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    Apparatus for simultaneously closing and opening a group of blinds
    12.
    发明授权
    Apparatus for simultaneously closing and opening a group of blinds 失效
    用于同时关闭和打开一组百叶窗的装置

    公开(公告)号：US4550759A

    公开(公告)日：1985-11-05

    申请号：US495276

    申请日：1983-05-16

    Applicant: John Archer

    Inventor： John Archer

    IPC: E06B9/32 ,  E06B9/26

    CPC classification number: E06B9/32 ,  Y10S160/17

    Abstract: In a group of blinds each blind consists of a number of thin slats suspended from a horizontal shaft. The slats are attached to cords fixed to the shaft and the slats are turnably adjustable by rotating the shaft, which is connected to both a hand-operated mechanism and automatic drive unit. Said automatic drive unit is provided with a torque limiting device. Moreover, a timing device is connected to said drive unit for all blinds in the group for automatic actuation of all said drive units at determined points of time and setting of the slats in all blinds to closed or open position irrespective of their existing position set by said hand-operated mechanism.

    Abstract translation: 在一组百叶窗中，每个盲人包括从水平轴悬挂的许多薄板条。 板条连接到固定到轴的绳索，并且板条通过旋转轴而可转动地调节，所述轴连接到手动机构和自动驱动单元。 所述自动驱动单元设置有转矩限制装置。 此外，定时装置连接到所述驱动单元，用于组中的所有百叶窗，用于在确定的时间点自动致动所有所述驱动单元，并将所有百叶窗中的板条设置为关闭或打开位置，而不管其由现有位置设定的现有位置如何 说手动机构。

    Geophysical data acquisition system and method of acquisition of geophysical data
    13.
    发明授权
    Geophysical data acquisition system and method of acquisition of geophysical data 有权

    公开(公告)号：US12259509B2

    公开(公告)日：2025-03-25

    申请号：US17902939

    申请日：2022-09-05

    Applicant: John Archer

    Inventor： John Archer

    IPC: G01V1/09 ,  G01V1/104 ,  G01V1/13

    Abstract: Disclosed is a geophysical data acquisition system. The system comprises a frame assembly; a set of ground engaging members connected to the frame assembly, and adapted to move the frame assembly along the ground surface; and a carrier assembly carried by the frame assembly, the carrier assembly having one or more seismic source subsystems and a drive mechanism adapted to move each of the one or more seismic source subsystems through a plurality of positions between a lowered position and a raised position and forward and rearward positions with respect to the frame assembly. The movement of each of the one or more seismic source subsystems being in coordination with the movement of the frame assembly, such that each of the one or more seismic source subsystems move to the lowered position when the frame assembly approaches one or more data acquisition points on the ground surface.

    GEOPHYSICAL DATA ACQUISITION SYSTEM AND METHOD OF ACQUISITION OF GEOPHYSICAL DATA
    14.
    发明公开
    GEOPHYSICAL DATA ACQUISITION SYSTEM AND METHOD OF ACQUISITION OF GEOPHYSICAL DATA 审中-公开

    公开(公告)号：US20240077628A1

    公开(公告)日：2024-03-07

    申请号：US17902939

    申请日：2022-09-05

    Applicant: John Archer

    Inventor： John Archer

    IPC: G01V1/09 ,  G01V1/104

    CPC classification number: G01V1/09 ,  G01V1/104 ,  G01V1/13

    Abstract: Disclosed is a geophysical data acquisition system. The system comprises a frame assembly; a set of ground engaging members connected to the frame assembly, and adapted to move the frame assembly along the ground surface; and a carrier assembly carried by the frame assembly, the carrier assembly having one or more seismic source subsystems and a drive mechanism adapted to move each of the one or more seismic source subsystems through a plurality of positions between a lowered position and a raised position and forward and rearward positions with respect to the frame assembly. The movement of each of the one or more seismic source subsystems being in coordination with the movement of the frame assembly, such that each of the one or more seismic source subsystems move to the lowered position when the frame assembly approaches one or more data acquisition points on the ground surface.

