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11.发明授权Compositions for and method of pretreating plastic surfaces to improve adhesion of coating materials 失效用于预涂塑料表面的组合物和方法以改善涂料的粘合性
公开(公告)号：US3607473A
公开(公告)日：1971-09-21
申请号：US3607473D
申请日：1968-03-04
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , HOMROK JOHN P , WILKINSON RALPH R
CPC classification number: C08J7/02
Abstract: Bath compositions and processes are disclosed for use in pretreating the surface of various synthetic molded plastics to improve adhesion to the surface thereof of films of different coating materials, such as paint, ink and adhesives, for example. An aqueous emulsion of an organic surface activating agent, followed by a strong acid aqueous oxidizing solution, are employed in the treatment of the plastic surface to effect the desired surface modification.
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12.发明授权
公开(公告)号：US3592744A
公开(公告)日：1971-07-13
申请号：US3592744D
申请日：1968-12-02
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D , DURSO FRANK L
CPC classification number: C23C18/163 , C23C18/1625 , C23C18/1632 , C23C18/1653 , C23C18/2086 , C25D17/08
Abstract: A METHOD IS DISCLOSED FOR TREATING PLASTIC SHEATHED METAL JIGS OR RACKS CONVENTIONALLY USED IN SUPPORTING AND TRANSPORTING NONCONDUCTIVE ARTICLES THROUGH CHEMICAL AND ELECTROPLATING SOLUTIONS IN THE COURSE OF A CONTINUOUS PLATING CYCLE FOR METALLIZING THE ARTICESS, WHEREBY TO PREVENT OR REDUCE DEPOSIT OF METAL ON THE RACKS THEMSELVES. O THIS END, THE RACKS ARE TREATED TO CAUSE ADSORPTION OF HEXAVALENT CHROMIUM IONS AT THE SURFACE OF THEIR PLASTIC SHEATHED PROTIONS.
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公开(公告)号：US3140203A
公开(公告)日：1964-07-07
申请号：US10481661
申请日：1961-04-24
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J
IPC: C23G1/12
CPC classification number: C23G1/125
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公开(公告)号：US3694250A
公开(公告)日：1972-09-26
申请号：US3694250D
申请日：1969-09-17
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , RHODENIZER HAROLD L , SLOMINSKI LEO J
CPC classification number: H05K3/108 , C23C18/1844 , C23C18/40 , H05K3/062 , H05K3/427 , H05K2201/0347 , H05K2203/0392 , H05K2203/072 , H05K2203/1105
Abstract: COPPER SURFACES ARE PLATED IN A PROCESS COMPRISING ETCHING, ACTIVATING, ELECTROLESS AND/OR ELECTROLYTIC COPPER DEPOSITION, AND HEATING OR BAKING AT A TEMPERATURE OF ABOUT 150* TO ABOUT 450*F. FOR ABOUT 10 MIN. TO ABOUT 2 HOURS OR MORE. SUBSTANTIAL IMPROVEMENT IN THE ADHESION BETWEEN THE COOPER SURFACE AND THE METAL DEPOSITED BY ELECTROLESS AND/OR ELECTROLYTIC PLATING IS ACHIEVED. PROCESSES FOR PLATING ON COPPER-CLAD PLASTIC SUBSTRATES AND FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS ARE ALSO SET FORTH.
