公开(公告)号：US20090294988A1

公开(公告)日：2009-12-03

申请号：US12538410

申请日：2009-08-10

Applicant: Kenichi WATANABE ,  Masanobu IKEDA ,  Takahiro KIMURA

Inventor： Kenichi WATANABE ,  Masanobu IKEDA ,  Takahiro KIMURA

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/45 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05546 ,  H01L2224/05647 ,  H01L2224/45124 ,  H01L2224/48747 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/13091 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a pad forming region electrically connecting an element forming region to the outside, in which a low dielectric constant insulating film is formed in association with in the element forming region, a Cu film serving as a via formed in the low dielectric constant insulating film in the pad forming region is disposed in higher density than that of a Cu film serving as a via in the element forming region. Hereby, when an internal stress occurs, the stress is prevented from disproportionately concentrating on the via, and deterioration of a function of a wiring caused thereby can be avoided.

Abstract translation: 在与元件形成区域相关联地形成有低介电常数绝缘膜的元件形成区域与外部电连接的焊盘形成区域中，形成在低介电常数绝缘膜中的通孔的Cu膜 焊盘形成区域以比元件形成区域中的通孔用的Cu膜的密度高的方式设置。 因此，当发生内部应力时，防止应力不成比例地集中在通孔上，并且可以避免由此引起的布线的功能的劣化。

公开(公告)号：US20120248572A1

公开(公告)日：2012-10-04

申请号：US13495001

申请日：2012-06-13

Applicant: Kenichi WATANABE

Inventor： Kenichi WATANABE

IPC: H01L29/02

CPC classification number: H01L23/5223 ,  H01L21/76802 ,  H01L21/76832 ,  H01L21/76834 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A first capacitor recess and a wiring trench are formed through an interlayer insulating film. A lower electrode fills the first capacitor recess, and a first wiring fills the wiring trench. An etching stopper film and a via layer insulating film are disposed over the interlayer insulating film. A first via hole extends through the via layer insulating film and etching stopper film and reaches the first wiring, and a first plug fills the first via hole. A second capacitor recess is formed through the via layer insulating film, the second capacitor recess at least partially overlapping the lower electrode, as viewed in plan. The upper electrode covers the bottom and side surfaces of the second capacitor recess. A capacitor is constituted of the upper electrode, etching stopper film and lower electrode. A second wring connected to the first plug is formed over the via layer insulating film.

公开(公告)号：US20120224233A1

公开(公告)日：2012-09-06

申请号：US13410890

申请日：2012-03-02

Applicant: Kenichi WATANABE

Inventor： Kenichi WATANABE

IPC: H04N1/333

CPC classification number: H04N1/00891 ,  H04N1/32793 ,  H04N2201/0093

Abstract: A facsimile control apparatus includes a main control unit configured so that power supply to the main control unit is shut off while the facsimile control apparatus is in an energy-saving mode; a first switching unit configured to switch the power supply to the main control unit on/off; and a detection circuit configured to output a switch control signal for turning the first switching unit on when detecting an input signal input from a public network.

Abstract translation: 一种传真控制装置，包括：主控制单元，其构造成在所述传真控制装置处于节能模式时关闭所述主控制单元的电力供应; 第一切换单元，被配置为开/关的主控制单元的电源; 以及检测电路，被配置为当检测到从公共网络输入的输入信号时，输出用于使所述第一开关单元接通的开关控制信号。

公开(公告)号：US20100240211A1

公开(公告)日：2010-09-23

申请号：US12764210

申请日：2010-04-21

Applicant: Kenichi WATANABE ,  Michiari KAWANO ,  Hiroshi NAMBA ,  Kazuo SUKEGAWA ,  Takumi HASEGAWA ,  Toyoji SAWADA

Inventor： Kenichi WATANABE ,  Michiari KAWANO ,  Hiroshi NAMBA ,  Kazuo SUKEGAWA ,  Takumi HASEGAWA ,  Toyoji SAWADA

IPC: H01L21/768

CPC classification number: G03F1/26 ,  G03F1/32 ,  H01L21/76811 ,  H01L21/76813 ,  H01L23/562 ,  H01L23/564 ,  H01L23/585 ,  H01L2221/1036 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device including an integrated circuit part in which an integrated circuit is formed and a main wall part including metal films surrounding said integrated circuit part, includes the step of selectively forming a sub-wall part including metal films between the integrated circuit part and the main wall part, in parallel to formation of the integrated circuit part and the main wall part. A sub-wall part which is in an “L” shape is provided between each corner of the main wall part and the integrated circuit part of the resulting semiconductor device.

