公开(公告)号：US20040226744A1

公开(公告)日：2004-11-18

申请号：US10844823

申请日：2004-05-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Toshiyuki Asahi ,  Yutaka Taguchi ,  Yasuhiro Sugaya ,  Seiichi Nakatani ,  Toshio Fujii

IPC: H05K007/06

CPC classification number: H05K1/186 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/19105 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2224/83

Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

Abstract translation: 具有本发明的内置电路部件的模块包括电绝缘层，设置在电绝缘层的两个主平面上的一对布线层，多个通孔导体，电连接该对布线层并通过 所述电绝缘层的厚度方向以及埋设在所述电绝缘层中的电路部件，其中，所述多个通孔导体按照规定的规则配置在所述电绝缘层的周向部分。 多个通孔导体例如在与绝缘层的主平面平行的方向上在电绝缘层的切割面上形成至少一条直线的间隔。

公开(公告)号：US20040040740A1

公开(公告)日：2004-03-04

申请号：US10654343

申请日：2003-09-03

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC: H05K001/03 ,  H05K001/09

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: At least two electric elements (203) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns (201), and the electric elements (203) are sealed with a thermosetting resin composition (204). An upper surface of the at least two electric elements (203) and an upper surface of the thermosetting resin composition (204) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition (204), it is possible to reduce the thickness without damaging the electric elements (203). Also, the electric elements (203) and the wiring patterns (201) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.

Abstract translation: 至少两个电子元件（203）如半导体芯片或表面声波器件安装在布线图案（201）上，电气元件（203）用热固性树脂组合物（204）密封。 所述至少两个电气元件（203）的上表面和所述热固性树脂组合物（204）的上表面同时被磨损，从而形成彼此基本齐平的表面。 由于它们在用热固性树脂组合物（204）密封的同时被磨损，所以可以减小厚度而不损坏电气元件（203）。 此外，可以防止电气元件（203）和布线图案（201）被研磨液体污染。 以这种方式，可以获得能够在保持其机械强度的同时减小其厚度的电子元件内置模块。

公开(公告)号：US20030127725A1

公开(公告)日：2003-07-10

申请号：US10316699

申请日：2002-12-10

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Satoru Yuhaku ,  Seiichi Nakatani

IPC: H01L023/053

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/81 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/20 ,  H05K3/205 ,  H05K3/281 ,  H05K3/282 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0264 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0665

Abstract: The present invention provides a metal wiring board in which metal wiring buried in a surface layer of an electrically insulating substrate is adhered to a carrier sheet covering the metal wiring that can be mechanically detached and that can prevent oxidation of the metal wiring. A semiconductor device that uses this substrate is structured so that a metal terminal electrode buried in an electrically insulating substrate is electrically connected to a protruding electrode on a semiconductor element, the protruding electrode has a structure wherein its tip is flattened by mounting the semiconductor element to the substrate, and the portion where the substrate and the semiconductor element are connected is reinforced by an insulating resin structure and formed into a single unit therewith. Thus, the present invention provides a metal wiring board that uses low-cost wiring patterns, is low resistance, and is provided with a carrier sheet with which highly reliable bump connection is possible, a semiconductor device, and a method of manufacturing the same.

Abstract translation: 本发明提供了一种金属布线板，其中埋在电绝缘基板的表面层中的金属布线粘附到覆盖可机械分离的金属布线的载体片上，并且可以防止金属布线的氧化。 使用该基板的半导体装置被构造成使得埋在电绝缘基板中的金属端子电极电连接到半导体元件上的突出电极，该突出电极具有通过将半导体元件安装到其顶端而被平坦化的结构 基板和基板和半导体元件连接的部分被绝缘树脂结构增强，并与其形成一个单一的单元。 因此，本发明提供一种使用低成本布线图案，低电阻的金属布线板，并且设置有可靠地具有高可靠性的凸点连接的载体片，半导体器件及其制造方法。

公开(公告)号：US20030141006A1

公开(公告)日：2003-07-31

申请号：US10330159

申请日：2002-12-30

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasuhiro Sugaya ,  Osamu Inoue ,  Junichi Kato

IPC: C03B029/00

CPC classification number: H05K3/4611 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/4857 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/4629 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.

公开(公告)号：US20030090883A1

公开(公告)日：2003-05-15

申请号：US10272599

申请日：2002-10-15

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshiyuki Asahi ,  Yasuhiro Sugaya ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

IPC: H05K001/18

CPC classification number: H01L25/50 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82047 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/29075

Abstract: A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.

Abstract translation: 组件内置模块包括绝缘层，与绝缘层的两个表面一体化的布线，连接布线的通孔以及嵌入在绝缘层内部的一个或多个选自电子部件和半导体的部件。 在该模块中，布线板的表面上形成有布线中的至少一方，嵌入绝缘层内的部件安装在布线基板上并与嵌入板一体化。 这种构造允许诸如半导体的部件在嵌入之前进行安装检查和性能检查。 结果，可以提高模块的产量。 此外，由于部件与布线板集成并嵌入，因此可以提高其强度。

公开(公告)号：US20020135058A1

公开(公告)日：2002-09-26

申请号：US10038212

申请日：2002-01-03

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshiyuki Asahi ,  Yasuhiro Sugaya ,  Shingo Komatsu ,  Seiichi Nakatani

IPC: H01L023/22

CPC classification number: H05K1/187 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A component built-in module includes an electric insulation layer, first wiring patterns in a plurality of layers that are laminated with the electric insulation layer being interposed therebetween, at least one first inner via electrically connecting the first wiring patterns in different layers with each other, and at least one electronic component that is embedded in the electric insulation layer and is mounted on any one of the first wiring patterns in the plurality of layers, wherein at least one of the first inner vias is present in a range that overlaps a range in which the electronic component is present in a lamination direction in which the first wiring patterns are laminated, and has a height in the lamination direction that is smaller than a height of the electronic component. Since the first inner via has a small height, the via diameter can be decreased. Therefore, it is possible to provide a component built-in module that has high reliability and is suitable for high-density component mounting.

