公开(公告)号：US20230137656A1

公开(公告)日：2023-05-04

申请号：US17973180

申请日：2022-10-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/18 ,  H05K1/05 ,  H05K3/32 ,  H05K1/09

Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

公开(公告)号：US20240397609A1

公开(公告)日：2024-11-28

申请号：US18658450

申请日：2024-05-08

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki TANAKA ,  Hayato TAKAKURA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K3/18

Abstract: A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.

公开(公告)号：US20230389179A1

公开(公告)日：2023-11-30

申请号：US18323131

申请日：2023-05-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kazutoshi KINOSHITA ,  Hayato TAKAKURA ,  Ryosuke SASAOKA

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00

CPC classification number: H05K1/14 ,  H05K1/0306 ,  H05K1/05 ,  H05K3/0044 ,  H05K2203/0228

Abstract: Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.

公开(公告)号：US20230380058A1

公开(公告)日：2023-11-23

申请号：US18315878

申请日：2023-05-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hideki MATSUI ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H05K1/117

Abstract: Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.

公开(公告)号：US20210204402A1

公开(公告)日：2021-07-01

申请号：US17058513

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Takuya TANIUCHI ,  Naoki SHIBATA ,  Ryosuke SASAOKA ,  Yasunari OYABU

IPC: H05K1/02 ,  H05K3/06

Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.