Abstract translation: 一种制造半导体器件的方法，包括形成有集成电路的集成电路部分和包括围绕所述集成电路部分的金属膜的主壁部分的步骤包括以下步骤：在集成电路部分之间选择性地形成包括金属膜的副壁部分 电路部分和主壁部分，并联形成集成电路部分和主壁部分。 在主壁部的每个角部和所得到的半导体器件的集成电路部分之间设置有“L”形的副壁部。

公开(公告)号：US20090236798A1

公开(公告)日：2009-09-24

申请号：US12478803

申请日：2009-06-05

Applicant: Kuniaki KIMURA ,  Kenichi WATANABE

Inventor： Kuniaki KIMURA ,  Kenichi WATANABE

IPC: B65H31/36

CPC classification number: B65H31/38 ,  B65H2301/4219 ,  B65H2801/06

Abstract: In a sheet processing device in the form of an offset stacker, a sheet fence (103, 104) is provided on a side of sheets (S) to be processed stacked on a stack tray (3) opposite from a jogger (101, 102) so that the sheet fence accurately defines a final offset position of the sheets. Thereby, even when a transient offset position at which the sheets are stacked on the stack tray varies from one sheet to another, the side edges of sheets selected for offset stacking can be lined up without fail owing to the jogging action of the jogger and the supporting action of the sheet fence. A pair of joggers may be arranged on either side of the sheets, along with a pair of corresponding sheets fences on the opposing sides. The jogger and sheet fence on a same side may be supported by a common moveable frame (107, 108) so that the jogging action and sheet fence adjustment can be achieved by a common structure and a common drive unit.

Abstract translation: 在偏移式堆垛机形式的片材处理装置中，片材篱笆（103,104）被设置在堆垛堆叠（3）上与加工器（101,102 ），使得板栅栏精确地限定纸张的最终偏移位置。 因此，即使当堆叠托盘上堆叠片材的瞬时偏移位置从一张片材变化到另一片时，由于顺序器的慢跑动作，可选择用于偏移堆叠的片材的侧边缘不会排列， 支持栏杆的动作。 一对慢跑器可以布置在纸张的两侧，以及在相对侧上的一对相应的纸板栅栏。 同一侧的慢跑者和篱笆可以由共同的可移动框架（107,108）支撑，使得可以通过公共结构和公共驱动单元来实现点动动作和薄板挡板调节。

公开(公告)号：US20080142977A1

公开(公告)日：2008-06-19

申请号：US11868102

申请日：2007-11-14

Applicant: Kenichi WATANABE ,  Tomoji NAKAMURA ,  Satoshi OTSUKA

Inventor： Kenichi WATANABE ,  Tomoji NAKAMURA ,  Satoshi OTSUKA

IPC: H01L23/52

CPC classification number: H01L23/481 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53238 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device has a multilayer interconnection structure, wherein the multilayer interconnection structure comprises at least a first interconnection layer and a second interconnection layer formed over the first interconnection layer, the first interconnection layer comprises a first conductor pattern embedded in a first interlayer insulation film and constituting a part of an interconnection pattern and a second, another interconnection pattern embedded in the first interlayer insulation film, the second interconnection layer comprises a third conductor pattern embedded in a second interlayer insulation film and constituting a part of said interconnection pattern, the third conductor pattern has an extension part in a part thereof so as to extend in a layer identical to the third conductor pattern, the third conductor pattern being electrically connected to the first conductor pattern at a first region of the extension part via a first via plug, the extension part making a contact with the second conductor pattern at a second region further away from, or closer to the third conductor pattern with regard to the first region via a second via-plug of a diameter smaller than the first via-plug, the extension part of the third conductor pattern, the first via-plug and the second via-plug form, together with the second interlayer insulation film, a dual damascene structure.

Abstract translation: 半导体器件具有多层互连结构，其中所述多层互连结构至少包括形成在所述第一互连层上的第一互连层和第二互连层，所述第一互连层包括嵌入在第一层间绝缘膜中的第一导体图案， 构成互连图案的一部分和嵌入第一层间绝缘膜中的第二另一互连图案，第二互连层包括嵌入第二层间绝缘膜中并构成所述互连图案的一部分的第三导体图案，第三导体 图案的一部分具有延伸部分，以便在与第三导体图案相同的层中延伸，第三导体图案经由第一通孔插头在延伸部分的第一区域处电连接到第一导体图案， 扩展部分制作ac 通过直径小于第一通孔插头的第二通孔插头，在相对于第一区域进一步远离或接近第三导体图案的第二区域处与第二导体图案接合，第三导体图案的延伸部分 导体图案，第一通孔塞和第二通孔塞形式与第二层间绝缘膜一起是双镶嵌结构。

公开(公告)号：US20060219455A1

公开(公告)日：2006-10-05

申请号：US11277734

申请日：2006-03-28

Applicant: Kenichi WATANABE ,  Nobuo HARA ,  Atsushi IMAI

Inventor： Kenichi WATANABE ,  Nobuo HARA ,  Atsushi IMAI

IPC: B62K11/00

CPC classification number: F02D11/02 ,  B62K23/02 ,  F02D11/04 ,  F02D11/105 ,  F02D2200/602

Abstract: An operation control device determines the operation of a throttle grip rotation torque element having a throttle grip rotation torque sensor and a throttle grip rotation torque operator, and a pseudo operation degree element for a throttle grip by integration using a throttle grip pseudo opening degree operator. A handle load sensor and a handle load operator detect a handle load. Right and left step load sensors and right and left step load operators detect right and left step loads. A weight shift element operator calculates a weight shift element. A target throttle opening degree is determined based on the operation of these elements, and a throttle valve is rotated by PID control. The operation control device can control a driving force in response to the weight shift of a rider in addition to the operation of the throttle grip.