Abstract translation: 组件内置模块包括电绝缘层，层间隔着电绝缘层的多个层中的第一布线图案，至少一个第一内通孔，将第一布线图案彼此不同地电连接 以及至少一个电子部件，其嵌入在所述电绝缘层中并且安装在所述多个层中的所述第一布线图案中的任一个上，其中，所述第一内部通孔中的至少一个存在于与所述多个层重叠的范围内 其中电子部件以层叠方式存在，其中第一布线图案被层叠，并且具有比电子部件的高度小的层叠方向的高度。 由于第一内部通孔具有小的高度，所以通孔直径可以减小。 因此，可以提供具有高可靠性并适用于高密度部件安装的部件内置模块。

公开(公告)号：US20040194999A1

公开(公告)日：2004-10-07

申请号：US10816485

申请日：2004-04-01

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yoshihiro Tomita ,  Tadashi Nakamura ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Kazuyoshi Honda ,  Sadayuki Okazaki

IPC: H05K001/11 ,  H05K007/06

CPC classification number: H05K3/4007 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/117 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4069 ,  H05K3/467 ,  H05K2201/0367 ,  H05K2201/0919 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0733 ,  H01L2224/0401

Abstract: A wiring board that allows the high-density connection with a plurality of circuit boards within a limited area, a manufacturing method for the same and electronic equipment using the same are provided. A wiring board includes: a plurality of conductive layers each including one or more wirings for transmitting signals; and a plurality of insulation layers for insulating the respective conductive layers. The conductive layers and the insulation layers are laminated alternately, and each of the plurality of conductive layers is provided with a terminal at at least one of both ends. The terminals are formed stepwise and separated by the insulation layers in a cross-sectional shape of a lamination structure of the conductive layers and the insulation layers.

Abstract translation: 提供了允许在有限区域内与多个电路板进行高密度连接的布线板，其制造方法以及使用该布线板的电子设备。 布线板包括：多个导电层，每个导电层包括用于传输信号的一个或多个布线; 以及用于绝缘各导电层的多个绝缘层。 导电层和绝缘层交替层叠，并且多个导电层中的每一个在两端中的至少一个处设置有端子。 端子形成为阶梯状，并以导电层和绝缘层的叠层结构的横截面形状由绝缘层隔开。

公开(公告)号：US20020117743A1

公开(公告)日：2002-08-29

申请号：US10033322

申请日：2001-12-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu

IPC: H01L023/22

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10S438/977 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

Abstract translation: 一种组件内置模块，包括由电绝缘材料形成的芯层，以及形成在芯层的至少一个表面上的电绝缘层和多个布线图案。 芯层的电绝缘材料由至少包含无机填料和热固性树脂的混合物形成。 至少一个或多个活性组分和/或无源组分包含在芯层的内部部分中。 芯层具有多个布线图案和由导电树脂形成的多个内部通孔。 由至少包含无机填料和芯层的热固性树脂的混合物形成的电绝缘材料在室温下的弹性模量在0.6GPa至10GPa的范围内。 因此，可以提供能够以高密度填充无机填料的导热部件内置模块; 将诸如半导体等的有源部件和芯片电阻器，片状电容器等无源部件埋入基板的内部; 并简单地制造多层布线结构。

公开(公告)号：US20040191491A1

公开(公告)日：2004-09-30

申请号：US10804612

申请日：2004-03-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yasuhiro Sugaya ,  Hiroyuki Ishitomi ,  Seiichi Nakatani

IPC: B32B015/08 ,  B32B009/04

CPC classification number: H05K3/382 ,  H05K3/06 ,  H05K3/20 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/1461 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2843 ,  Y10T428/31681

Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60null C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 nullm or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.

Abstract translation: 本发明的转印片包括玻璃化转变温度不低于60℃的树脂膜，形成在树脂膜上的硅树脂层和形成在硅树脂层上的金属布线图案。 金属布线图案具有形成粗糙面的露出面，粗糙面的平均表面粗糙度（Rz）为2μm以上，而与硅树脂接触的布线图案的面 树脂层的表面粗糙度（Rz）低于露出面。 因此，本发明提供一种转印片材，其具有能够在低温下进行转印，改善的尺寸稳定性和通孔连接可靠性的转印性能。 本发明还提供一种使用转印片的布线板及其制造方法。

公开(公告)号：US20040001661A1

公开(公告)日：2004-01-01

申请号：US10609494

申请日：2003-06-20

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC: G02B006/12

CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K1/185

Abstract: A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.

Abstract translation: 其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。 利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。