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公开(公告)号：US3682786A
公开(公告)日：1972-08-08
申请号：US3682786D
申请日：1970-02-18
Applicant: MACDERMID INC
Inventor： BROWN SHARON D , OTTAVIO EUGENE D D , KUZMIK JOHN J , GRUNWALD JOHN J
CPC classification number: C23C18/26 , C23C18/208 , C23C18/285 , C23C18/30 , H05K3/188 , Y10S205/927 , Y10S205/928
Abstract: PLASTIC SUBSTRATES, SUCH AS POLYPROPYLENE, ABS, ETC. ARE PLATED WITH AN ADHERENT METAL COATING IN A PROCESS WHICH AVOIDS COMPLETELY THE ART-EMPLOYED STEPS OF ETCHING IN A CHROMIC-SULFURIC ACID SOLUTION AS WELL AS THE DEPOSITION OF A THIN COATING OF METAL ON THE SUBSTRATE FROM AN ELECTROLESS PLATING BATH PRIOR TO THE ELECTROLYTIC PLATING OPERATION. PLASTIC SUBSTRATES ARE (1) TREATED WITH A SOLUTION OR DISPERSION OF SULFUR IN A SUITABLE SOLVENT, SUCH AS A TRICHLOROETHYLENE, (2) CONTACTED WITH AN AQUEOUS SOLUTION OF A CUPROUS SALT; SUCH AS CUPROUS CHLORIDE, (3) OPTIONALLY TREATED WITH AN AQUEOUS SOLUTION OF PALLADIUM CHLORIDE AND FINALLY (4) ELECTROPLATED TO FORM A COATING OF THE DESIRED METAL OF THE DESIRED THICKNESS.
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Patent Agency Ranking
公开(公告)号：US3666549A
公开(公告)日：1972-05-30
申请号：US3666549D
申请日：1969-05-09
Applicant: MACDERMID INC
Inventor： RHODENIZER HAROLD L , GRUNWALD JOHN J , INNES WILLIAM P
CPC classification number: H05K3/184 , C23C18/1605 , C23C18/1653 , H05K3/062 , H05K3/108 , H05K3/181 , H05K3/38 , H05K3/381 , H05K2203/0716 , H05K2203/1105 , H05K2203/1152 , H05K2203/1407
Abstract: A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS USING THE ADDITIVE PROCESS. IMPROVEMENT OVER THE PRIOR ART IS OBTAINED IN RESPECT TO ADHESION OF THE CONDUCTOR METAL CIRCUIT TO A THERMOSET RESIN SUBSTRATE. IN THE PROCESS, A NICKEL OF COPPER CLAD THERMOSET RESIN SUBSTRATE IS STRIPPED OF ALL METAL ACTIVATED (CATALYZED), A RESIST PATTERN APPLIED TO OBTAIN THE DESIRED CIRCUIT AND A CONDUCTOR METAL DEPOSITED ON THE CIRCUIT AREA BY ELECTROLESS AND/OR ELECTRODEPOSITION TO A FINAL DESIRED THICKNESS. AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED. VARIOUS TYPES OF CIRCUIT BOARDS RESULTING FROM THE PROCESS ARE ALSO DISCLOSED.
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17.发明授权Method of and solution for accelerating activation of plastic substrates in electroless metal plating system 失效用于加速电镀金属镀层系统中塑料基板的激活的方法和解决方案
公开(公告)号：US3622370A
公开(公告)日：1971-11-23
申请号：US3622370D
申请日：1969-04-07
Applicant: MACDERMID INC
Inventor： OTTAVIO EUGENE D D , GRUNWALD JOHN J
CPC classification number: C23C18/28 , C23C18/1617 , C23C18/26
Abstract: A method is disclosed for accelerating the activation of a polymeric plastic substrate in a chemical plating process incorporating a preliminary chromic acid etch involving immersing the substrate in an acidic dilute palladium chloride solution following activation, and rejuvenating that accelerating solution with periodic additions of stannous ions sufficient to reduce hexavalent chromium contamination carried over from the preliminary chromic acid etch to a prescribed maximum level without incurring substantial precipitation of palladium in the accelerating solution.
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18.发明授权Compositions for the method of selectively dissolving nickel from other metals 失效从其他金属中选择性地分解镍的方法的组合物
公开(公告)号：US3460938A
公开(公告)日：1969-08-12
申请号：US3460938D
申请日：1967-06-30
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , SLOMINSKI LEO J
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19.发明授权
公开(公告)号：US3373114A
公开(公告)日：1968-03-12
申请号：US60657567
申请日：1967-01-03
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J
IPC: C23G1/12
CPC classification number: C23G1/125
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20.发明授权
公开(公告)号：US3242090A
公开(公告)日：1966-03-22
申请号：US35069464
申请日：1964-03-10
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J
IPC: C23F1/44
CPC classification number: C23F1/44
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