Abstract translation: 操作控制装置使用节气门手柄假开度算子确定具有节气门夹持旋转扭矩传感器和节气门手柄旋转扭矩算子的节气门夹持旋转扭矩元件的操作，以及用于通过积分的节气门手柄的伪操作度元件。 手柄负载传感器和手柄负载操作器检测手柄负载。 右侧和左侧步进负载传感器以及右侧和左侧步进负载运算符检测右侧和左侧的负载。 重量移动元件操作器计算重量移动元件。 基于这些元件的操作来确定目标节气门开度，并且通过PID控制旋转节流阀。 操作控制装置除了操纵节气门手柄之外，还能够响应于骑手的重量偏移来控制驱动力。

公开(公告)号：US20120324078A1

公开(公告)日：2012-12-20

申请号：US13488485

申请日：2012-06-05

Applicant: Ken SUGIMOTO ,  Junji YAMAMOTO ,  Kenichi WATANABE

Inventor： Ken SUGIMOTO ,  Junji YAMAMOTO ,  Kenichi WATANABE

IPC: G06F15/173

CPC classification number: G06F13/4282 ,  G06F13/4022 ,  G06F2213/0026

Abstract: In a server apparatus in which a plurality of physical servers and an I/O device are connected via an I/O switch, when the plurality of physical servers share one I/O device, a tag included in a request packet transmitted from a first physical server to the I/O device is translated into a value that is not used in the I/O device in the I/O switch and thereafter the request packet is transferred to the I/O device, and then a tag included in a response packet which responds to the request packet and which is transmitted from the I/O device to the first physical server is restored to the original tag, so that conflict of tags when a plurality of physical servers share one I/O device is avoided.

Abstract translation: 在通过I / O交换机连接多个物理服务器和I / O设备的服务器装置中，当多个物理服务器共享一个I / O设备时，包括在从第一 到I / O设备的物理服务器被转换为在I / O交换机中的I / O设备中未使用的值，然后将请求分组传送到I / O设备，然后将包含在I / 响应分组，响应分组，从I / O设备发送到第一物理服务器的响应分组被恢复到原始标签，从而避免了当多个物理服务器共享一个I / O设备时的标签冲突。

公开(公告)号：US20120316026A1

公开(公告)日：2012-12-13

申请号：US13485064

申请日：2012-05-31

Applicant: Kazuo OGURI ,  Kenichi WATANABE ,  Takayoshi URUSHIBATA

Inventor： Kazuo OGURI ,  Kenichi WATANABE ,  Takayoshi URUSHIBATA

IPC: F16H3/56

CPC classification number: F16H3/663 ,  F16H2003/445 ,  F16H2200/0043 ,  F16H2200/2005 ,  F16H2200/2023 ,  F16H2200/2043

Abstract: An automatic transmission includes: a Ravigneaux planetary gear set; first to fifth friction engagement elements; the first friction engagement element, the second friction engagement element, and the fifth friction engagement element being disposed on a front side which is nearer to the driving source than the output member, the third friction engagement element and the fourth friction engagement element being disposed on a rear side which is farther from the driving source than the output member, and a first drum member that includes an inner circumference on which the second friction engagement element is disposed, and an outer circumference on which the fifth friction engagement element is disposed, and that is connected with a front carrier plate located at a front end portion of the common carrier.

Abstract translation: 自动变速器包括：Ravigneaux行星齿轮组; 第一至第五摩擦接合元件; 第一摩擦接合元件，第二摩擦接合元件和第五摩擦接合元件设置在比输出构件更靠近驱动源的前侧上，第三摩擦接合元件和第四摩擦接合元件设置在 与驱动源相比输出构件更远的后侧，以及包括配置有第二摩擦接合元件的内周的第一鼓构件和设置有第五摩擦接合构件的外周，以及 其与位于公共载体的前端部的前承载板连接。

公开(公告)号：US20120252181A1

公开(公告)日：2012-10-04

申请号：US13495000

申请日：2012-06-13

Applicant: Kenichi WATANABE

Inventor： Kenichi WATANABE

IPC: H01L21/02

CPC classification number: H01L23/5223 ,  H01L21/76802 ,  H01L21/76832 ,  H01L21/76834 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A first capacitor recess and a wiring trench are formed through an interlayer insulating film. A lower electrode fills the first capacitor recess, and a first wiring fills the wiring trench. An etching stopper film and a via layer insulating film are disposed over the interlayer insulating film. A first via hole extends through the via layer insulating film and etching stopper film and reaches the first wiring, and a first plug fills the first via hole. A second capacitor recess is formed through the via layer insulating film, the second capacitor recess at least partially overlapping the lower electrode, as viewed in plan. The upper electrode covers the bottom and side surfaces of the second capacitor recess. A capacitor is constituted of the upper electrode, etching stopper film and lower electrode. A second wring connected to the first plug is formed over the via layer insulating film.