Micro channel structure
    11.
    发明授权

    公开(公告)号:US11478794B2

    公开(公告)日:2022-10-25

    申请号:US16660890

    申请日:2019-10-23

    Abstract: A micro channel structure includes a substrate, a supporting layer, a valve layer, a second insulation layer, a vibration layer and a bonding-pad layer. A flow channel is formed on the substrate. A conductive part and a movable part are formed on the supporting layer and the valve layer, respectively. A first chamber is formed at the interior of a base part and communicates to the hollow aperture. A supporting part is formed on the second insulation layer. A second chamber is formed at the interior of the supporting layer and communicates to the first chamber through the hollow aperture. A suspension part is formed on the vibration layer. By providing driving power sources having different phases to the bonding-pad layer, the suspension part moves upwardly and downwardly, and a relative displacement is generated between the movable part and the conductive part, to achieve fluid transportation.

    NARROW TYPE INKJET PRINT HEAD CHIP
    13.
    发明申请

    公开(公告)号:US20210291523A1

    公开(公告)日:2021-09-23

    申请号:US17206816

    申请日:2021-03-19

    Abstract: A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.

    MICRO FLUID ACTUATOR
    15.
    发明申请

    公开(公告)号:US20200166155A1

    公开(公告)日:2020-05-28

    申请号:US16661060

    申请日:2019-10-23

    Abstract: A micro fluid actuator includes an orifice layer, a flow channel layer, a substrate, a chamber layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer and an upper electrode layer, which are stacked sequentially. An outflow aperture, a plurality of first inflow apertures and a second inflow aperture are formed in the substrate by an etching process. A storage chamber is formed in the chamber layer by the etching process. An outflow opening and an inflow opening are formed in the orifice layer by the etching process. An outflow channel, an inflow channel and a plurality of columnar structures are formed in the flow channel layer by a lithography process. By providing driving power which have different phases to the upper electrode layer and the lower electrode layer, the vibration layer is driven to displace in a reciprocating manner, so as to achieve fluid transportation.

    Micro-electromechanical system pump

    公开(公告)号:US11536260B2

    公开(公告)日:2022-12-27

    申请号:US16570352

    申请日:2019-09-13

    Abstract: A MEMS pump includes a first substrate, a first oxide layer, a second substrate, a second oxide layer, a third substrate and a piezoelectric element sequentially stacked to form the entire structure of the MEMS pump. The first substrate has a first thickness and at least one inlet aperture. The first oxide layer has at least one fluid inlet channel and a convergence chamber, wherein the fluid inlet channel communicates with the convergence chamber and the inlet aperture. The second substrate has a second thickness and a through hole, and the through hole is misaligned with the inlet aperture and communicates with the convergence chamber. The second oxide layer has a first chamber with a concave central portion. The third substrate has a third thickness and a plurality of gas flow channels, wherein the gas flow channels are misaligned with the through hole.

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