公开(公告)号：US20030137045A1

公开(公告)日：2003-07-24

申请号：US10346917

申请日：2003-01-17

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

IPC: H01L023/02

CPC classification number: H05K1/187 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 nullm and not more than 100 nullm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 nullm and not more than 200 nullm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

Abstract translation: 电路部件内置模块包括：由含有无机填料和热固性树脂的混合物制成的第一电绝缘基板; 至少形成在所述第一电绝缘基板的主表面上的多个布线图案; 结合在第一电绝缘基板中并与布线图形电连接的半导体芯片; 以及将所述多个布线图案彼此电连接的内部通孔，所述内部通孔穿过所述第一电绝缘基板。 在电路部件内置模块中，半导体芯片的厚度为30μm以上且100μm以下，具有非接线表面接地，电路部件内置模块的厚度为 范围不小于80μm，不大于200μm。 利用这种配置，提供了以高密度安装电路部件的高性能和紧凑型电路部件内置模块，以便适用于各种类型的电子信息装置。

公开(公告)号：US20030116348A1

公开(公告)日：2003-06-26

申请号：US10314034

申请日：2002-12-05

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Seiichi Nakatani ,  Koichi Hirano ,  Mikinari Shimada ,  Yasuhiro Sugaya

IPC: H05K001/16

CPC classification number: H01G9/26 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/383 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive layer.

Abstract translation: 本发明的电容器安装的金属箔在金属箔上设置有金属箔和多个电容器。 每个电容器包括设置在金属箔上方的导电层和设置在金属箔和导电层之间的电介质层。

公开(公告)号：US20030062624A1

公开(公告)日：2003-04-03

申请号：US10271937

申请日：2002-10-15

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshiyuki Asahi ,  Yasuhiro Sugaya ,  Shingo Komatsu ,  Seiichi Nakatani

IPC: H01L023/48

CPC classification number: H05K1/187 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A component built-in module includes an electric insulation layer, first wiring patterns in a plurality of layers that are laminated with the electric insulation layer being interposed therebetween, at least one first inner via electrically connecting the first wiring patterns in different layers with each other, and at least one electronic component that is embedded in the electric insulation layer and is mounted on any one of the first wiring patterns in the plurality of layers, wherein at least one of the first inner vias is present in a range that overlaps a range in which the electronic component is present in a lamination direction in which the first wiring patterns are laminated, and has a height in the lamination direction that is smaller than a height of the electronic component. Since the first inner via has a small height, the via diameter can be decreased. Therefore, it is possible to provide a component built-in module that has high reliability and is suitable for high-density component mounting.

公开(公告)号：US20040158980A1

公开(公告)日：2004-08-19

申请号：US10779239

申请日：2004-02-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu

IPC: H01K003/10

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10S438/977 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

Abstract translation: 一种组件内置模块，包括由电绝缘材料形成的芯层，以及形成在芯层的至少一个表面上的电绝缘层和多个布线图案。 芯层的电绝缘材料由至少包含无机填料和热固性树脂的混合物形成。 至少一个或多个活性组分和/或无源组分包含在芯层的内部部分中。 芯层具有多个布线图案和由导电树脂形成的多个内部通孔。 由至少包含无机填料和芯层的热固性树脂的混合物形成的电绝缘材料在室温下的弹性模量在0.6GPa至10GPa的范围内。 因此，可以提供能够以高密度填充无机填料的导热部件内置模块; 将诸如半导体等的有源部件和芯片电阻器，片状电容器等无源部件埋入基板的内部; 并简单地制造多层布线结构。

公开(公告)号：US20040145044A1

公开(公告)日：2004-07-29

申请号：US10753933

申请日：2004-01-07

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

IPC: H01L021/48 ,  H01L023/48

CPC classification number: H05K1/187 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 nullm and not more than 100 nullm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 nullm and not more than 200 nullm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

公开(公告)号：US20040084769A1

公开(公告)日：2004-05-06

申请号：US10692938

申请日：2003-10-24

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

IPC: H01L023/48

CPC classification number: H05K3/328 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/326 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/091 ,  H05K2201/10674 ,  H01L2224/97 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05147

Abstract: A semiconductor device (1) of the present invention includes a semiconductor element (103) including electrode parts (104), and a wiring substrate (108) including an insulation layer (101), electrode-part-connection electrodes (102) provided in the insulation layer (101), and external electrodes (107) that is provided in the insulation layer (101) and that is connected electrically with the electrode-part-connection electrodes (102), in which the electrode parts (104) and the electrode-part-connection electrodes (102) are connected electrically with each other. The insulation layer (101) has an elastic modulus measured according to JIS K6911 of not less than 0.1 GP a and not more than 5 GPa, and the electrodes (104) and the electrode-part-connection electrodes (102) are connected by metal joint.

Abstract translation: 本发明的半导体器件（1）包括包括电极部分（104）的半导体元件（103）和包括绝缘层（101）的布线基板（108），电极部分连接电极（102） 绝缘层（101）和设置在绝缘层（101）中并与电极部分连接电极（102）电连接的外部电极（107），其中电极部分（104）和 电极部分连接电极（102）彼此电连接。 绝缘层（101）具有根据JIS K6911测定的弹性模量为0.1GPa以上且5GPa以下，电极（104）和电极部连接用电极（102）通过金属 联合。

公开(公告)号：US20030189246A1

公开(公告)日：2003-10-09

申请号：US10405524

申请日：2003-04-02

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyosi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC: H01L023/10

CPC classification number: H01L23/66 ,  H01L21/481 ,  H01L21/56 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.

Abstract translation: 半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。 在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。 利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

公开(公告)号：US20030141105A1

公开(公告)日：2003-07-31

申请号：US10340170

申请日：2003-01-09

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

IPC: H05K001/03 ,  H05K001/09

CPC classification number: H01L23/295 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/28 ,  H01L25/105 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/185 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiring patterns 102a and 102b formed on one principal surface and another principal surface of the insulating substrate 101, a circuit component 103a electrically connected to the wiring pattern 102a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101, the inner via conductor 104 electrically connecting the wiring pattern 102a and 102b.

Abstract translation: 一种电路元件内置模块，能够高密度地安装电路元件，具有高散热性和高可靠性。 电路部件内置模块100包括由第一混合物105和第二混合物106制成的绝缘基板101，形成在绝缘基板101的一个主表面和另一主表面上的布线图案102a和102b，电路部件103a电 连接到布线图案102a并且在绝缘基板101的内部部分中用第二混合物106密封，内部通孔导体104电连接布线图案102a和102b。

公开(公告)号：US20030102153A1

公开(公告)日：2003-06-05

申请号：US10283386

申请日：2002-10-29

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC: H05K001/03

CPC classification number: H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

Abstract: A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

Abstract translation: 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。