公开(公告)号：US3698940A

公开(公告)日：1972-10-17

申请号：US3698940D

申请日：1970-01-26

Applicant: MACDERMID INC

Inventor： MERSEREAU MARK ,  RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  B44D1/18

CPC classification number: C23C18/1653 ,  C23C18/1605 ,  C23C18/2086 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0783 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS BY THE ADDITIVE PROCESS, IN WHICH THE SURFACE OF THE SUBSTRATE IS CONTACTED WITH A PARTICULAR CLASS OF SOLVENTS, PRIOR TO ELECTROLESS DEPOSITION OF THE METAL THEREON,

AND AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED.

公开(公告)号：US3563784A

公开(公告)日：1971-02-16

申请号：US3563784D

申请日：1968-09-09

Applicant: MACDERMID INC

Inventor： INNES WILLIAM P ,  OTTAVIO EUGENE D D ,  BROWN SHARON D

IPC: C23C18/20 ,  C23C18/26 ,  C23C3/00 ,  B44D1/40

CPC classification number: C23C18/30 ,  C23C18/208 ,  C23C18/24 ,  C23C18/26 ,  C23C18/285

Abstract: AQUEOUS DILUTE SURFACTANT SOLUTIONS ARE EMPLOYED IN THE TREATMENT OF PLASTIC SUBSTRATES TO PREPARE THEM FOR ELECTROLESS PLAING TO ENSURE COMPLETE COVERAGE OF THE SUBSTRATE SURFACE BY THE METAL. THE SUBSTRATES ARE IMMERSED IN THE SUFACTANT SOLUTION AS A PRELIMINARY STEP IMMEDIATELY PRECEDING THE ACTIVATION OF THE SUBSTRATE IN THE NORMAL CYCLE OF ELECTROLESS PLATING OPERATIONS, SUPPLANTING VARIOUS OTHER PRE-ACTIVATION STEPS AND, UNLIKE SUCH PRIOR STEPS, BEING OPERATIVE FOR ALL TYPES OF SYNTHETIC RESINS ENCOUNTERED IN ELECTROLESS PLATING OPERATIONS.

公开(公告)号：US3533727A

公开(公告)日：1970-10-13

申请号：US3533727D

申请日：1967-12-08

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: D06P1/92

CPC classification number: D06P1/926 ,  D06P1/928 ,  Y10S8/907 ,  Y10S8/909 ,  Y10S8/938

公开(公告)号：US3666549A

公开(公告)日：1972-05-30

申请号：US3666549D

申请日：1969-05-09

Applicant: MACDERMID INC

Inventor： RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

CPC classification number: H05K3/184 ,  C23C18/1605 ,  C23C18/1653 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2203/0716 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K2203/1407

Abstract: A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS USING THE ADDITIVE PROCESS. IMPROVEMENT OVER THE PRIOR ART IS OBTAINED IN RESPECT TO ADHESION OF THE CONDUCTOR METAL CIRCUIT TO A THERMOSET RESIN SUBSTRATE. IN THE PROCESS, A NICKEL OF COPPER CLAD THERMOSET RESIN SUBSTRATE IS STRIPPED OF ALL METAL ACTIVATED (CATALYZED), A RESIST PATTERN APPLIED TO OBTAIN THE DESIRED CIRCUIT AND A CONDUCTOR METAL DEPOSITED ON THE CIRCUIT AREA BY ELECTROLESS AND/OR ELECTRODEPOSITION TO A FINAL DESIRED THICKNESS. AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED. VARIOUS TYPES OF CIRCUIT BOARDS RESULTING FROM THE PROCESS ARE ALSO DISCLOSED.