公开(公告)号：US20160049944A1

公开(公告)日：2016-02-18

申请号：US14926534

申请日：2015-10-29

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Kazuya YAMADA ,  Toshihisa SONE ,  Akihiro TAKEI ,  Yuichi YOSHIDA ,  Kengo TAKEMASA

IPC: H03L1/02 ,  G01R22/06

CPC classification number: H03L1/026 ,  G01R1/44 ,  G01R21/00 ,  G01R22/061 ,  G01R22/10 ,  G01R35/04 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H03K3/011 ,  H03L1/02 ,  H03L1/027 ,  H03L1/04 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

公开(公告)号：US20250105105A1

公开(公告)日：2025-03-27

申请号：US18895117

申请日：2024-09-24

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Ryo SEKIKAWA ,  Isao KURITA ,  Yuichi YOSHIDA

IPC: H01L23/495 ,  H01L23/31

Abstract: Provided is a semiconductor device that can suppress flash/burrs from forming on a lower surface of a die pad in a configuration in which the lower surface of the die pad is exposed from a sealing resin. The semiconductor device includes a lead frame, a semiconductor chip, and a sealing body. The lead frame includes a plate-shaped die pad and a lead. The die pad has one principal surface with a mounting region for mounting the semiconductor chip. The die pad includes a side portion and a frame-shaped protrusion on the side portion in top view. The protrusion overhangs in a lateral direction in an eave shape along the one principal surface. The semiconductor chip is mounted on the mounting region. The sealing body covers a side surface of the die pad while exposing the other principal surface of the die pad and sealing the semiconductor chip on the one principal surface of the die pad. The sealing body holds the die pad and the lead. The die pad has a through hole penetrating the protrusion in a direction intersecting with the one principal surface.

公开(公告)号：US20190190449A1

公开(公告)日：2019-06-20

申请号：US16277601

申请日：2019-02-15

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Kengo TAKEMASA ,  Yuichi YOSHIDA ,  Toshihisa SONE ,  Kazuya YAMADA ,  Akihiro TAKEI

IPC: H03B5/30 ,  H01L23/31 ,  H01L23/34 ,  H01L23/495 ,  H03L1/02 ,  H01L23/00

CPC classification number: H03B5/30 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49596 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H03L1/022 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

公开(公告)号：US20180006604A1

公开(公告)日：2018-01-04

申请号：US15691986

申请日：2017-08-31

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Kengo TAKEMASA ,  Yuichi YOSHIDA ,  Toshihisa SONE ,  Kazuya YAMADA ,  Akihiro TAKEI

IPC: H03B5/30 ,  H01L23/34 ,  H03L1/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

CPC classification number: H03B5/30 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49596 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H03L1/022 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

公开(公告)号：US20130285640A1

公开(公告)日：2013-10-31

申请号：US13871030

申请日：2013-04-26

Applicant: LAPIS SEMICONDUCTOR CO., LTD.

Inventor： Kazuya YAMADA ,  Toshihisa SONE ,  Akihiro TAKEI ,  Yuichi YOSHIDA ,  Kengo TAKEMASA

IPC: H03L1/02 ,  G01R21/00

CPC classification number: H03L1/026 ,  G01R1/44 ,  G01R21/00 ,  G01R22/061 ,  G01R22/10 ,  G01R35/04 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H03K3/011 ,  H03L1/02 ,  H03L1/027 ,  H03L1/04 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract translation: 半导体器件包括以特定频率振荡的振荡器，集成了检测周围温度的温度传感器的半导体集成电路和电连接到振荡器的控制器，并且校正了振荡频率的温度相关误差 基于由温度传感器检测到的温度的振荡器和一体地密封振荡器和半导体集成电路的密封构件。