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公开(公告)号：US20230161082A1
公开(公告)日：2023-05-25
申请号：US18074882
申请日：2022-12-05
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Chunmei LIU , Feifan CHEN , Zhenyu CHEN
CPC classification number: G02B3/00 , G02B13/004 , H04N23/55 , H04N23/54 , G02B2003/0093
Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
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公开(公告)号：US20220345602A9
公开(公告)日：2022-10-27
申请号：US16919065
申请日：2020-07-01
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC: H04N5/225 , H01L27/146 , H04N13/239
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US20220268968A1
公开(公告)日：2022-08-25
申请号：US17740887
申请日：2022-05-10
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20220224808A1
公开(公告)日：2022-07-14
申请号：US16497433
申请日：2018-03-22
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Shoujie WANG , Nan GUO , Liang DING , Bojie ZHAO , Feifan CHEN , Chunmei LIU , Qimin MEI
Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.
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15.发明申请公开(公告)号：US20210185804A1
公开(公告)日：2021-06-17
申请号：US17182353
申请日：2021-02-23
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhen HUANG , Junjie ZENG , Chenxiang XU , Feifan CHEN
IPC: H05K1/02 , G03B30/00 , G01S17/894 , H04N5/225
Abstract: The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.
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Patent Agency Ranking
公开(公告)号：US20190058815A1
公开(公告)日：2019-02-21
申请号：US16136213
申请日：2018-09-19
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Baozhong ZHANG , Mingzhu WANG , Nan GUO , Zhen HUANG , Feifan CHEN
IPC: H04N5/225 , H01L27/146
Abstract: A camera module includes an optical lens, a plurality of different camera components, and a plurality of connection elements pre-formed on at least one of the camera components for electrical connection. Each of the connection elements includes a first connection element formed on a surface of the camera component and a first conduction element electrically formed on the first connection element and protruded from the first connection element in order to electrically connect with other camera components.
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17.发明申请公开(公告)号：US20170271390A1
公开(公告)日：2017-09-21
申请号：US15494413
申请日：2017-04-21
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG , Nan GUO , Zhenyu CHEN , Zhewen MEI
IPC: H01L27/146
CPC classification number: H01L27/14618 , H01L27/1462 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/1469 , H04N5/2251 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H04N13/239 , H04N2213/001
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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18.发明申请公开(公告)号：US20170264804A1
公开(公告)日：2017-09-14
申请号：US15473609
申请日：2017-03-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
IPC: H04N5/225
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20170264803A1
公开(公告)日：2017-09-14
申请号：US15473607
申请日：2017-03-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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20.发明申请公开(公告)号：US20170264800A1
公开(公告)日：2017-09-14
申请号：US15461413
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2257 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H04N13/239 , H04N2213/001
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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