公开(公告)号：US12081849B2

公开(公告)日：2024-09-03

申请号：US17635121

申请日：2020-07-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD

Inventor： Zhongyu Luan ,  Zhen Huang ,  Li Liu ,  Hongfeng Gan ,  Tinghua Li ,  Xinxiang Sun

IPC: H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/18 ,  H05K3/30

CPC classification number: H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10151 ,  H05K2203/1316

Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

公开(公告)号：US11906879B2

公开(公告)日：2024-02-20

申请号：US17603183

申请日：2020-03-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen Huang ,  Zhongyu Luan ,  Zongchun Yang ,  Fengsheng Xi ,  Chenxiang Xu

IPC: G03B17/02 ,  B29D11/00 ,  G03B13/34 ,  H04N23/54

CPC classification number: G03B17/02 ,  B29D11/00807 ,  G03B13/34 ,  H04N23/54

Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.

公开(公告)号：US11871100B2

公开(公告)日：2024-01-09

申请号：US17600735

申请日：2020-03-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen Huang ,  Zhongyu Luan ,  Zongchun Yang ,  Lifeng Kan ,  Chenxiang Xu

IPC: H04N23/55 ,  G03B1/00 ,  G02B7/02 ,  G03B11/00

CPC classification number: H04N23/55 ,  G03B11/00 ,  G02B7/021

Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.

公开(公告)号：US11627239B2

公开(公告)日：2023-04-11

申请号：US17540642

申请日：2021-12-02

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Zhenyu Chen ,  Takehiko Tanaka ,  Zhongyu Luan ,  Bojie Zhao ,  Zhen Huang ,  Nan Guo ,  Fengsheng Xi ,  Heng Jiang ,  Zilong Deng

IPC: H04N5/225

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

公开(公告)号：US11289521B2

公开(公告)日：2022-03-29

申请号：US16088435

申请日：2016-10-25

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Zhenyu Chen ,  Nan Guo ,  Bojie Zhao ,  Takehiko Tanaka ,  Zhen Huang ,  Zhongyu Luan ,  Heng Jiang

IPC: H01L27/146 ,  H04N5/225 ,  H01L23/00

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

公开(公告)号：US10175447B2

公开(公告)日：2019-01-08

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: G02B7/02 ,  H01L21/56 ,  H01L25/065 ,  G02B5/20 ,  G02B3/00 ,  G02B7/00 ,  H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  B29C45/14 ,  H01L27/146 ,  H04M1/02 ,  B29L31/34

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US09826132B2

公开(公告)日：2017-11-21

申请号：US15473607

申请日：2017-03-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B7/02 ,  H05K1/02 ,  H04M1/02 ,  G02B3/00 ,  G02B7/00 ,  G02B5/20 ,  H01L27/146

CPC classification number: H04N5/2257 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B7/021 ,  H01L27/14625 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US12119361B2

公开(公告)日：2024-10-15

申请号：US18207357

申请日：2023-06-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Zhenyu Chen ,  Takehiko Tanaka ,  Jingfei He ,  Zhen Huang ,  Zhongyu Luan ,  Feifan Chen

IPC: H01L27/146 ,  H04M1/02 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57 ,  H05K1/18

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H04M1/0264 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57 ,  H05K1/181 ,  H05K2201/10121

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

公开(公告)号：US12021097B2

公开(公告)日：2024-06-25

申请号：US17847569

申请日：2022-06-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Zhongyu Luan ,  Zhenyu Chen ,  Zhen Huang

IPC: H01L23/10 ,  H01L27/146 ,  H04N23/55 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L27/14621 ,  H01L27/14698 ,  H04N23/55 ,  H05K1/0274 ,  H05K1/118 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/16195

Abstract: A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

公开(公告)号：US11721709B2

公开(公告)日：2023-08-08

申请号：US17550733

申请日：2021-12-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Zhenyu Chen ,  Takehiko Tanaka ,  Jingfei He ,  Zhen Huang ,  Zhongyu Luan ,  Feifan Chen

IPC: H01L27/146 ,  H04M1/02 ,  H05K1/18 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H04M1/0264 ,  H04N23/51 ,  H04N23/54 ,  H04N23/57 ,  H05K1/181 ,  H05K2201/10121

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.