    Control of gene expression in eukaryotes
    18.
    发明申请
    Control of gene expression in eukaryotes 审中-公开
    控制真核生物中的基因表达

    公开(公告)号：US20050053959A1

    公开(公告)日：2005-03-10

    申请号：US10732859

    申请日：2003-12-09

    Applicant: Jutta Turck ,  John Archer

    Inventor： Jutta Turck ,  John Archer

    IPC: C12N15/10 ,  C12N15/31 ,  C12N15/63 ,  C12N15/79 ,  C12N15/82 ,  C12Q1/68 ,  C07H21/04 ,  C12N9/10

    CPC classification number: C12N15/63 ,  C12N15/635 ,  C12N15/8217 ,  C12N15/8238

    Abstract: A chemically inducible gene expression system is described. A chimeric gene having a first sequence comprising a promoter and a regulator polypeptide is linked with a second sequence comprising a promoter and a coding or non-coding sequence. Expression of the target gene of the second sequence is controlled by the regulator polypeptide which is acted upon by an inducer. The inducer is a chemical compound, such as OHP, which acts upon the OHP responsive regulator polypeptide, which can be obtained from Rhodococcus sp. V49. Various domain regions and complementary response elements are also described.

    Abstract translation: 描述了化学诱导型基因表达系统。 具有包含启动子和调节多肽的第一序列的嵌合基因与包含启动子和编码或非编码序列的第二序列连接。 第二序列的靶基因的表达由受诱导剂作用的调节多肽控制。 诱导剂是一种化学化合物，例如OHP，其作用于OHP应答调节多肽，其可从红球菌属获得。 V49。 还描述了各种域区域和互补响应元件。

    Solder bumped substrate for a fine pitch flip-chip integrated circuit package
    19.
    发明授权
    Solder bumped substrate for a fine pitch flip-chip integrated circuit package 有权
    焊接衬底用于精细俯仰倒装芯片集成电路封装

    公开(公告)号：US06734570B1

    公开(公告)日：2004-05-11

    申请号：US10350851

    申请日：2003-01-24

    Applicant: John Archer

    Inventor： John Archer

    IPC: H01L2348

    CPC classification number: H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0545 ,  Y02P70/611 ,  H01L2924/00014

    Abstract: A method of fabricating a solder bumped substrate for a flip-chip integrated circuit (IC) package is provided. The method includes the following steps. Providing a substrate material. Patterning a conductive layer on the substrate material that includes a plurality of circuit traces coupled to a plurality of bonding pads, wherein the bonding pads are arranged to correspond to input/output (I/O) pads on the flip-chip IC. Fabricating a solder mask layer over the conductive layer, wherein the solder mask layer defines a pad opening corresponding to each of the bonding pads, and wherein the pad openings defined by the solder mask layer are tapered such that each pad opening includes an expanded end and a tapered end. Printing solder onto a portion of each bonding pad that is exposed by the expanded end of the corresponding pad opening. Reflowing the printed solder to form solder bumps on each bonding pad.

    Abstract translation: 提供一种制造用于倒装芯片集成电路（IC）封装的焊料凸起衬底的方法。 该方法包括以下步骤。 提供衬底材料。 对包括耦合到多个接合焊盘的多个电路迹线的衬底材料上的导电层进行构图，其中所述接合焊盘被布置为对应于所述倒装芯片IC上的输入/输出（I / O）焊盘。 在导电层上制造焊接掩模层，其中焊料掩模层限定对应于每个焊盘的焊盘开口，并且其中由焊料掩模层限定的焊盘开口是锥形的，使得每个焊盘开口包括扩展端和 锥形端。 将焊料印刷到由相应的焊盘开口的扩展端露出的每个焊盘的一部分上。 回填印刷的焊料，以在每个焊盘上形成焊料凸块。

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