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    Light-Emitting Package Structure and Manufacturing Method Thereof
    12.
    发明申请
    Light-Emitting Package Structure and Manufacturing Method Thereof 有权

    公开(公告)号：US20210143133A1

    公开(公告)日：2021-05-13

    申请号：US16699091

    申请日：2019-11-28

    Applicant: Lextar Electronics Corporation

    Inventor： Hung-Chun TONG ,  Fu-Hsin CHEN ,  Wen-Wan TAI ,  Yu-Chun LEE ,  Tzong-Liang TSAI

    IPC: H01L25/075 ,  H01L33/58 ,  H01L33/52

    Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

    Picking Apparatus and the Method Using the Same
    13.
    发明申请
    Picking Apparatus and the Method Using the Same 有权

    公开(公告)号：US20210134625A1

    公开(公告)日：2021-05-06

    申请号：US16693400

    申请日：2019-11-25

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

    IPC: H01L21/67

    Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes an elastic plate, a substrate, a temperature-controlled adhesive layer, at least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The substrate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and configured to adhere the micro elements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. A viscosity of the temperature-controlled adhesive layer varies with a temperature of the temperature-controlled adhesive layer.

    Wavelength Converting Material and Light Emitting Device
    14.
    发明申请
    Wavelength Converting Material and Light Emitting Device 有权

    公开(公告)号：US20210126167A1

    公开(公告)日：2021-04-29

    申请号：US16698978

    申请日：2019-11-28

    Applicant: Lextar Electronics Corporation

    Inventor： Chang-Zhi ZHONG ,  Hung-Chia WANG ,  Hung-Chun TONG ,  Yu-Chun LEE ,  Tzong-Liang TSAI

    IPC: H01L33/50 ,  H01L33/06 ,  H01L31/0216 ,  C09K11/64 ,  C09K11/02 ,  C09K11/77

    Abstract: A wavelength converting material includes a luminous core and a first protective layer. The first protective layer covers the luminous core, and the first protective layer includes aluminum silicate. The aluminum silicate includes a plurality of silicon atoms, each of the silicon atoms is one of a zeroth configuration Q4(0Al), first configuration Q4(1Al), second configuration Q4(2Al), third configuration Q4(3Al), and fourth configuration Q4(4Al). The silicon atoms of the zeroth configuration do not connect with aluminum oxide group, and the silicon atoms of the first, second, third, and fourth configurations respectively connect with one, two, three, and four aluminum oxide group(s). A total number of the silicon atoms of the third configuration and the fourth configuration is larger than a total number of the silicon atoms of the zeroth configuration, the first configuration, and the second configuration.

    DISPLAY DEVICE
    15.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号：US20200126955A1

    公开(公告)日：2020-04-23

    申请号：US16198790

    申请日：2018-11-22

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

    IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60

    Abstract: A display device includes a driving substrate, multiple light-emitting elements, first and second transparent substrates, multiple pixels, and a patterned light-absorbing layer. The light-emitting elements are disposed on the driving substrate and used to emit a light. The first transparent substrate is disposed over the driving substrate and the light-emitting elements and includes at least one groove. The pixels are disposed in the groove and include a first sub-pixel, a second sub-pixel, and a third sub-pixel respectively aligned with one of the light-emitting elements. The second transparent substrate covers the first transparent substrate and the pixels. The patterned light-absorbing layer is disposed on the second transparent substrate and includes multiple first openings respectively aligned with the first, second, and third sub-pixels. The first, second, and third sub-pixels correspond to the light emitted by the light-emitting elements to respectively emit a red light, a green light, and a blue light.

    HEAT SINK FOR ELECTRICAL ELEMENTS AND LIGHT-EMITTING DEVICE CONTAINING THEREOF
    16.
    发明申请
    HEAT SINK FOR ELECTRICAL ELEMENTS AND LIGHT-EMITTING DEVICE CONTAINING THEREOF 有权
    用于电气元件的散热器及其包含的发光装置

    公开(公告)号：US20150077996A1

    公开(公告)日：2015-03-19

    申请号：US14290971

    申请日：2014-05-29

    Applicant: Lextar Electronics Corporation

    Inventor： Li-Cheng YANG ,  Yu-Chun LEE ,  Cheng-Ta KUO

    IPC: F28F3/00 ,  F21K99/00 ,  F21V29/00

    CPC classification number: F21V29/85 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L23/467 ,  H01L33/648 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided.

    Abstract translation: 本公开提供了用于电气元件的散热器和包含其的发光装置。 散热器包括辐射基板和至少一个中空辐射通道。 其中，中空辐射通道水平嵌入辐射基板，并且具有设置在辐射基板的相同位置或相对位置上的两个开口，使得气体可以在中空辐射通道中流动并且去除辐射基板的热量 。 还提供了包含散热器的发光装置。

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