公开(公告)号：US20230317747A1

公开(公告)日：2023-10-05

申请号：US18207357

申请日：2023-06-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Jingfei HE ,  Zhen HUANG ,  Zhongyu LUAN ,  Feifan CHEN

IPC: H01L27/146 ,  H04M1/02 ,  H05K1/18 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H04M1/0264 ,  H05K1/181 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57 ,  H05K2201/10121

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

公开(公告)号：US20230083133A1

公开(公告)日：2023-03-16

申请号：US17986436

申请日：2022-11-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Bojie ZHAO ,  Takehiko TANAKA ,  Feifan CHEN ,  Ye WU

IPC: H04N5/225 ,  G01N15/06 ,  G03B17/02 ,  H04M1/02

Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

公开(公告)号：US20220342174A9

公开(公告)日：2022-10-27

申请号：US16926786

申请日：2020-07-13

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Liang DING ,  Chunmei LIU ,  Feifan CHEN ,  Nan GUO

IPC: G02B7/00 ,  H04N5/225 ,  H01L27/146 ,  G02B7/02 ,  G02B27/62

Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

公开(公告)号：US20220304148A9

公开(公告)日：2022-09-22

申请号：US17323079

申请日：2021-05-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Feifan CHEN ,  Bojie ZHAO ,  Bo PENG ,  Zhen HUANG

IPC: H05K1/02 ,  H05K3/00 ,  G02B7/09 ,  H04N5/225 ,  H05K3/32 ,  H05K3/46

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

公开(公告)号：US20210392251A1

公开(公告)日：2021-12-16

申请号：US15999858

申请日：2016-07-28

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Nan GUO ,  Zhenyu CHEN ,  Zhen HUANG ,  Feifan CHEN ,  Liang DING

IPC: H04N5/225

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

公开(公告)号：US20210250474A1

公开(公告)日：2021-08-12

申请号：US17242211

申请日：2021-04-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Feifan CHEN ,  Liang DING ,  Nan GUO ,  Ye WU ,  Heng JIANG

IPC: H04N5/225 ,  H01L27/146

Abstract: A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

公开(公告)号：US20210195076A1

公开(公告)日：2021-06-24

申请号：US17273079

申请日：2019-08-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Feifan CHEN ,  Hangang WEI ,  Beibei DAI ,  Xiaofeng WANG ,  Qinwen YU

IPC: H04N5/225 ,  G01S17/894

Abstract: The present invention provides a TOF camera module and electronic device and an assembly method, wherein the TOF camera module includes a floodlight module, a receiving module and a plurality of electronic components, and a part of the electronic components is conductively connected to the floodlight module, a part of the electronic components is conductively connected to the receiving module, and the receiving module provides a first circuit board and at least one of the plurality of electronic components is located on a back side of the first circuit board of the receiving module.

公开(公告)号：US20190361191A1

公开(公告)日：2019-11-28

申请号：US16427369

申请日：2019-05-31

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Heng JIANG ,  Feifan CHEN ,  Chunmei LIU ,  Bojie ZHAO ,  Nan GUO ,  Liang DING

IPC: G02B7/00 ,  G02B7/02 ,  H04N5/225 ,  H04N17/00

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

公开(公告)号：US20180246290A1

公开(公告)日：2018-08-30

申请号：US15964896

申请日：2018-04-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Chunmei LIU ,  Hailong LIAO ,  Yiqi WANG ,  Liang DING ,  Nan GUO ,  Heng JIANG ,  Feifan CHEN ,  Bojie ZHAO

IPC: G02B7/00 ,  H04N5/225 ,  G02B7/02 ,  H04N17/00

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

公开(公告)号：US20170244878A1

公开(公告)日：2017-08-24

申请号：US15460216

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Nan GUO ,  Zhen HUANG ,  Duanliang CHENG ,  Liang DING ,  Feifan CHEN ,  Heng JIANG

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/02 ,  G02B7/02 ,  G02B7/00

CPC classification number: H04N5/2257 ,  G02B7/021 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0274 ,  H05K2201/10121

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.