian

IPC: H01L23/48 ,  H01L23/02 ,  H01L23/10 ,  H01L23/498 ,  H01L21/768 ,  B81B7/00 ,  H01L23/26 ,  H01L27/146 ,  B81C1/00 ,  H01L21/52

CPC classification number: H01L23/10 ,  B81B7/0038 ,  B81B2201/0207 ,  B81C1/00269 ,  B81C2203/035 ,  H01L21/52 ,  H01L21/76841 ,  H01L23/26 ,  H01L23/49866 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/1469 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.

公开(公告)号：US09796580B2

公开(公告)日：2017-10-24

申请号：US14738745

申请日：2015-06-12

Applicant: InvenSense, Inc.

Inventor： Peter Smeys ,  Martin Lim

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00238 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.

公开(公告)号：US20160149105A1

公开(公告)日：2016-05-26

申请号：US14951554

申请日：2015-11-25

Applicant: Melexis Technologies NV

Inventor： Carl VAN BUGGENHOUT ,  Appolonius Jacobus VAN DER WIEL ,  Luc BUYDENS

IPC: H01L35/28 ,  H01L35/34 ,  H01L27/144 ,  H01L31/09

CPC classification number: H01L35/28 ,  B81B7/02 ,  B81B2201/0207 ,  B81B2203/0315 ,  G01J1/0214 ,  G01J1/0295 ,  G01J1/4228 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/0285 ,  G01J5/045 ,  G01J5/06 ,  G01J5/0803 ,  G01J5/12 ,  G01J2005/068 ,  H01L27/144 ,  H01L27/1443 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/09 ,  H01L35/34

Abstract: A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.

Abstract translation: 一种用于辐射测量的芯片，该芯片包括包括第一传感器和第二传感器的第一基板。 该芯片还包括第二基板，其包括具有倾斜壁的第一腔和第二腔。 内层存在于第二腔的内侧。 第二基板被密封到第一基板上，在内部具有空腔，使得第一腔在第一传感器之上，第二腔位于第二传感器之上。

公开(公告)号：US09162868B2

公开(公告)日：2015-10-20

申请号：US14091492

申请日：2013-11-27

Applicant: Infineon Technologies AG

Inventor： Stefan Kolb ,  Andreas Meiser ,  Till Schloesser ,  Wolfgang Werner

IPC: H01L21/00 ,  B81B3/00 ,  G01P15/125 ,  G01N27/22 ,  G01L9/12 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B3/0086 ,  B81B2201/0207 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C1/0015 ,  G01H1/00 ,  G01H11/06 ,  G01L9/0072 ,  G01L9/12 ,  G01N27/223 ,  G01P15/125

Abstract: A MEMS device includes a fixed electrode and a movable electrode arranged isolated and spaced from the fixed electrode by a distance. The movable electrode is suspended against the fixed electrode by one or more spacers including an insulating material, wherein the movable electrode is laterally affixed to the one or more spacers.

Abstract translation: MEMS器件包括固定电极和可移动​​电极，与固定电极隔离并间隔一定距离。 可移动电极通过一个或多个包括绝缘材料的间隔件悬置在固定电极上，其中可动电极横向地固定到一个或多个间隔件上。

公开(公告)号：US08900906B2

公开(公告)日：2014-12-02

申请号：US13415479

申请日：2012-03-08

Applicant: Gary Yama ,  Fabian Purkl ,  Matthieu Liger ,  Matthias Illing

Inventor： Gary Yama ,  Fabian Purkl ,  Matthieu Liger ,  Matthias Illing

IPC: H01L21/02

CPC classification number: B81C1/00039 ,  B81B3/007 ,  B81B2201/0207 ,  B81B2203/0307 ,  B81C2201/0181 ,  G01J5/023 ,  H01L27/14649 ,  H01L27/14683

Abstract: In one embodiment, a method of forming a semiconductor device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a first trench in the sacrificial layer, forming a first sidewall layer with a thickness of less than about 50 nm on a first sidewall of the first trench using atomic layer deposition (ALD), and removing the sacrificial layer.

Abstract translation: 在一个实施例中，形成半导体器件的方法包括提供衬底，在衬底层上形成牺牲层，在牺牲层中形成第一沟槽，形成厚度小于约50nm的第一侧壁层 使用原子层沉积（ALD）的第一沟槽的第一侧壁，以及去除牺牲层。

公开(公告)号：US08866237B2

公开(公告)日：2014-10-21

申请号：US13405513

申请日：2012-02-27

Applicant: Christopher D. Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

Inventor： Christopher D. Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L29/84 ,  H01L31/02 ,  H01L29/66 ,  H01L21/02

CPC classification number: B81C1/00246 ,  B81B7/0067 ,  B81B2201/0207 ,  B81C1/00269 ,  G01J5/045 ,  G01J5/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24245 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.

Abstract translation: 一种嵌入式微电子机械系统（MEMS）（100），包括嵌入在绝缘板（120）中的半导体芯片（101），所述芯片具有包括辐射传感器MEMS（105）的空腔（102），所述开口 在由芯片感测到的辐射（150）透射的板（110）覆盖的芯片表面处的腔的空腔（104）。 离开空腔的板表面具有裸露的中心区域，以暴露于由空腔内的MEMS感测的辐射，以及由接触板表面的金属膜（111）覆盖的周边区域和覆盖板（112）的层 粘合剂堆叠在金属膜上。

公开(公告)号：US20140264659A1

公开(公告)日：2014-09-18

申请号：US14207443

申请日：2014-03-12

Applicant: BISHNU PRASANNA GOGOI

Inventor： BISHNU PRASANNA GOGOI

IPC: B81B7/02

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。